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25

MOTOR (LD) board

SW board

SENSOR board

BD49 board

MOTOR (TB) board

DRIVER board

VCD CONNECT board

SUB TRANS board

AMP board

VIDEO OUT board

MIC board

PANEL board

6 STREAM LED board

H/P JACK board

MAIN board

TRANS board

REM board

VMP43GY board

26

• X

: parts extracted from the component side.

• Y

: parts extracted from the conductor side.

•

: Pattern from the side which enables seeing.

(The other layer’s patterns are not indicated.)

Caution:
Pattern face side:

Parts on the pattern face side seen from

(Conductor Side)

the pattern face are indicated.

Parts face side:

Parts on the parts face side seen from

(Component Side)

the parts face are indicated.

C

B

These are omitted.

E

Q

B

These are omitted.

C

E

Q

B

These are omitted.

C

E

Q

Note on Schematic Diagram:
• All capacitors are in 

µ

F unless otherwise noted. (p: pF)

50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in 

Ω

 and 

1

/

4

 

W or less unless otherwise

specified.

•

2

: nonflammable resistor.

•

C

: panel designation.

•

Indication of transistor.

•

A

: B+ Line.

•

B

: B– Line.

• Voltage and waveforms are dc with respect to ground

under no-signal (detuned) conditions.
– BD49 Board –
no mark : CD PLAY
– VMP43GY Board –
no mark : VIDEO CD PLAY

∗

: Impossible to measure

– Other Sections –
no mark : FM
(

) : CD PLAY

∗

: Impossible to measure

• Voltages are taken with a VOM (Input impedance 10 M

Ω

).

Voltage variations may be noted due to normal produc-
tion tolerances.

• Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc-
tion tolerances.

• Circled numbers refer to waveforms.

• Signal path.

F

: AUDIO

J

: CD PLAY (AUDIO)

E

: TAPE PLAY (DECK-A)

d

: TAPE PLAY (DECK-B)

G

: REC

f

: AUX

L

: CD PLAY (VIDEO)

• Abbreviation

EA

: Saudi Arabia model

TH

: Thai model

Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 

°C.

Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.

Note: The components identified by mark 

0

 or dotted line

with mark 

0

 are critical for safety.

Replace only with part number specified.

27

27

HCD-RV22/RV55

1 V/DIV, 200 ns/DIV

ea

1 V/DIV, 10 

µ

s/DIV

es

1 V/DIV, 20 ns/DIV

ed

59.5 ns

3.4 Vp-p

474 ns

3.3 Vp-p

IC601 on the panel board has two types of IC models: LC876964C-52S7-E and LC876A64C-55E0-E.
The service part is the model LC876A64C-55E0-E only.
Check the model number printed on the IC when replacing IC601.
If LC876964C-52S7-E is printed on the IC, remove the resistor R789.

IC601

R789

LC876964C

47k

LC876A64C

NO MOUNT

LC876964C
LC876A64C

22.7 

µ

s

2.7 Vp-p

28

28

HCD-RV22/RV55

Ref. No.

Location

D101

H-12

IC103

G-10

IC150

D-9

Q101

F-5

Q102

F-11