Sony HCD-RG88 Service Manual ▷ View online
SERVICE MANUAL
Model Name Using Similar Mechanism
HCD-RG77
CD
CD Mechanism Type
CDM58E-30BD60C (Singapore)
Section
CDM58ES-30BD60C (Except Singapore)
Base Unit Name
BU-30BD60C
TAPE
Optical Pick-up Name
A-MAX.3
Section
Model Name Using Similar Mechanism
HCD-RG77
Tape Transport Mechanism Type
TCM-230AWR41CS
COMPACT DISC DECK RECEIVER
E Model
HCD-RG88
Ver 1.1 2002.06
9-873-655-02
Sony Corporation
2002F0500-1
Home Audio Company
C
2002.06
Published by Sony Engineering Corporation
SPECIFICATIONS
HCD-RG88 is the amplifier, CD player,
tape deck and tuner section in MHC-
RG88.
tape deck and tuner section in MHC-
RG88.
– Continued on next page –
Amplifier section
The following are measured at AC 120, 220, 240V
50/60 Hz
DIN power output (rated) 160 + 160 watts
50/60 Hz
DIN power output (rated) 160 + 160 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
210 + 210 watts
(6 ohms at 1 kHz,
10% THD)
10% THD)
Inputs
GAME (VIDEO):
GAME (VIDEO):
1 Vp-p, 75 ohms
(phono jack)
GAME (AUDIO):
GAME (AUDIO):
Voltage 250 mV,
(phono jacks)
impedance
47 kilohms
MD/VIDEO (AUDIO) IN: voltage 450 mV/250 mV,
(phono jacks)
(phono jacks)
impedance 47 kilohms
MIC:
sensitivity 1 mV,
(phone jack)
impedance 10 kilohms
Outputs
VIDEO OUT:
VIDEO OUT:
max. output level 1 Vp-p,
(phono jacks)
unbalanced, Sync.
negative load impedance
75 ohms
negative load impedance
75 ohms
PHONES:
accepts headphones of
(stereo mini jack)
8 ohms or more
FRONT SPEAKER:
accepts impedance of 6 to
16 ohms
SURROUND SPEAKER: accepts impedance of
24 ohms or more
SUBWOOFER
accept impedance of
8 ohms or more
8 ohms or more
CD player section
System
Compact disc and digital
audio system
audio system
Laser
Semiconductor laser
(
λ=795nm)
Laser Output
Max. 44.6
µW*
*This output is the value
measured at a distance of
200 mm from the
objective lens surface on
the Optical Pick-up Block
with 7 mm aperture.
measured at a distance of
200 mm from the
objective lens surface on
the Optical Pick-up Block
with 7 mm aperture.
Frequency response
2 Hz – 20 kHz (
±0.5 dB)
Wave length
795 nm
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wave length
(Square optical connector jack, rear panel)
Wave length
660 nm
Output Level
–18 dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (
±3 dB),
using Sony TYPE I
cassette
cassette
HCD-RG88
2
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Latin American models:
Latin American models:
530 – 1,710 kHz
(with the interval set at 10
kHz)
531 – 1,710 kHz
(with the interval set at 9
kHz)
(with the interval set at 10
kHz)
531 – 1,710 kHz
(with the interval set at 9
kHz)
Middle Eastern models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
(with the interval set at 9
kHz)
Other models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
530 – 1,710 kHz
(with the interval set at 10
kHz)
kHz)
530 – 1,710 kHz
(with the interval set at 10
kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
Mexican models:
Mexican models:
120 V AC, 60 Hz
220 V AC, 50/60 Hz
Other models:
120 V, 220 V or 230 - 240
V AC, 50/60 Hz
Adjustable with voltage
selector
Adjustable with voltage
selector
Power consumption
300 watts
Dimensions (w/h/d)
Approx. 280 x 360 x 445 mm
Mass :
Approx. 13.1 kg
Design and specifications are subject to change
without notice.
without notice.
Argentina models:
Tuner section
FM stereo, FM/AM superheterodyne tuner
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
The following caution label is located inside the unit.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
HCD-RG88
3
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
5
Setting the Clock .............................................................
6
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
7
3-2. Top Case ..........................................................................
8
3-3. Loading Panel ..................................................................
8
3-4. CD Mechanism Deck ......................................................
9
3-5. Front Panel Section .........................................................
9
3-6. Back Panel Section .......................................................... 10
3-7. MAIN Board ................................................................... 10
3-8. Base Unit (BU-30BD60C) .............................................. 11
3-9. DRIVER Board, MOTOR Board
3-7. MAIN Board ................................................................... 10
3-8. Base Unit (BU-30BD60C) .............................................. 11
3-9. DRIVER Board, MOTOR Board
and SENSOR (CD) Board .............................................. 11
3-10. Tape Mechanism Deck (TCM-230AWR41CS) .............. 12
3-11. Belt .................................................................................. 12
3-12. SW board HEAD (A) Board
3-11. Belt .................................................................................. 12
3-12. SW board HEAD (A) Board
and HEAD (B) Board ...................................................... 13
4.
TEST MODE
.............................................................. 14
5.
MECHANICAL ADJUSTMENTS
....................... 18
6.
ELECTRICAL ADJUSTMENTS
Deck section .................................................................... 18
CD Section ...................................................................... 21
CD Section ...................................................................... 21
7.
DIAGRAMS
7-1. Block Diagram – CD SERVO Section – ....................... 23
7-2. Block Diagram – TUNER/TAPE DECK Section – ...... 24
7-3. Block Diagram – MAIN Section – ................................ 25
7-4. Block Diagram – DISPLAY/KEY CONTROL/
7-2. Block Diagram – TUNER/TAPE DECK Section – ...... 24
7-3. Block Diagram – MAIN Section – ................................ 25
7-4. Block Diagram – DISPLAY/KEY CONTROL/
POWER SUPPLY Section – ........................................... 26
7-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 27
7-6. Printed Wiring Board – BD Board – ............................. 28
7-7. Schematic Diagram – BD Board – ................................ 29
7-8. Printed Wiring Boards
7-7. Schematic Diagram – BD Board – ................................ 29
7-8. Printed Wiring Boards
– DRIVER/MOTOR/SENSOR (CD) Boards – .............. 30
7-9. Schematic Diagram
– DRIVER/MOTOR/SENSOR (CD) Boards – .............. 30
7-10. Printed Wiring Boards
– SW/HEAD (A)/HEAD (B) Boards – .......................... 31
7-11. Schematic Diagram – SW Board – ................................ 32
7-12. Printed Wiring Board – MAIN Board – ........................ 33
7-13. Schematic Diagram – MAIN Board (1/4) – .................. 34
7-14. Schematic Diagram – MAIN Board (2/4) – .................. 35
7-15. Schematic Diagram
7-12. Printed Wiring Board – MAIN Board – ........................ 33
7-13. Schematic Diagram – MAIN Board (1/4) – .................. 34
7-14. Schematic Diagram – MAIN Board (2/4) – .................. 35
7-15. Schematic Diagram
– MAIN (3/4)/HEAD (A)/HEAD (B) Boards – ............. 36
7-16. Schematic Diagram – MAIN Board (4/4) – .................. 37
7-17. Printed Wiring Board – GAME IN Board – .................. 38
7-18. Schematic Diagram – GAME IN Board – ..................... 39
7-19. Printed Wiring Board – SUB WOOFER Board – ......... 40
7-20. Schematic Diagram – SUB WOOFER Board – ............ 41
7-21. Printed Wiring Boards
7-17. Printed Wiring Board – GAME IN Board – .................. 38
7-18. Schematic Diagram – GAME IN Board – ..................... 39
7-19. Printed Wiring Board – SUB WOOFER Board – ......... 40
7-20. Schematic Diagram – SUB WOOFER Board – ............ 41
7-21. Printed Wiring Boards
– POWER/SENSOR Boards – ........................................ 42
7-22. Schematic Diagram
– POWER/SENSOR Boards – ........................................ 43
7-23. Printed Wiring Boards
– PANEL/CD OPEN/CD SWITCH Boards – ................ 44
7-24. Schematic Diagram
– PANEL/CD OPEN/CD SWITCH Boards – ................ 45
7-25. Printed Wiring Boards
– PAD SWITCH/VOL Boards – ..................................... 46
7-26. Schematic Diagram
– PAD SWITCH/VOL Boards – ..................................... 47
7-27. Printed Wiring Boards
– MAIN TRANS/SUB-TRANS Boards – ...................... 48
7-28. Schematic Diagram
– MAIN TRANS/SUB-TRANS Boards – ...................... 49
7-29. IC Pin Function Description ........................................... 51
8.
EXPLODED VIEWS
8-1. Panel Section ................................................................... 55
8-2. Front Panel Section ......................................................... 56
8-3. Chassis Section ............................................................... 57
8-4. CD Mechanism Deck Section ......................................... 58
8-5. Base Unit Section (BU-30BD60C) ................................. 59
8-6. Tape Mechanism Deck Section
8-2. Front Panel Section ......................................................... 56
8-3. Chassis Section ............................................................... 57
8-4. CD Mechanism Deck Section ......................................... 58
8-5. Base Unit Section (BU-30BD60C) ................................. 59
8-6. Tape Mechanism Deck Section
(TCM-230AWR41CS) .................................................... 60
9.
ELECTRICAL PARTS LIST
............................... 61
Ver 1.1
4
HCD-RG88
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
• MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
MODEL
PART No.
E, Singapore, Chilean and
Peruvian models
Peruvian models
4-237-780-2
[]
Mexican and Argentina models
4-237-780-7
[]
PART No.