DOWNLOAD Sony HCD-RG80 Service Manual ↓ Size: 14.41 MB | Pages: 68 in PDF or view online for FREE

Model
HCD-RG80
Pages
68
Size
14.41 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-rg80.pdf
Date

Sony HCD-RG80 Service Manual ▷ View online

HCD-DX50/RG80
Canadian Model
HCD-RG80
Australian Model
E Model
HCD-DX50
SERVICE MANUAL
MINI HI-FI COMPONENT SYSTEM
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM58E-30BD60
Section
Base Unit Name
BU-30BD60
Optical Pick-up Name
A-MAX.3
Tape deck
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
TCM-230PWR41C
SPECIFICATIONS
Ver 1.3  2003. 10
• HCD-DX50/RG80 are the tuner,
deck, CD and amplifier section in
MHC-DX50/RG80.
— Continued on next page —
Photo : HCD-DX50
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-929-589-14
2003J16-1
© 2003.10
2
HCD-DX50/RG80
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 
0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
3
HCD-DX50/RG80
TABLE OF CONTENTS
1. GENERAL
·········································································· 4
2. DISASSEMB
L
······························································· 7
3. TEST MODE
···································································· 12
4. MECHANICAL ADJUSTMENTS
····························· 14
5. ELECTRICAL ADJUSTMENTS
······························· 14
6. DIAGRAMS
6-1. Circuit Board Location ················································· 20
6-2. Block Diagrams ···························································· 21
6-3. Schematic Diagram    Main Section (1/4) ···················· 23
6-4. Schematic Diagram    Main Section (2/4) ···················· 24
6-5. Schematic Diagram    Main Section (3/4) ···················· 25
6-6. Schematic Diagram    Main Section (4/4) ···················· 26
6-7. Printed Wiring Board    Main Section ·························· 27
6-8. Schematic Diagram    BD Section ································ 28
6-9. Printed Wiring Board    BD Section ····························· 29
6-10. Schematic Diagram    AMP Section ··························· 30
6-11. Printed Wiring Board    AMP Section ························· 31
6-12. Schematic Diagram    Panel Section ··························· 32
6-13. Printed Wiring Board    Panel Section ························ 33
6-14. Schematic Diagram    Panel SW Section ···················· 34
6-15. Printed Wiring Board    Panel SW Section ················· 35
6-16. Schematic Diagram    Leaf SW Section ····················· 36
6-17. Printed Wiring Board    Leaf SW Section ··················· 37
6-18. Schematic Diagram    Driver Section ························· 38
6-19. Printed Wiring Board    Driver Section ······················· 39
6-20. Schematic Diagram    Trans Section ··························· 40
6-21. Printed Wiring Board    Trans Section ························ 41
6-22. Printed Wiring Board    Switch Section ······················ 42
6-23. IC Pin Function Description ······································· 42
6-24. IC Block Diagrams ····················································· 45
7. EXPLODED VIEWS
7-1. Cabinet Section ····························································· 47
7-2. Front Panel Section ······················································· 48
7-3. Main Board Section ······················································ 49
7-4. Tape Mechanism Section-1 (TCM-230PWR41C) ········ 50
7-5. Tape Mechanism Section-2 (TCM-230PWR41C) ········ 51
7-6. CD Mechanism Deck Section (CDM58E-30BD60) ···· 52
7-7. Base Unit Section (BU-30BD60) ································· 53
8. ELECTRICAL PARTS LIST
······································· 54
SAFETY  CHECK-OUT
    After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
    The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
1.
A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2.
A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3.
Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
Earth Ground
AC
voltmeter
(0.75V)
1.5k
0.15
µF
Fig. A.  Using an AC voltmeter to check AC leakage.
To Exposed Metal 
Parts on Set
MODEL IDENTIFICATION
— BACK PANEL —
MODEL
DX50 : E, SP, AR models
DX50 : KR, MX, AUS/RG80 models
PARTS No.
4-231-580-0s
4-231-580-2s
• Abbreviation
AUS
: Australian model
SP
: Singapore model
KR
: Korea model
PARTS No.
MX
: Mexican model
AR
: Argentina model
4
HCD-DX50/RG80
SECTION 1
GENERAL
This section is extracted from
instruction manual.
Page of 68
Display

Sony HCD-RG80 Service Manual ▷ Download

  • DOWNLOAD Sony HCD-RG80 Service Manual ↓ Size: 14.41 MB | Pages: 68 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony HCD-RG80 in PDF for free, which will help you to disassemble, recover, fix and repair Sony HCD-RG80 Audio. Information contained in Sony HCD-RG80 Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.