Sony HCD-RG66T Service Manual ▷ View online
HCD-RG66T
2
General
Power requirements
Mexican model:
Mexican model:
120 V AC, 60 Hz
Argentina model:
220 V AC, 50/60 Hz
Other models:
120 V, 220 V or 230 - 240
V AC, 50/60 Hz
Adjustable with voltage
selector
V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
230 watts
Dimensions (w/h/d)
Approx. 280 x 360 x 445
mm
mm
Mass :
Approx. 11.0 kg
Design and specifications are subject to change
without notice.
without notice.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
The following caution label is located inside the unit.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
HCD-RG66T
3
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
5
Setting the Clock .............................................................
6
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
7
3-2. Top Case ..........................................................................
8
3-3. Loading Panel ..................................................................
8
3-4. CD Mechanism Deck (CDM58ES-30BD60C) ..............
9
3-5. Front Panel Section .........................................................
9
3-6. Back Panel Section .......................................................... 10
3-7. MAIN Board ................................................................... 10
3-8. Base Unit (BU-30BD60C) .............................................. 11
3-9. DRIVER Board, MOTOR Board
3-7. MAIN Board ................................................................... 10
3-8. Base Unit (BU-30BD60C) .............................................. 11
3-9. DRIVER Board, MOTOR Board
and SENSOR (CD) Board .............................................. 11
3-10. Tape Mechanism Deck (TCM-230AWR41CS) .............. 12
3-11. Belt .................................................................................. 12
3-12. SW Board, HEAD (A) Board
3-11. Belt .................................................................................. 12
3-12. SW Board, HEAD (A) Board
and HEAD (B) Board ...................................................... 13
4.
TEST MODE
.............................................................. 14
5.
MECHANICAL ADJUSTMENTS
....................... 18
6.
ELECTRICAL ADJUSTMENTS
Deck section .................................................................... 18
CD Section ...................................................................... 21
CD Section ...................................................................... 21
7.
DIAGRAMS
7-1. Block Diagram – CD SERVO Section – ....................... 23
7-2. Block Diagram – TUNER/TAPE DECK Section – ...... 24
7-3. Block Diagram – MAIN Section – ................................ 25
7-4. Block Diagram – DISPLAY/KEY CONTROL/
7-2. Block Diagram – TUNER/TAPE DECK Section – ...... 24
7-3. Block Diagram – MAIN Section – ................................ 25
7-4. Block Diagram – DISPLAY/KEY CONTROL/
POWER SUPPLY Section – ........................................... 26
7-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 27
7-6. Printed Wiring Board – BD Board – ............................. 28
7-7. Schematic Diagram – BD Board – ................................ 29
7-8. Printed Wiring Boards
7-7. Schematic Diagram – BD Board – ................................ 29
7-8. Printed Wiring Boards
– DRIVER/MOTOR/SENSOR (CD) Boards – .............. 30
7-9. Schematic Diagram
– DRIVER/MOTOR/SENSOR (CD) Boards – .............. 30
7-10. Printed Wiring Boards
– SW/HEAD (A)/HEAD (B) Boards – .......................... 31
7-11. Schematic Diagram – SW Board – ................................ 32
7-12. Printed Wiring Boards – MAIN Board – ....................... 33
7-13. Schematic Diagram – MAIN Board (1/4) – .................. 34
7-14. Schematic Diagram – MAIN Board (2/4) – .................. 35
7-15. Schematic Diagram
7-12. Printed Wiring Boards – MAIN Board – ....................... 33
7-13. Schematic Diagram – MAIN Board (1/4) – .................. 34
7-14. Schematic Diagram – MAIN Board (2/4) – .................. 35
7-15. Schematic Diagram
– MAIN (3/4)/HEAD (A)/HEAD (B) Boards – ............. 36
7-16. Schematic Diagram – MAIN Board (4/4) – .................. 37
7-17. Printed Wiring Board – GAME IN Board – .................. 38
7-18. Schematic Diagram – GAME IN Board – ..................... 39
7-19. Printed Wiring Boards
7-17. Printed Wiring Board – GAME IN Board – .................. 38
7-18. Schematic Diagram – GAME IN Board – ..................... 39
7-19. Printed Wiring Boards
– POWER/SENSOR Boards – ........................................ 40
7-20. Schematic Diagram
– POWER/SENSOR Boards – ........................................ 41
7-21. Printed Wiring Boards
– PANEL/CD OPEN/CD SWITCH Boards – ................ 42
7-22. Schematic Diagram
– PANEL/CD OPEN/CD SWITCH Boards – ................ 43
7-23. Printed Wiring Boards
– PAD SWITCH/VOL Boards – ..................................... 44
7-24. Schematic Diagram
– PAD SWITCH/VOL Boards – ..................................... 45
7-25. Printed Wiring Boards
– MAIN TRANS/SUB-TRANS Boards – ...................... 46
7-26. Schematic Diagram
– MAIN TRANS/SUB-TRANS Boards – ...................... 47
7-27. IC Pin Function Description ........................................... 49
8.
EXPLODED VIEWS
8-1. Panel Section ................................................................... 53
8-2. Front Panel Section ......................................................... 54
8-3. Chassis Section ............................................................... 55
8-4. CD Mechanism Deck Section
8-2. Front Panel Section ......................................................... 54
8-3. Chassis Section ............................................................... 55
8-4. CD Mechanism Deck Section
(CDM58ES-30BD60C) ................................................... 56
8-5. Base Unit Section (BU-30BD60C) ................................. 57
8-6. Tape Mechanism Deck Section
8-6. Tape Mechanism Deck Section
(TCM-230AWR41CS) .................................................... 58
9.
ELECTRICAL PARTS LIST
............................... 59
Ver 1.1
4
HCD-RG66T
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
• MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
MODEL
PART No.
E, Chilean and Peruvian models
4-237-780-0
[]
Mexican and Argentina models
4-237-780-5
[]
PART No.
5
HCD-RG66T
SECTION 2
GENERAL
This section is extracted from
instruction manual.
instruction manual.
CD eg
CD SYNC HI-DUB qf
DECK A A wh
DECK B A qh
DIMMER 9
DIRECTION q;
DISC 1~3 4
DISC SKIP EX-CHANGE 5
Disc tray 3
DISPLAY 7
CD SYNC HI-DUB qf
DECK A A wh
DECK B A qh
DIMMER 9
DIRECTION q;
DISC 1~3 4
DISC SKIP EX-CHANGE 5
Disc tray 3
DISPLAY 7
EDIT q;
EFFECT ON/OFF rs
ENTER ra
FM MODE qs
EFFECT ON/OFF rs
ENTER ra
FM MODE qs
GAME ea
GAME EQ rd
GAME INPUT wd
GAME MIXING wl
GROOVE rf
IR (receptor) 2
GAME EQ rd
GAME INPUT wd
GAME MIXING wl
GROOVE rf
IR (receptor) 2
MD (VIDEO) es
MIC wa
MIC LEVEL w;
MOVIE EQ ek
MUSIC EQ eh
OPEN/CLOSE Z 6
P FILE r;
PHONES (jack) ql
PLAY MODE e;
MIC wa
MIC LEVEL w;
MOVIE EQ ek
MUSIC EQ eh
OPEN/CLOSE Z 6
P FILE r;
PHONES (jack) ql
PLAY MODE e;
REC PAUSE/START qg
REPEAT qs
SPECTRUM 8
SURROUND el
TAPE A/B ed
TUNER/BAND ef
TUNER MEMORY e;
VOLUME qa
REPEAT qs
SPECTRUM 8
SURROUND el
TAPE A/B ed
TUNER/BAND ef
TUNER MEMORY e;
VOLUME qa
BUTTON DESCRIPTIONS
@/1 1
hH ws
x qd
X wk
> qj
. wg
M/+ qk
m/– wf
v/V/b/B ej
hH ws
x qd
X wk
> qj
. wg
M/+ qk
m/– wf
v/V/b/B ej
ALPHABETICAL ORDER
A - D
M - Q
1
2 3
4
5
6
7
8
9
0
K
L
M
N
O
qh
qj
qk
ql
w;
wa
ws
W
X
wg
wh
wk
wl
e;
ea
es
eg
ed
ef
ej
eh
ek
el
ra r;
rd rs
rf
E - L
R - Z
LOCATION OF CONTROLS
– Front Panel –
– Front Panel –