HCD-RG55, HCD-RG55S, MHC-RG55, MHC-RG55S — Sony Audio Service Manual (repair manual)

Model
HCD-RG55 HCD-RG55S MHC-RG55 MHC-RG55S
Pages
71
Size
4.49 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-rg55-hcd-rg55s-mhc-rg55-mhc-rg55s.pdf
Date

View Sony HCD-RG55 / HCD-RG55S / MHC-RG55 / MHC-RG55S Service Manual online

1
Ver 1.2  2004. 05
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM58F-K6A
section
CDM58FS-K6A
Optical Pick-up Name
KSM-213DCP
Tape deck
Model Name Using Similar Machanism
NEW
Section
Tape Transport Mechanism Type
RG55: CWL43RR51
RG55S: CWL43FR50
SERVICE MANUAL
AEP Model
UK Model
HCD-RG55S
E Model
Australian Model
HCD-RG55
HCD-RG55/RG55S
Amplifier section
European model:
HCD-RG55S
Front speaker
DIN power output (rated)
50+50 watts (6 ohms at
1 kHz, DIN)
Continuous RMS power output (reference)
60+60 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference)
120+120 watts (6 ohms
at 1 kHz, 10% THD)
Sub woofer
DIN power output (rated)
100 watts (12 ohms at
40 Hz, DIN)
Continuous RMS power output (reference)
120 watts (12 ohms at
40 Hz, 10% THD)
Music power output (reference)
120 watts (12 ohms at
40 Hz, 10% THD)
Other models:
HCD-RG55
The following measured at AC 120, 220, 230 –
240 V, 50/60 Hz
DIN power output (rated)
100+100 watts (6 ohms
at 1 kHz, DIN)
SPECIFICATIONS
Continuous RMS power output (reference)
120+120 watts (6 ohms
at 1 kHz, 10% THD)
Inputs
MD/VIDEO (AUDIO) IN (phono jacks):
voltage 450/250 mV,
impedance 47 kilohms
GAME (AUDIO) IN (phono jack):
voltage 450 mV,
impedance 47 kilohms
MIC (phone jack) (except for European models):
sensitivity 1 mV,
impedance 10 kilohms
Outputs
PHONES (stereo mini jack):
accepts headphones of
8 ohms or more
Front speaker:
accepts impedance of 6 to
16 ohms
Sub woofer speaker (MHC-RG55S only):
accepts impedance of 12
to 16 ohms
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-874-003-03
2004E04-1
© 2004. 05
– Continued on next page –
COMPACT DISC DECK RECEIVER
• HCD-RG55/RG55S is the tuner,
deck, CD and amplifier section in
MHC-RG55/RG55S.
2
HCD-RG55/RG55S
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CD player section
System
Compact disc and digital
audio system
Laser
Semiconductor laser
(
λ=780 nm)
Emission duration:
continuous
Frequency response
2 Hz – 20 kHz (±0.5 dB)
Wavelength
780 – 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength
660 nm
Output Level
–18 dBm
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (±3 dB),
using Sony TYPE I
cassette
Wow and flutter
±0.15% W.Peak (IEC)
0.1% W.RMS (NAB)
±0.2% W.Peak (DIN)
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
European and Middle Eastern models:
531 – 1,602 kHz (with the
interval set at 9 kHz)
Other models:
531 – 1,602 kHz (with the
interval set at 9 kHz)
530 – 1,710 kHz (with the
interval set at 10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency 450 kHz
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
General
Power requirements
European model:
230 V AC, 50/60 Hz
Australian models:
230 – 240 V AC, 50/60 Hz
Mexican model:
120 V AC, 50/60 Hz
Argentine models:
220 V AC, 50/60 Hz
Korean model:
220 V AC, 60 Hz
Other models:
120 V, 220 V or 230 –
240 V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
European models:
HCD-RG55S:
150 watts
0.5 watts (at the Power
Saving Mode)
Other models:
HCD-RG55:
200 watts
Dimensions (w/h/d)
Approx. 280 
× 325 × 421 mm
Mass
HCD-RG55S:
Approx. 9.0 kg
HCD-RG55:
Approx. 10.0 kg
Supplied accessories:
AM loop antenna (1)
Remote Commander (1)
Batteries (2)
FM lead antenna (1)
Front speaker pads (8)
Design and specifications are subject to change without
notice.
3
HCD-RG55/RG55S
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
MODEL IDENTIFICATION
– BACK PANEL –
PARTS No.
MODEL
PARTS No.
AR, E2, E51, SP models
4-238-649-01
AUS, KR, MX models
4-238-649-21
AEP, UK models
4-238-649-31
• Abbreviation
AUS : Australian model
AR : Argentina model
SP
: Singapore model
E2 : Central and South America model
KR
: Korea model
E51 : Chilean and Peruvian model
MX
: Mexican model
SETTING AND RELEASING THE CD DISC TRAY LOCK
FUNCTION
This set has a disc tray lock function to prevent discs for
demonstration at shops from theft. While this lock function is set,
the tray will not be delivered out even when the OPEN/CLOSE
button is pressed.
Setting method:
Press the OPEN/CLOSE button while pressing the STOP button.
After a few seconds, the message “LOCKED” will appear on the
fluorescent indicator tube with the tray locked.
Releasing method:
Just as the lock is set, press the OPEN/CLOSE button while
pressing the STOP button.
After a few seconds, the message “UNLOCKED” will appear with
the lock released.
4
TABLE OF CONTENTS
1. SERVICE NOTE
................................................................ 5
2. GENERAL
Main Unit ................................................................................ 6
Remote Control ....................................................................... 7
3. DISASSEMBLY
3-1.   Case (Top) ........................................................................... 9
3-2.   CD (Door) ........................................................................... 9
3-3.   Front Panel Section (AEP, UK Model) ............................. 10
3-4.   Front Panel Section (Except AEP, UK Model) ................. 11
3-5.   Tape Mechanism Deck ...................................................... 12
3-6.   Panel Board (AEP, UK Model) ......................................... 12
3-7.   Panel Board (Except AEP, UK Model) ............................. 13
3-8.   Key Board ......................................................................... 13
3-9.   Sensor Board, DC Fan (FAN961) ..................................... 14
3-10. Main Board, Sub Woofer Board, Power Board ................. 15
3-11. CD Board .......................................................................... 15
3-12. Base Unit ........................................................................... 16
3-13. Driver Board, Motor Board, Sensor (CD) Board .............. 16
4. TEST MODE
..................................................................... 17
5. ELECTRICAL ADJUSTMENTS
................................. 21
6. DIAGRAMS
6-1.   Circuit Boards Location .................................................... 23
6-2.   Printed Wiring Boards –CD Section (1/2)– ...................... 25
6-3.   Printed Wiring Boards –CD Section (2/2)– ...................... 26
6-4.   Schematic Diagram –CD Section– .................................... 27
6-5.   Printed Wiring Board –Main Section– .............................. 28
6-6.   Schematic Diagram –Main Section (1/4)– ........................ 30
6-7.   Schematic Diagram –Main Section (2/4)– ........................ 31
6-8.   Schematic Diagram –Main Section (3/4)– ........................ 32
6-9.   Schematic Diagram –Main Section (4/4)– ........................ 33
6-10. Printed Wiring Boards –Panel Section– ............................ 34
6-11. Schematic Diagram –Panel Section– ................................ 35
6-12. Printed Wiring Board –Key Section– ................................ 36
6-13. Schematic Diagram –Key Section– ................................... 37
6-14. Printed Wiring Board –Sub Woofer Section– ................... 38
6-15. Schematic Diagram –Sub Woofer Section– ...................... 39
6-16. Printed Wiring Boards –Power Section (1/3)– .................. 40
6-17. Printed Wiring Board –Power Section (2/3)– ................... 41
6-18. Printed Wiring Board –Power Section (3/3)– ................... 42
6-19. Schematic Diagram –Power Section– ............................... 43
7. EXPLODED VIEWS
7-1.   Main Section ..................................................................... 46
7-2.   Front panel Section ........................................................... 47
7-3.   Main Board Section .......................................................... 48
7-4.   CD Mechanism Deck Section ........................................... 49
7-5.   Optical Pick-up Section ..................................................... 50
8. ELECTRICAL PARTS LIST
........................................ 51
HCD-RG55/RG55S
5
HCD-RG55/RG55S
SECTION 1
SERVICE NOTE
1
 
Cut the fifteen melted-connection points
     with a cutting plier.
3
 
Cut the seven melted-connection points
     with a cutting plier.
2
 
PANEL board
4
 
KEY board
PANEL board
(eleven screw holes)
KEY board
(six screw holes)
Screw hole
In order to re-install the panel board and the key board,
fix them by using the screws (+BVTP 2.6
 
× 
8 ) respectively.
Screw in to the respective screw holes.
Do not tighten the screws excessively.
* The panel board and the key board only are connected to the front panel
  by means of hot-melting the plastics.
Note for installing the panel board and the key board
REMOVING THE PANEL BOARD AND THE KEY BOARD
Hot melt

Download Sony HCD-RG55 / HCD-RG55S / MHC-RG55 / MHC-RG55S Service Manual (Repair Manual)

Here you can view online or download Sony HCD-RG55 / HCD-RG55S / MHC-RG55 / MHC-RG55S Service Manual in pdf. This Service Manual can help you recover, restore, fix, disassemble and repair Sony HCD-RG55 / HCD-RG55S / MHC-RG55 / MHC-RG55S Audio. Information contained in Sony HCD-RG55 / HCD-RG55S / MHC-RG55 / MHC-RG55S service manual (repair manual) typically includes:

  • Disassembly, troubleshooting, programming, maintenance, remote, adjustment, installation and setup instructions.
  • Schematics, wiring and block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Parts list (bill of materials).