Sony HCD-RG222 / MHC-RG222 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Personal Audio Group
Published by Sony Engineering Corporation
The following measured at AC 120, 127, 220, 240 V
50/60 Hz
DIN power output (rated): 100 + 100 watts (6 ohms at
50/60 Hz
DIN power output (rated): 100 + 100 watts (6 ohms at
1 kHz, DIN)
Continuous RMS power output (reference):
120 + 120 watts (6 ohms at
1 kHz, 10% THD)
1 kHz, 10% THD)
CD player section
System
Compact disc and digital
audio system
audio system
Laser
Semiconductor laser
(
(
λ=780 nm)
Emission duration:
continuous
continuous
Frequency response
2 Hz – 20 kHz (
±0.5 dB)
Wavelength
780 – 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Tape deck section
Recording system
4-track 2-channel, stereo
Frequency response
50 – 13,000 Hz (
±3 dB),
using Sony TYPE I
cassettes
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
General
Power requirements
European and Russian models:
European and Russian models:
230 V AC, 50/60 Hz
Australian model:
230 – 240 V AC, 50/60 Hz
Argentine models:
220 V AC, 50/60 Hz
Mexican models:
127 V AC, 60 Hz
Saudi Arabian model:
120 – 127/220 or
230 – 240 V AC, 50/60 Hz
Adjustable with voltage
selector
230 – 240 V AC, 50/60 Hz
Adjustable with voltage
selector
Other models:
120 V, 220 V or
230 – 240 V AC, 50/60 Hz
Adjustable with voltage
selector
230 – 240 V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
European and Russian models:
110 watts
0.25 watts (at the Power
Saving Mode)
0.25 watts (at the Power
Saving Mode)
Other models:
180 watts
Dimensions (w/h/d) incl. projecting parts and controls
Amplifier/Tuner/Tape/CD section:
Amplifier/Tuner/Tape/CD section:
Approx. 280
× 327 ×
425 mm
Amplifier section
Other models:
87.5 – 108.0 MHz
(50-kHz step)
(50-kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
European, Russian and Saudi Arabian models:
531 – 1,602 kHz (with the
tuning interval set at
9 kHz)
tuning interval set at
9 kHz)
Other models:
530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
FM tuner section
Tuning range
Russian model:
65.0 – 74.0 MHz
(There is no stereo effect.
10-kHz step)
87.5 – 108.0 MHz
(50-kHz step)
(There is no stereo effect.
10-kHz step)
87.5 – 108.0 MHz
(50-kHz step)
— Continued on next page —
HCD-RG222
AEP Model
UK Model
E Model
Australian Model
MINI HI-FI COMPONENT SYSTEM
9-877-657-02
2005E16-1
2005.05
• HCD-RG222 is the tuner, deck, CD and
amplifier section in MHC-RG222.
SPECIFICATIONS
Ver. 1.1 2005.05
Model Name Using Similar Mechanism
New
CD
CD Mechanism Type
CDM74-F1BD81
Section
Optical Pick-up Name
KSM-215DCP/C2NP
Tape deck
Model Name Using Similar Mechanism
New
Section
Tape Transport Mechanism Type
CWM43FF-05
2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
HCD-RG222
The release method of a CD disc tray LOCK function
There is a disc lock function for the disc theft prevention for a
demonstration at a shop front in this machine.
Procedue:
1. Press the ?/1 button to turn the set on.
2. Press two buttons of x and Z (EJECT) simultaneously for
demonstration at a shop front in this machine.
Procedue:
1. Press the ?/1 button to turn the set on.
2. Press two buttons of x and Z (EJECT) simultaneously for
five seconds.
3. The message “LOCKED” is displayed and the tray is locked.
(Even if exiting from this mode, the tray is still locked.)
4. Press two buttons of x and Z (EJECT) simultaneously for
five seconds again.
5. The message “UNLOCKED” is displayed and the tray is
unlocked.
6. To exit from this mode, press the ?/1 button to turn the set
off.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Mass
European and Russian models:
Approx. 8.5 kg
Other models:
Approx. 10.0 kg
Design and specifications are subject to change
without notice.
without notice.
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
Model Name
Part No.
AEP and UK model
4-252-487-0
[]
240V AC Area in E model
4-252-488-0
[]
Singapore model
4-254-503-0
[]
Australian model
4-254-504-0
[]
Saudi Arabia model
4-254-512-0
[]
Iran model
4-254-525-0
[]
Russian model
4-254-798-0
[]
Part No.
3
HCD-RG222
TABLE OF CONTENTS
1. SERVICING NOTE
·························································· 4
2. GENERAL
·········································································· 5
3. DISASSEMBLY
3-1. Cover (Top) ····································································· 8
3-2. CD Door ·········································································· 8
3-3. Front Panel Section ························································· 9
3-4. CD Mechanism Deck (CDM74-F1BD81) ······················ 9
3-5. Tape Mechanism Deck, GAME JACK Board ··············· 10
3-6. PANEL Board ······························································· 10
3-7. BACK PANEL Section, SUB-TRANS Board ·············· 11
3-8. Power Transformer ······················································· 11
3-9. MAIN Board ································································· 12
3-10. AMP Board ································································· 12
3-11. BD81A Board ····························································· 13
3-12. CONNECT Board ······················································· 13
3-13. DRIVER Board, SW Board ········································ 14
3-14. Optical Pick-up (KSM-215DCP/C2NP) ····················· 14
3-15. SENSOR Board ·························································· 15
3-16. MOTOR (TB) Board ··················································· 15
3-17. MOTOR (LD) Board ·················································· 16
3-2. CD Door ·········································································· 8
3-3. Front Panel Section ························································· 9
3-4. CD Mechanism Deck (CDM74-F1BD81) ······················ 9
3-5. Tape Mechanism Deck, GAME JACK Board ··············· 10
3-6. PANEL Board ······························································· 10
3-7. BACK PANEL Section, SUB-TRANS Board ·············· 11
3-8. Power Transformer ······················································· 11
3-9. MAIN Board ································································· 12
3-10. AMP Board ································································· 12
3-11. BD81A Board ····························································· 13
3-12. CONNECT Board ······················································· 13
3-13. DRIVER Board, SW Board ········································ 14
3-14. Optical Pick-up (KSM-215DCP/C2NP) ····················· 14
3-15. SENSOR Board ·························································· 15
3-16. MOTOR (TB) Board ··················································· 15
3-17. MOTOR (LD) Board ·················································· 16
4. TEST MODE
···································································· 17
5. DIAGRAMS
5-1. Block Diagrams – PANEL Section – ···························· 22
– MAIN Section – ······················································· 23
– BD/DRIVER Section – ············································ 24
– BD/DRIVER Section – ············································ 24
5-2. Printed Wiring Board – BD81A Section – ···················· 25
5-3. Schematic Diagram – BD81A Section – ······················ 26
5-4. Printed Wiring Board – CD MECHANISM Section – · 27
5-5. Schematic Diagram – CD MECHANISM Section – ···· 28
5-6. Printed Wiring Board – MAIN Section – ····················· 29
5-7. Schematic Diagram – MAIN Section (1/2) – ··············· 30
5-8. Schematic Diagram – MAIN Section (2/2) – ··············· 31
5-9. Printed Wiring Board – PANEL COMB Section – ······· 32
5-10. Schematic Diagram – PANEL COMB Section – ······· 33
5-11. Printed Wiring Board – PANEL Section – ·················· 34
5-12. Schematic Diagram – PANEL Section (1/2) – ··········· 35
5-13. Schematic Diagram – PANEL Section (2/2) – ··········· 36
5-14. Printed Wiring Board
5-3. Schematic Diagram – BD81A Section – ······················ 26
5-4. Printed Wiring Board – CD MECHANISM Section – · 27
5-5. Schematic Diagram – CD MECHANISM Section – ···· 28
5-6. Printed Wiring Board – MAIN Section – ····················· 29
5-7. Schematic Diagram – MAIN Section (1/2) – ··············· 30
5-8. Schematic Diagram – MAIN Section (2/2) – ··············· 31
5-9. Printed Wiring Board – PANEL COMB Section – ······· 32
5-10. Schematic Diagram – PANEL COMB Section – ······· 33
5-11. Printed Wiring Board – PANEL Section – ·················· 34
5-12. Schematic Diagram – PANEL Section (1/2) – ··········· 35
5-13. Schematic Diagram – PANEL Section (2/2) – ··········· 36
5-14. Printed Wiring Board
– TRANS Section (AEP, UK, RU) – ··························· 37
5-15. Printed Wiring Board
– TRANS Section (EXCEPT AEP, UK, RU) – ··········· 38
5-16. Printed Wiring Board
– AMP Section (AEP, UK, RU) – ································ 39
5-17. Printed Wiring Board
– AMP Section (EXCEPT AEP, UK, RU) – ················ 40
5-18. Schematic Diagram – AMP POWER Section – ········· 41
5-19. IC Pin Function Description ······································· 44
5-19. IC Pin Function Description ······································· 44
6. EXPLODED VIEWS
6-1. MAIN Section ······························································· 49
6-2. Front Panel Section ······················································· 50
6-3. MAIN Board Section ···················································· 51
6-4. CD Mechanism Deck Section -1 (CDM74-F1BD81) ··· 52
6-4. CD Mechanism Deck Section -2 (CDM74-F1BD81) ··· 53
6-2. Front Panel Section ······················································· 50
6-3. MAIN Board Section ···················································· 51
6-4. CD Mechanism Deck Section -1 (CDM74-F1BD81) ··· 52
6-4. CD Mechanism Deck Section -2 (CDM74-F1BD81) ··· 53
7. ELECTRICAL PARTS LIST
······································· 54
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
4
HCD-RG222
SECTION 1
SERVICING NOTE
•
SERVICE POSITION -1 (AMP BOARD)
•
SERVICE POSITION -2 (BD81A BOARD)
front panel
CD mechanism deck
AMP board
To inspect the AMP board, turn both of the front panel
and the CD mechanism deck so that the left side of the product faces down.
and the CD mechanism deck so that the left side of the product faces down.
BD81A board
CD mechanism deck
Remove the CD mechanism deck and place it on top of the pedestal as shown.
Inspect the BD81A board in this set up.
Inspect the BD81A board in this set up.
