DOWNLOAD Sony HCD-RG11 / MHC-RG11 Service Manual ↓ Size: 4.65 MB | Pages: 48 in PDF or view online for FREE

AEP Model

UK Model

• HCD-RG11 is the tuner, deck, CD and

amplifier section in MHC-RG11.

Model Name Using Similar Mechanism

HCD-RG20

CD

CD Mechanism Type

CDM58F-K6

Section

Optical Pick-up Name

KSM-213D

Tape deck

Model Name Using Similar Mechanism

HCD-RG20

Section

Tape Transport Mechanism Type

CWL44FF29

2004H16-1

© 2004.08

DIN power output (rated) 40 + 40 watts

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference)

50 + 50 watts (6 ohms at 1
kHz, 10% THD)

Music power output (reference)

95 + 95 watts (6 ohms
at 1 kHz, 10% THD)

Inputs
GAME (AUDIO) IN (phono jack):

voltage 450 mV,
impedance 47 kilohms

Outputs
PHONES (stereo mini jack):

accepts headphones of
8 ohms or more

Front speaker:

accepts impedance of 6 to
16 ohms

System

Compact disc and digital
audio system

Laser

Semiconductor laser
(

λ=780 nm)

Emission duration:
continuous

Frequency response

2 Hz – 20 kHz (

±0.5 dB)

Wavelength

780 – 790 nm

Signal-to-noise ratio

More than 90 dB

Dynamic range

More than 90 dB

Recording system

4-track 2-channel stereo

Frequency response

40 – 13,000 Hz (

±3 dB),

using Sony TYPE I
cassette

FM stereo, FM/AM superheterodyne tuner

Tuning range

87.5 – 108.0 MHz

Antenna

FM lead antenna

Antenna terminals

75 ohm unbalanced

Intermediate frequency

10.7 MHz

Tuning range

531 – 1,602 kHz (with the
interval set at 9 kHz)

Antenna

AM loop antenna

Antenna terminals

External antenna terminal

Intermediate frequency

450 kHz

Power requirements

230 V AC, 50/60 Hz

Power consumption

85 watts
1.0 watts (at the Power
Saving Mode)

Dimensions (w/h/d)

Approx. 280 

× 325 × 421 mm

Mass

Approx. 8.1 kg

Design and specifications are subject to change
without notice.

2

0

0

This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

·········································································· 3

································································ 5

2-1. Case (Top) ····································································· 5
2-2. CD Door ········································································ 6
2-3. Front Panel Section and

CD Mechanism Deck (CDM58F-K6) Section ·············· 6

2-4. Tape Mechanism Deck And PANEL Board ·················· 7
2-5. SUB TRANS Board, VIDEO OUT Board and

TRANS Board ······························································· 7

2-6. MAIN Board and POWER Board ································· 8
2-7. Base Unit ······································································· 8
2-8. CD Board, DRIVER Board, MOTOR Board and

ADDRESS SENSOR Board ·········································· 9

···································································· 10

······························· 12

······································································ 14

5-1. Circuit Board Location ················································ 14
5-2. Block Diagrams ··························································· 15
5-3. Printed Wiring Board  – CD Section – ························ 17
5-4. Schematic Diagram  – CD Section – ··························· 18
5-5. Printed Wiring Board  – MAIN Board – ····················· 19
5-6. Schematic Diagram  – MAIN Board (1/4) – ··············· 20
5-7. Schematic Diagram  – MAIN Board (2/4) – ··············· 21
5-8. Schematic Diagram  – MAIN Board (3/4) – ··············· 22
5-9. Schematic Diagram  – MAIN Board (4/4) – ··············· 23
5-10. Printed Wiring Board

– Address Sensor, Driver Motor Section – ·················· 24

5-11. Printed Wiring Board  – Panel Section – ····················· 25
5-12. Schematic Diagram  – Panel Section – ······················· 26
5-13. Printed Wiring Board  – POWER Board – ·················· 27
5-14. Printed Wiring Board  – Trans Section – ····················· 28
5-15. Schematic Diagram  – Trans Section – ······················· 29
5-16. IC Block Diagrams ······················································ 30
5-17. IC Pin Function Description ········································ 32

······················································ 34

6-1. MAIN SECTION ························································ 34
6-2. FRONT PANEL SECTION ········································· 35
6-3. MAIN BOARD SECTION ·········································· 36
6-4. CD MECHANISM DECK SECTION ························ 37

······································· 38

3

This section is extracted
from instruction manual.

1

2

3

4 5 6

7

8

9

q;

qa

qs

qd

qf

qg

qh

qj

qk

ql

w;

wa

ws

wd

wf

wg

wh

wj

wk

AUDIO jacks wd (19)
CD wk (10 – 12, 15)
CD SYNC qh (15)
Deck A ws (14)
Deck B qs (14 – 16)
DISC 1 – 3 4 (10, 11)
DISC SKIP EX-CHANGE 3

(10, 11)

Disc tray 5 (10)
DISPLAY w; (12)
EFFECT ON/OFF qd

(17)

GAME wg (18 – 20)

?/1 (power) 1
Z OPEN/CLOSE 6
Z (deck B) qa
M (fast forward) qf
. (go back) qj
> (go forward) qj
X (pause) qj
H (play) qj
x (stop) qj
m (rewind) qk
Z (deck A) wa

GAME EQ ql (17, 18, 20)
GROOVE 8 (17)
MOVIE EQ 7 (17)
MUSIC EQ 2 (17)
PHONES jack q;
REC PAUSE/START qg (15)
TAPE A/B wh (14, 15)
TUNER/BAND wj (12, 13, 15)
VIDEO jack wf (19, 20)
VOLUME control 9

4

1 2 3 4

5

6

7

8

9

0

qa

qs

qd

qf

qg

qh

qj

qk

ql

w;

wa

CD ql (10 – 12, 15)
CLEAR w; (11)
CLOCK/TIMER SELECT 2

(16, 19)

CLOCK/TIMER SET 3 (9, 16,

18)

DISPLAY 6 (12)
D.SKIP 7 (10)
ENTER qg (9, 11 – 13, 16, 18,

19)

EQ +/– qf (17)
GAME q; (18 – 20)
GROOVE qd (17)

ON/OFF qh (17)
PLAY MODE wa (10, 11)
PRESET +/– 5 (13)
REPEAT 8 (11)
SLEEP 1 (18)
STEREO/MONO 8 (13)
SURROUND qa (17)
TAPE A/B 9 (14, 15)
TUNER MEMORY qj (12, 13)
TUNER/BAND qk (12, 13)
TUNING +/– 5 (12, 13)
VOL +/– qs

?/1 (power) 4
M (fast forward) 5
. (go back) 5
> (go forward) 5
X (pause) 5
N (play) 5
m (rewind) 5
x (stop) 5

?/1

Proceed to step 5 when “CLOCK” appears
in the display.

.

>

.

>

The minute indication flashes.

.

>

If you made a mistake or want to change the time,
start over from step 2.

The clock settings are canceled when you disconnect
the power cord or if a power failure occurs.