DOWNLOAD Sony HCD-PZ1D / MHC-PZ1D Service Manual ↓ Size: 6.6 MB | Pages: 108 in PDF or view online for FREE

Model
HCD-PZ1D MHC-PZ1D
Pages
108
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6.6 MB
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PDF
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Service Manual
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Device
Audio
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hcd-pz1d-mhc-pz1d.pdf
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Sony HCD-PZ1D / MHC-PZ1D Service Manual ▷ View online

SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-PZ1D
SPECIFICATIONS
DVD RECEIVER
9-893-158-03
2012F33-1
© 
2012.06
E Model
Ver. 1.2  2012.06
•  HCD-PZ1D is the Amplifi er,  Inputs/Outputs, 
Disc player and Tuner section in MHC-PZ1D.
Model Name Using Similar Mechanism
NEW
DVD Mechanism Type
CDM74HFVX-DVBU101
Optical Pick-up Name
KHM-313CAB
Amplifier section
The following measured at AC 127 V, 220 V, 
60 Hz (Brazilian model)
The following measured at AC 127 V, 60 Hz 
(Mexican model)
The following measured at AC 120 V, 220 V, 
240 V, 50/60 Hz (Other models)
Brazilian model:
Power output (rated):
135 W + 135 W (at 6 Ω, 1 kHz, 1% 
THD, at LINK MODE)
RMS output power (reference):
Front speaker:
175 W + 175 W (per channel at 8 Ω, 
1 kHz, 10% THD)
Satellite speaker:
70 W + 70 W (per channel at 24 Ω, 
1 kHz, 10% THD)
Subwoofer:
210 W (at 6 Ω, 100 Hz, 10% THD)
Other models:
Power output (rated):
135 W + 135 W (at 6 Ω, 1 kHz, 1% 
THD, at LINK MODE)
RMS output power (reference):
Front speaker:
210 W + 210 W (per channel at 8 Ω, 
1 kHz)
Satellite speaker:
90 W + 90 W (per channel at 24 Ω, 
1 kHz)
Subwoofer:
240 W (at 6 Ω, 100 Hz)
Inputs
VIDEO/SAT VIDEO IN (phono jack):
1 Vp-p, 75 Ω
VIDEO/SAT AUDIO IN L/R (phono jacks):
voltage 250/450 mV, impedance 
47 kΩ
MIC (phone jack):
sensitivity 1 mV, impedance 10 kΩ
Intelligent Pantilter Dock:
1 Vp-p, 75 Ω
Outputs
VIDEO OUT (phono jack):
max. output level 1 Vp-p, unbalanced, 
Sync negative, load impedance 75 Ω
COMPONENT VIDEO OUT
Y: 1 Vp-p, 75 Ω
p-p, 75 Ω
p-p, 75 Ω
DVD DIGITAL OUT (Square optical 
connector jack, rear panel):
Wavelength 650 nm
PHONES (stereo mini jack):
accepts headphones of 8 Ω or more
FRONT SPEAKERS:
Use only the supplied speaker 
SS-GZR999D.
SATELLITE SPEAKERS:
Use only the supplied speaker 
SS-RSZ999D.
SUBWOOFER:
Use only the supplied subwoofer 
SS-WGR999D.
 (USB) port: Type A
Maximum current: 500 mA
Intelligent Pantilter Dock:
Output voltage: DC 4.2 V
Maximum current: 1 A
Disc player section 
System:
Compact disc and digital audio and 
video system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
* This output is the value measurement 
at a distance of 200 mm from the 
objective lens surface on the Optical 
Pick-up Block with 7 mm aperture.
Video color system format: NTSC
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
Brazilian model:
87.5 MHz   108.0 MHz (100 kHz 
step)
Other models:
87.5 MHz   108.0 MHz (50 kHz step)
Antenna:
FM lead antenna
Antenna terminals:
75 Ω unbalanced
Intermediate frequency:
10.7 MHz 
AM tuner section
Tuning range:
530 kHz   1,710 kHz (10 kHz step)
531 kHz   1,710 kHz (9 kHz step)
Antenna:
AM loop antenna
Antenna terminals:
External antenna terminal
Intermediate frequency:
450 kHz
General
Power requirements
Argentine model:
AC 220 V, 50/60 Hz
Brazilian model:
AC 127 V, 220 V, 60 Hz, adjustable 
with voltage selector
Mexican model:
AC 127 V, 60 Hz
Other models: 
AC 120 V, 220 V, 230 V   240 V, 
50/60 Hz, adjustable with voltage 
selector
Power consumption: 215 W
Dimensions (W/H/D) (excl. speakers):
Approx. 280 mm × 330 mm × 
430 mm
Mass (excl. speakers): Approx. 13.3 kg
Quantity of the main unit: 1 piece
Design and specifications are subject to 
change without notice.
Standby power consumption: 0.5 W
HCD-PZ1D
2
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
This system incorporates Dolby
1)
 Digital and 
DTS
2)
 Digital Surround System.
1)
 Manufactured under license from Dolby 
Laboratories. “Dolby” and the double-
D symbol are trademarks of Dolby 
Laboratories.
2)
 Manufactured under license under U.S. 
Patent #'s: 5,451,942; 5,956,674; 5,974,380; 
5,978,762; 6,487,535 & other U.S. and 
worldwide patents issued & pending. DTS 
and the Symbol are registered trademarks, 
& DTS 2.0+ Digital Out and the DTS logos 
are trademarks of DTS, Inc. Product includes 
software. ©DTS, Inc. All Rights Reserved.
“DVD+RW,” “DVD-RW,” “DVD+R,” “DVD 
VIDEO,” and the “CD” logos are trademarks.
 MPEG Layer-3 audio coding technology and 
patents licensed from Fraunhofer IIS and 
Thomson.
 Windows Media is either a registered 
trademark or trademark of Microsoft 
Corporation in the United States and/or 
other countries.
 This product contains technology subject 
to certain intellectual property rights 
of Microsoft. Use or distribution of this 
technology outside of this product is 
prohibited without a license(s) from 
Microsoft.
THIS PRODUCT IS LICENSED UNDER 
THE MPEG-4 VISUAL PATENT 
PORTFOLIO LICENSE FOR THE 
PERSONAL AND NON-COMMERCIAL 
USE OF A CONSUMER FOR
(i) ENCODING VIDEO IN COMPLIANCE 
WITH THE MPEG-4 VISUAL STANDARD 
(“MPEG-4 VIDEO”) 
AND/OR 
(ii) DECODING MPEG-4 VIDEO THAT 
WAS ENCODED BY A CONSUMER 
ENGAGED IN A PERSONAL AND NON-
COMMERCIAL ACTIVITY AND/OR WAS 
OBTAINED FROM A VIDEO PROVIDER 
LICENSED BY MPEG LA TO PROVIDE 
MPEG-4 VIDEO.
NO LICENSE IS GRANTED OR SHALL 
BE IMPLIED FOR ANY OTHER 
USE. ADDITIONAL INFORMATION 
INCLUDING THAT RELATING TO 
PROMOTIONAL, INTERNAL AND 
COMMERCIAL USES AND LICENSING 
MAY BE OBTAINED FROM MPEG LA, 
LLC. SEE http://www. mpegla.com/
 All other trademarks and registered 
trademarks are of their respective holders. 
In this manual, 
TM
 and 
®
 marks are not 
specified.
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classified as a CLASS 1 
LASER product. This marking is located 
on the rear exterior.
HCD-PZ1D
3
1. 
SERVICING  NOTES
  .............................................   4
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................   9
2-2.  Case (Side L), Case (Side R) ..........................................   10
2-3.  Top Panel Block ..............................................................   10
2-4.  Cord (With Plug) (J1) .....................................................   11
2-5. Base 
Plate 
........................................................................  11
2-6.  Cam Ring (Shutter) .........................................................   12
2-7.  Torsion Spring (A) ..........................................................   12
2-8. Ring 
(Operating) 
.............................................................  13
2-9. Chassis 
Block 
..................................................................  13
2-10. Loading Panel .................................................................   14
2-11.  Front Panel Block ...........................................................   15
2-12. VOL-LED Board ............................................................   16
2-13.  RIGHT Board, LEFT Board ...........................................   16
2-14. FRONT Board .................................................................   17
2-15.  LCD CTRL Board ...........................................................   17
2-16. MIC Board ......................................................................   18
2-17.  Sub Panel LCD Block .....................................................   19
2-18.  LCD Module (LCD101) .................................................   19
2-19.  BU Holder Block ............................................................   20
2-20. DMB19 Board .................................................................   21
2-21.  Optical Pick-up (KHM-313CAB) ...................................   21
2-22.  Back Panel Block ............................................................   22
2-23. MAIN Board ...................................................................   23
2-24. AMP Board .....................................................................   24
2-25. VIDEO Board .................................................................   25
2-26.  Mechanism Deck (CDM74HFV  ASSY) ........................   25
2-27.  DRIVER Board, SW Board ............................................   26
2-28. SENSOR Board ..............................................................   26
2-29.  MOTOR (TB) Board.......................................................   27
2-30.  MOTOR (LD) Board ......................................................   27
3. 
TEST  MODE 
 ............................................................   28
4. 
ELECTRICAL  CHECKS 
 ......................................   33
5. DIAGRAMS
5-1.  Block Diagram - RF, SERVO Section - ..........................   34
5-2.  Block Diagram - VIDEO Section - .................................   35
5-3.  Block Diagram - MAIN Section - ...................................   36
5-4.  Block Diagram - AUDIO Section - .................................   37
5-5. Block 
Diagram 
- DISPLAY, POWER SUPPLY Section - .......................   38
5-6.  Printed Wiring Boards - DRIVER Section - ...................   40
TABLE  OF  CONTENTS
5-7.  Schematic Diagram - DRIVER Section - .......................   41
5-8.  Printed Wiring Board - DMB19 Board (Side A) - ..........   42
5-9.  Printed Wiring Board - DMB19 Board (Side B) - ..........   43
5-10.  Schematic Diagram - DMB19 Board (1/4) - ..................   44
5-11.  Schematic Diagram - DMB19 Board (2/4) - ..................   45
5-12.  Schematic Diagram - DMB19 Board (3/4) - ..................   46
5-13.  Schematic Diagram - DMB19 Board (4/4) - ..................   47
5-14.  Printed Wiring Board - MAIN Board - ...........................   48
5-15.  Schematic Diagram - MAIN Board (1/3) - .....................   49
5-16.  Schematic Diagram - MAIN Board (2/3) - .....................   50
5-17.  Schematic Diagram - MAIN Board (3/3) - .....................   51
5-18.  Printed Wiring Boards - MIC, HP, USB Section - ..........   52
5-19.  Schematic Diagram - MIC, HP, USB Section - ..............   53
5-20.  Printed Wiring Board - VIDEO Board - .........................   54
5-21.  Schematic Diagram - VIDEO Board - ............................   55
5-22.  Printed Wiring Boards - FRONT Section - .....................   56
5-23.  Schematic Diagram - FRONT Section - .........................   57
5-24.  Printed Wiring Boards - PANEL Section - .....................   58
5-25.  Schematic Diagram - PANEL Section - ..........................   59
5-26. Printed Wiring Board 
- LCD CTRL Board (Component Side) -........................   60
5-27. Printed Wiring Board 
- LCD CTRL Board (Conductor Side) - .........................   61
5-28.  Schematic Diagram - LCD CTRL Board - .....................   62
5-29.  Printed Wiring Board - AMP Board - .............................   63
5-30.  Schematic Diagram - AMP Board - ................................   64
5-31.  Printed Wiring Boards - TRANSFORMER Section - ....   65
5-32.  Schematic Diagram - TRANSFORMER Section - .........   66
6. 
EXPLODED  VIEWS
6-1. Overall 
Section 
...............................................................  80
6-2.  Top Panel Section ...........................................................   81
6-3.  MAIN Board Section ......................................................   82
6-4.  Front Panel Section .........................................................   83
6-5. LCD 
Section 
...................................................................  84
6-6.  AMP Board Section ........................................................   85
6-7.  Sub Chassis Section ........................................................   86
6-8.  Mechanism Deck Section-1 
(CDM74HFVX-DVBU101) ...........................................   87
6-9.  Mechanism Deck Section-2 
(CDM74HFVX-DVBU101) ...........................................   88
7. 
ELECTRICAL  PARTS  LIST
  ..............................   89
Accessories are given in the last of the electrical parts list.
HCD-PZ1D
4
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
• 
Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
RELEASING  THE TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1.  Press the [
?/1
] button to turn on the system.
2.  Press the [DVD] button.
3.  Press the [
x
] button and [OPEN/CLOSE 
Z
] button simultane-
ously and hold down unit “UNLOCKED” appears on the LCD 
module (around 5 seconds).
Note: When “LOCKED” is appears, the tray lock is not released by turn-
ing power on/off with the [?/1] button.
NOTE  THE  IC103  ON  THE  DMB19  BOARD  REPLAC-
ING
IC103 on the DMB19 board cannot exchange with single. When 
this part is damaged, exchange the complete mounted board.
MODEL  IDENTIFICATION
– Back Panel –
Parts No.
Model
Part No.
120V AC area in E, 
Chilean and Peruvian models
4-276-614-0[]
Mexican model
4-276-614-1[]
Argentina model
4-276-614-2[]
Brazilian model
4-276-614-3[]
Ver. 1.1
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  • Here you can View online or download the Service Manual for the Sony HCD-PZ1D / MHC-PZ1D in PDF for free, which will help you to disassemble, recover, fix and repair Sony HCD-PZ1D / MHC-PZ1D Audio. Information contained in Sony HCD-PZ1D / MHC-PZ1D Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.