Sony HCD-NEZ30 (serv.man2) Service Manual ▷ View online
SERVICE MANUAL
Ver. 1.5 2007.04
9-887-030-82
HCD-NEZ30
US Model
Canadian Model
UK Model
E Model
East European Model
Subject: Change of HEAD PHONE board (Suffix-13, -14)
1.
NEW/FORMER DESCRIPTION
In this set, HEAD PHONE board has been changed in the midway of
production.
Printed wiring boards and schematic diagrams of new type, and changed
parts list are described in this supplement-2.
Refer to original service manual and supplement-1 for other information.
production.
Printed wiring boards and schematic diagrams of new type, and changed
parts list are described in this supplement-2.
Refer to original service manual and supplement-1 for other information.
SUPPLEMENT-2
File this supplement with the service manual.
– HEAD PHONE Board (Component Side) –
Former : 1-869-177-11, -12
New
New
: 1-869-177-13, -14
2
HCD-NEZ30
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
Note for Printed Wiring Boards and Schematic Diagrams
2.
DIAGRAMS
Note on Schematic Diagram:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
•
All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
C
: panel designation.
•
Signal path.
F
: TUNER
•
Abbreviation
CND : Canadian model
EE
CND : Canadian model
EE
: East European model
2-1. PRINTED WIRING BOARD – HEAD PHONE Board –
: Uses unleaded solder.
JW
2
4
1
JW238
JW239
JW231
JW240
JW240
JW247
JW245
JW244
J500
R530
R519
R525
R526
R528
R527
R520
R532
R534
R533
R531
R529
R541
R542
R543
R544
R545
R546
R547
R548
1
13
HEAD PHONE BOARD
1-869-177-
PHONES
(CHASSIS)
FFC501
MAIN
BOARD
CN500
BOARD
CN500
A
B
C
D
1
2
3
4
EPT500
C521
C520
(EXCEPT US, CND)
(EXCEPT UK, EE)
(UK, EE)
JR501
(US, CND)
13, 14
(13, 14)
R527
R525
R519
R520
R526
R528
J500
EPT500
R533
R531
R529
R534
R532
R530
R541
R542
R544
R546
R548
R543
R545
R547
C520
C521
470
470
470
470
470
470
220
220
220
220
220
220
JR501
JW240
JW240 0.45
µ
H
0
10k
10k
10k
10k
10k
10k
10k
10k
0.01
0.01
HP-L
HPGND
HP-R
SP-L
SP-R
HP-L
HP-L
HP-R
HP-R
SP-L
SP-L
MAIN
BOARD
(1/2)
CN500
SP-R
SP-R
FFC501
1
13
(CHASSIS)
PHONES
(EXCEPT US,CND)
(US,CND)
(EXCEPT UK,EE)
(UK,EE)
2-2. SCHEMATIC DIAGRAM – HEAD PHONE Board –
Ver. 1.5
3
HCD-NEZ30
NOTE:
•
Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
•
-XX and -X mean standardized parts, so they
may have some difference from the original
one.
may have some difference from the original
one.
•
RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
•
Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
•
SEMICONDUCTORS
In each case, u:
In each case, u:
µ
, for example:
uA... :
µ
A...
uPA... :
µ
PA...
uPB... :
µ
PB...
uPC... :
µ
PC...
uPD... :
µ
PD...
•
CAPACITORS
uF:
uF:
µ
F
•
COILS
uH:
uH:
µ
H
•
Abbreviation
AR
AR
: Argentina model
CND : Canadian model
E51 : Chilean and Peruvian models
E51 : Chilean and Peruvian models
HEAD PHONE
When indicating parts by reference
number, please include the board.
number, please include the board.
A-1158-127-A HEAD PHONE BOARD, COMPLETE
(E, E51, MX, AR)
A-1183-398-A HEAD PHONE BOARD, COMPLETE (US, CND)
A-1188-719-A HEAD PHONE BOARD, COMPLETE (UK, EE)
A-1188-719-A HEAD PHONE BOARD, COMPLETE (UK, EE)
***************************
< CAPACITOR >
C520
1-162-974-11 CERAMIC CHIP
0.01uF
50V
(EXCEPT US, CND)
C521
1-162-974-11 CERAMIC CHIP
0.01uF
50V
(EXCEPT US, CND)
< FLEXIBLE FLAT CABLE >
FFC501
1-831-785-21 CABLE, FLEXIBLE FLAT (13 CORE)
< JACK >
J500
1-785-448-21 JACK (PHONES)
< JUMPER RESISTOR >
JR501
1-216-864-11 SHORT CHIP
0 (US, CND)
< FERRITE BEAD >
JW240
1-410-396-41 FERRITE
0.45uH (UK, EE)
< RESISTOR >
R519
1-216-817-11 METAL CHIP
470
5%
1/10W
R520
1-216-817-11 METAL CHIP
470
5%
1/10W
R525
1-216-817-11 METAL CHIP
470
5%
1/10W
R526
1-216-817-11 METAL CHIP
470
5%
1/10W
R527
1-216-817-11 METAL CHIP
470
5%
1/10W
R528
1-216-817-11 METAL CHIP
470
5%
1/10W
R529
1-216-813-11 METAL CHIP
220
5%
1/10W
R530
1-216-813-11 METAL CHIP
220
5%
1/10W
R531
1-216-813-11 METAL CHIP
220
5%
1/10W
R532
1-216-813-11 METAL CHIP
220
5%
1/10W
R533
1-216-813-11 METAL CHIP
220
5%
1/10W
R534
1-216-813-11 METAL CHIP
220
5%
1/10W
R541
1-216-833-11 METAL CHIP
10K
5%
1/10W
R542
1-216-833-11 METAL CHIP
10K
5%
1/10W
R543
1-216-833-11 METAL CHIP
10K
5%
1/10W
3.
ELECTRICAL PARTS LIST
Ver. 1.5
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
R544
1-216-833-11 METAL CHIP
10K
5%
1/10W
R545
1-216-833-11 METAL CHIP
10K
5%
1/10W
R546
1-216-833-11 METAL CHIP
10K
5%
1/10W
R547
1-216-833-11 METAL CHIP
10K
5%
1/10W
R548
1-216-833-11 METAL CHIP
10K
5%
1/10W
EE
: East European model
MX : Mexican model
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