Sony HCD-MD1DX / HCD-MD1EX (serv.man2) Service Manual ▷ View online
– 41 –
– 42 –
7-5.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
•
Circuit Boards Location
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
¢
: internal component.
•
2
: nonflammable resistor.
•
C
: panel designation.
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
F
: FM/AM
E
: MD PLAY
q
: MD REC
J
: CD PLAY (ANALOG OUT)
c
: CD PLAY (DEGITAL OUT)
d
: TAPE PLAY
G
: TAPE REC
• Abbreviation
CND : Canadian model.
HK
HK
: Hong Kong model.
SP
: Singapore model.
Note:
The components identi-
fied by mark
The components identi-
fied by mark
!
or dotted
line with mark
!
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
!
sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
Note on Printed Wiring Board:
• X
: parts extracted from the component side.
•
®
: Through hole.
• b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• Indication of transistor.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
EJECT board
MOTOR board
SENSOR board
AMP board
JOINT board
BD (CD) board
MAIN board
POWER board
SW board
BD (MD) board
HP board
PANEL board
HCD-MD1EX
7-6.
PRINTED WIRING BOARD – BD (CD) Section – •
See page 41 Circuit Boards Location.
– 43 –
– 44 –
• Semiconductor
Location
Ref. No.
Location
IC103
C-1
Q101
B-3
Q103
C-3
• Semiconductor
Location
Ref. No.
Location
IC101
B-1
IC102
B-1
IC104
C-3
Q102
B-1
(Page 57)
HCD-MD1EX
– 45 –
– 46 –
7-7.
SCHEMATIC DIAGRAM – BD (CD) Section – •
See page 77 for Waveforms.
•
See page 79 for IC Block Diagrams.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : STOP
(
no mark : STOP
(
) : CD PLAY
∗
: Impossible to measure
The components identified by mark
!
or dotted
line with mark
!
are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
!
sont
critiques pour la sécurité.
Ne les remplacer que
par une piéce portant le numéro spécifié.
(Page 59)
HCD-MD1EX
– 47 –
– 48 –
7-8.
PRINTED WIRING BOARD – BD (MD) Section – •
See page 41 Circuit Boards Location.
• Semiconductor
Location
Ref. No.
Location
D101
B-2
IC192
C-4
IC401
D-4
• Semiconductor
Location
Ref. No.
Location
D181
B-1
D183
B-1
IC101
B-3
IC103
B-4
IC121
C-4
IC124
D-4
IC152
A-4
IC153
A-1
IC171
A-3
IC181
B-1
IC201
D-3
IC316
A-2
Q101
B-3
Q102
B-4
Q103
B-4
Q104
B-4
Q162
B-4
Q163
A-3
Q181
B-1
Q182
B-1
Q350
A-1
(Page 75)
(Page 57)
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