DOWNLOAD Sony HCD-MC1 / MHC-MC1 Service Manual ↓ Size: 6.79 MB | Pages: 78 in PDF or view online for FREE

Model
HCD-MC1 MHC-MC1
Pages
78
Size
6.79 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio / S/M HCD-MC1 99 US E
File
hcd-mc1-mhc-mc1.pdf
Date

Sony HCD-MC1 / MHC-MC1 Service Manual ▷ View online

HCD-MC1
6-18. SCHEMATIC DIAGRAM     PANEL SECTION      
• See page 80 for IC Block Diagrams.    • See page 71 for Waveforms.   • See page 79 for IC Pin Function Description.
R652
100
FM
— 65 —
— 66 —
HCD-MC1
6-19. PRINTED WIRING BOARD     POWER SECTION       
• See page 33 for Circuit Boards Location.
CN803
CN802
C822
D821
C872
D813
EP801
C821
C871
ACM
GND
MCA
C819
R851
R853
R856
R855
C853
C862
R827
Q812
Q81
1
R826
R825
NO801
R863
R851
C861
C807
R859
R858
R862
C851
Q851
C856
R852
C852
R854
C855
R861
R870
R857
R824
R822
R81
1
C810
C803
R803
R801
R821
C802
R815
R816
R808
C809
C857
C823
C817
R809
R812
R804
R802
IC801
R813
D811
C811
C814
C813
C812
R805
R806
D801
Q801
C806
C801
C818
C804
D812
R823
C854
CN991
S991
S991
CLP1
F991
F992
T991
R995
F994
US MODEL
E MODEL
E MODEL
F993
CN992
CN993
C991
R992
R994
R993
R991
POWER AMP BOARD
11
(11)
1-674-311-
4
1
B
MAIN BOARD
CN101
(Page 52)
1
9
C
MAIN BOARD
CN104
(Page 52)
1
18
E
E
E
E
1
4
1
3
E
MAIN BOARD
CN111
(Page 51)
1
7
TRANS BOARD
VOLTAGE
SELECTOR
11
(11)
1-674-313-
AC
POWER
TRANS FORMER
E MODEL
US MODEL
1
2
A
B
C
D
E
F
G
3
4
5
6
7
8
9
10
11
12
13
16
— 67 —
— 68 —
Ref. No.
Location
D801
B-2
D811
C-3
D812
B-3
D813
D-4
D821
B-6
IC801
C-1
Q801
B-2
Q811
D-3
Q812
D-3
Q851
E-2
• Semiconductor
Location
HCD-MC1
6-20. SCHEMATIC DIAGRAM      POWER SECTION
250V
US MODEL
US MODEL
US MODEL
E MODEL
E MODEL
S991
JW993
VOLTAGE
CHANGE
FM
The components identified by mark 
!
 or dotted
line with mark 
!
 are critical for safety.
Replace only with part number specified.
— 69 —
— 70 —
HCD-MC1
5
 
IC601 
8
 (X-OUT)
4.2Vp-p
8MHz
1
 
IC501 
0
 (X2)
5.5Vp-p
5 MHz
4
 
IC401 
 (EXTAL)
3.6Vp-p
10 MHz
3
 
IC501 
 (CLK-OUT)   
    5.0Vp-p
32.768 kHz
2
 
IC501 
 (XT2)
4.8Vp-p
32.768 kHz
6-21. WAVEFORMS
6-22. IC PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
I/O
Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
FIN2
FIN1
E
F
TB
TE–
TE
TESI
SCI
TH
TA
TD–
TD
JP
TO
FD
FD–
FA
FA–
FE
FE–
AGND
SP
SPI
SPG
SP–
SPD
SLEQ
SLD
SL–
SL+
JP–
JP+
TGL
TOFF
TES
HFL
Connected to the pick-up photodiode
Added with FIN1 to create RF signal, subtracted with FIN1 to create FE signal
Connected to the pick-up photodiode
Connected to the pick-up photodiode Subtracted with F to create TE signal
Connected to the pick-up photodiode
DC component of the TE signal is input
Connects the TE signal gain setting resistor between TE pins
TE signal output
TES (Track Error Sense) comparator input. The TE signal is band-passed and input
Shock detection input
Tracking gain time constant setting
TA amplifier output
Creates a tracking phase compensation constant between TD and VR pins
Tracking phase compensation setting
Tracking jump signal (kick pulse) amplitude setting
Tracking control signal output
Focusing control signal output
Creates a focusing phase compensation constant between FD and FA pins
Creates a focusing phase compensation constant between FD- and FA- pins
Creates a focusing phase compensation constant between FA and FE pins
FE signal output
Connects the FE signal gain setting resistor between TE pins
Analog signal Ground
Single end output of CV+ and CV- pin signal
Spindle amplifier input
Gain setting resistor is connected when the spindle 12cm mode
Works together with the SPD pin to connect to the spindle phase compensation constant
Spindle control signal output
Sled phase compensation constant is connected
Sled control signal output
Sled feeding signal is input from the microprocessor
Sled feeding signal is input from the microprocessor
Tracking jump signal is input from the DSP
Tracking jump signal is input from the DSP
Tracking gain control signal is input from the DSP Gain becomes low when TGL is “H”
Tracking off control signal is input from the DSP
Tracking becomes off when TOFF is “H”
Outputs TES signal to the DSP
HFL (High Frequency Level) is used to determine whether the main beam is
positioned on a pit or a mirror
I
I
I
I
I
I
O
I
I
I
O
I
O
I
O
O
I
O
I
O
I
O
I
I
I
O
I
O
I
I
I
I
I
I
O
O
– MAIN Section –
– PANEL Section –
– BD Section –
BD BOARD IC101 LA9240M (FOCUS/TRACKING/SLED SERVO, RF AMP)
1
 
IC101 
 (RFSM)TP(RF)
1.7Vp-p
0.4Vp-p
5.2Vp-p
230ns
6
 
IC102 
 (16M)
16.9344 MHz
4.2336 MHz
7
 
IC102 
 (4.2M)
5Vp-p
5
 
IC102 
 (XOUT)X101
5.2Vp-p
16.9344 MHz
2
 
IC101 
 (FE)
       (PLAY MODE)
3
 
IC101 
7
 (TE)TP(TE)
4
 
IC102
(PCK)TP(PLCK)
0.5Vp-p
5.3Vp-p
— 71 —
— 72 —
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