Sony HCD-LX7 / HCD-LX8 / LBT-LX7 / LBT-LX8 Service Manual ▷ View online
HCD-LX7/LX8
25
25
IC101
ta
FE
1
2
3
4
5
WAVEFORMS
– BD (CD) SECTION –
– BD (CD) SECTION –
IC101
yh
XTAI
IC101
ta
RF AC
IC101
ra
TE
IC101
wh
MDP
1
IC601
us
X-OUT
– PANEL FL SECTION –
1
2
IC501
qa
XC-OUT
IC501
qd
X-OUT
– MAIN (2/3) SECTION –
3.1Vp-p
16.9MHz
1.2Vp-p
(PLAY)
2.5V
APPROX 500mVp-p (PLAY)
2.5V
APPROX 200m Vp-p (PLAY)
7.5
µ
sec
2.4Vp-p
16MHz
2.8Vp-p
32.768kHz
2.8Vp-p
12.5MHz
3.6Vp-p
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
2
: nonflammable resistor.
•
5
: fusible resistor.
•
C
: panel designation.
For printed wiring boards.
Note:
• X
: parts extracted from the component side.
•
a
: Through hole.
• b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
F
: FM
g
: VIDEO/MD
E
: PB (DECK A)
d
: PB (DECK B)
G
: REC (DECK B)
J
: CD
c
: digital out
I
: PHONO
• Abbreviation
EA
: Saudi Arabia model.
AR
: Argentine model.
SP
: Singapore model.
MY
: Malaysia model.
MX
: Mexican model.
AUS
: Australian model.
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
• Indication of transistor
Q
C
These are omitted
E
B
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
(Side A)
parts face are indicated.
B
These are omitted.
C
E
B
These are omitted.
C
E
HCD-LX7/LX8
26
26
6-3. PRINTED WIRING BOARD – BD (CD) SECTION –
• See page 17 for Circuit Boards Location.
(Page 28)
(VC)
(RF)
(AGCCON)
(FE)
(FF1)
(TE)
19
Q
HCD-LX7/LX8
27
27
6-4. SCHEMATIC DIAGRAM – BD (CD) SECTION –
• See page 25 for Waveforms.
(Page 30)
TP
(TE)
TP
(RP)
TP (AGCCON)
TP
(FE)
TP
(VC)
68
10V
220
19P
NC
C
HCD-LX7/LX8
28
28
6-5. PRINTED WIRING BOARD – MAIN SECTION –
• See page 17 for Circuit Boards Location.
D191
H-6
D192
I-6
D193
I-7
D194
I-7
D333
A-11
D334
A-11
D335
A-9
D336
A-9
D501
B-7
D534
C-6
D801
A-7
D802
B-6
D803
B-5
D804
B-6
D805
B-5
D806
B-6
D807
A-5
D808
A-8
D911
E-3
D912
D-4
D913
E-3
D931
C-5
D951
I-3
IC101
G-10
IC181
I-8
IC191
I-6
IC301
C-11
IC501
C-7
IC601
I-12
IC781
I-1
IC801
B-6
IC901
C-2
IC911
E-4
IC931
C-3
IC932
C-3
IC933
B-2
IC951
I-2
Q111
G-10
Q112
G-8
Q113
F-8
Q115
F-9
Q161
F-8
Q162
F-8
Q163
E-8
Q165
F-10
Q331
A-11
Q332
A-11
Q333
A-11
Q334
A-11
Q335
A-9
Q336
A-11
Q337
A-10
Q338
A-9
Q339
A-9
Q340
A-10
Q341
A-10
Q342
A-10
Q343
A-10
Q801
B-6
Q802
A-5
Q803
A-5
Q804
B-5
Q901
H-2
Q902
H-2
Q903
H-2
Q904
H-2
Q905
H-2
Q906
H-2
Q911
D-4
Q912
E-4
Q913
D-4
Q914
D-4
Q931
C-4
Q932
C-4
Q961
I-3
Q962
I-3
• Semiconductor
Location
Ref. No.
Location
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