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9
CD MECHANISM DECK (CDM37M-5BD32L)
7
five screws
(BVTP3
(BVTP3
×
8)
8
CD mechanism deck
(CDM37M-5BD32L)
(CDM37M-5BD32L)
3
three screws
(BVTP3
(BVTP3
×
8)
3
three screws
(BVTP3
(BVTP3
×
8)
2
connector
(CN412)
(CN412)
1
wire (flat type) (19 core)
(CN411)
(CN411)
5
Open the two cable clamps.
4
4
6
3
two screws
(BVTP3
(BVTP3
×
8)
10
BASE UNIT (BU-5BD32L)
3
base unit
(BU-5BD32L)
(BU-5BD32L)
1
BU fitting screw
2
boss
DISC TABLE
Note: When the disc table is installed, adjust the positions of roller cam
and mark
B
as shown in the figure, then set to the groove of disc
table.
1
two screws
(BVTP3
(BVTP3
×
8)
A
2
two brackets (BU)
3
step screw
4
disc table
A
11
11
SECTION 4
DIAGRAMS
4-1.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
(In addition to this, the necessary note is printed in each block)
(In addition to this, the necessary note is printed in each block)
Note on Printed Wiring Board:
•
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f
: internal component.
•
b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
2
: nonflammable resistor.
•
5
: fusible resistor.
•
C
: panel designation.
•
U
: B+ Line.
•
V
: B– Line.
•
H
: adjustment for repair.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
• Signal path.
F
: TUNER (FM/AM)
E
: PLAYBACK (DECK A)
d
: PLAYBACK (DECK B)
G
: RECORD
J
: CD PLAY (ANALOG OUT)
c
: CD PLAY (DIGITAL OUT)
N
: MIC INPUT
• Abbreviation
AUS
: Australian model
AR
: Argentine model
EA
: Saudi Arabia model
MY
: Malaysia model
MX
: Mexican model
SP
: Singapore model
Note:
The components identi-
fied by mark
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro
spécifié.
Ne les remplacer que par une
pièce portant le numéro
spécifié.
• Circuit Boards Location
PANEL FL board
TRANS board
SUB TRANS board
(LX5/LX30/LX50)
(LX5/LX30/LX50)
TUNER (FM/AM)
MAIN board
PA board
HEADPHONE board
TC-B board
CD-R board
FRONT INPUT board
CD-L board
TC-A board
MIC board
PANEL VR board
LEAF SW board
TABLE SENSOR board
BD board
AUDIO board
LED board
CD MOTOR board
•
Indication of transisitor.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
B
These are omitted.
C
E
Q
12
12
HCD-LX5/LX6/LX30/LX50
4-2.
PRINTED WIRING BOARD – BD Board –
•
See page 11 for Circuit Boards Location.
05
05
KSS-213D/Q-NP
19
)
(
)
(
)
(
TP(VC)
TP(RF)
TP(TE)
TP(FE1)
TP(FE)
TP
(AGCCON)
TP(GND)
21
21
31
31
,
,
21
21
31
31
,
,
• Semiconductor
Location
(Side A)
(Side A)
Ref. No.
Location
Q101
C-3
• Semiconductor
Location
(Side B)
(Side B)
Ref. No.
Location
IC101
C-2
IC102
B-1
IC103
B-1
(Page 19)
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