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2013B33-1

© 

2013.02

Model Name Using Similar Mechanism

NEW

CD Mechanism Type

CDM80BT-F4BD94-WOD

Base Unit Name

BU-F4BD94-WOD

Optical Pick-up Block Name

KSM-215CFP

•  HCD-LX20i is the amplifi er, CD player, tuner 

and iPod section in CMT-LX20i.

AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:

With 4 ohm loads, both channels driven, from 120   10,000 Hz; rated 25 watts 
per channel minimum RMS power, with no more than 10% total harmonic 
distortion from 250 milliwatts to rated output.

DIN power output (rated):
4 + 4 watts (4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 5 + 5 watts (4 ohms at 1 kHz, 
10% THD)

AUDIO IN (stereo mini jack): Voltage 775 mV, impedance 22 kilohms

PHONES (stereo mini jack): accepts headphones with an impedance of 
8 ohms or more
SPEAKER: accepts impedance of 4 ohms

System: Compact disc and digital audio system
Laser Diode Properties

Emission Duration: Continuous
Laser Output*: Less than 44.6μW
*

objective lens surface on the Optical Pick-up Block with 7mm aperture.

Frequency response: 20 Hz — 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB

FM stereo, FM/AM superheterodyne tuner
FM tuner section:

Tuning range:
87.5 — 108.0 MHz (100 kHz step)
Antenna: FM lead antenna
Intermediate frequency: 10.7 MHz

AM tuner section:

Tuning range:
530 —1,710 kHz (10 kHz step)
531 —1,710 kHz (9 kHz step)
Antenna: AM loop antenna
Intermediate frequency: 450 kHz

Compatible iPod models:

iPod touch 2nd

generation

iPod nano 4th 

generation

(video)

iPod touch 1st

generation

iPod nano 3rd

generation 

(video)

iPod classic

iPod nano 2nd

generation 

(aluminum)

iPod 5th

generation 

(video)

iPod nano 1st

generation

iPod 4th 

generation

(color display)

iPod 4th 

generation

iPod mini

Power requirements: 120 V AC, 60 Hz
Power consumption: 25 watts
Dimensions (w/h/d) (excl. speakers): Approx. 200 × 221 × 205 mm
Mass (excl. speakers): Approx. 2.2 kg

 iPod is a trademark of Apple Inc., registered in the U.S. 

and other countries.

 MPEG Layer-3 audio coding technology and patents 

licensed from Fraunhofer IIS and Thomson.

 All other trademarks and registered trademarks are of 

their respective holders. In this manual, 

TM

 and 

®

 marks 

are not specified.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

0  SUR  

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

 .............................................   3

 ..................................................................   5

3-1. Disassembly 

Flow 

...........................................................   7

3-2.  Panel (Back), Panel (Front) Block ..................................   7
3-3. MAIN 

Board 

...................................................................   8

3-4. PANEL 

Board 

.................................................................   8

3-5.  CD Mechanism Block (CDM80BT-F4BD94-WOD) .....   9
3-6. Belt 

(MOT) 

.....................................................................   9

3-7.  Base Unit (BU-F4BD94-WOD) .....................................   10

TEST  MODE 

 ............................................................   11

ADJUSTMENTS 

 ........................   13

6-1.  Block Diagram - CD, TUNER Section - ........................   15
6-2.  Block Diagram - MAIN Section - ...................................   16
6-3.  Printed Wiring Board - CD Board - ................................   18
6-4.  Schematic Diagram - CD Board - ...................................   19
6-5.  Printed Wiring Board - MAIN Board - ...........................   20
6-6.  Schematic Diagram - MAIN Board (1/3) - .....................   21
6-7.  Schematic Diagram - MAIN Board (2/3) - .....................   22
6-8.  Schematic Diagram - MAIN Board (3/3) - .....................   23
6-9.  Printed Wiring Boards - PANEL Section - .....................   24
6-10.  Schematic Diagram - PANEL Section - ..........................   25
6-11.  Printed Wiring Boards - AUDIO IN/OUT, KEY, 

POWER SUPPLY Section - ............................................   26

6-12.  Schematic Diagram - AUDIO IN/OUT, KEY, 

POWER SUPPLY Section - ............................................   27

7-1.  Panel (Back) Section .......................................................   33
7-2.  Panel (Front) Section ......................................................   34
7-3.  Stage (Top) Section .........................................................   35
7-4  MAIN Board Section ......................................................   36
7-5.  CD Mechanism Section 

(CDM80BT-F4BD94-WOD) ..........................................   37

7-6.  Base Unit Section (BU-F4BD94-WOD) ........................   38

  ..............................   39

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTE  OF  REPLACING  THE  DRIVER  BOARD
When the DRIVER board is damaged, exchange the entire 
CDM80BT ASSY.

RELEASING  THE  DISC  SLOT  LOCK
The disc slot lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1.  Press the [

?

/

1] button to turn the power on.

2.  Press the [FUNCTION +] button to select CD function.
3.  While pressing the [ENTER] button, press the [

Z] button for 

more 5 seconds.

4.  The message “UNLOCKED” is displayed on the liquid crystal 

display and the disc slot is unlocked.

Note: When “LOCKED” is displayed on the liquid crystal display, the slot 

lock is not released by turning power on/off with the [

?/1] button. 

Note: Please take out the CD mechanism block from a set refer to DISASSEMBLY (from Page 7).

NOTE  OF  REPLACING  IC453  ON THE  PANEL  BOARD
IC453 on the PANEL board has been changed in the midway of production.
Sheet (RM) is not installed in former type.
Sheet (RM) is installed in new type.
When replacing IC453 on the PANEL board, refer to the table below.

  Ref. No. 

Part No. 

Description

  Ref. No. 

Part No. 

Description

  IC453 

6-600-684-01  IC   NJL22H400B

  IC453 

6-600-766-01  IC   PNA4823M01S0 

 68 

4-159-924-01 SHEET 

(RM)