DOWNLOAD Sony HCD-GZX33D / HCD-GZX55D / HCD-GZX88D Service Manual ↓ Size: 6.28 MB | Pages: 86 in PDF or view online for FREE

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HCD-GZX33D HCD-GZX55D HCD-GZX88D
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86
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6.28 MB
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Service Manual
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Device
Audio
File
hcd-gzx33d-hcd-gzx55d-hcd-gzx88d.pdf
Date

Sony HCD-GZX33D / HCD-GZX55D / HCD-GZX88D Service Manual ▷ View online

SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
9-890-626-03
2014C80-1
© 
2014.03
Ver. 1.2  2014.03
•  HCD-GZX33D is the amplifi er, USB, DVD/CD player, 
Bluetooth, NFC and tuner section in MHC-GZX33D.
•  HCD-GZX55D is the amplifi er, USB, DVD/CD player, 
Bluetooth, NFC and tuner section in MHC-GZX55D.
•  HCD-GZX88D is the amplifi er, USB, DVD/CD player, 
Bluetooth, NFC and tuner section in MHC-GZX88D.
Photo: HCD-GZX88D
COMPACT DISC RECEIVER
HCD-GZX33D/GZX55D/
GZX88D
E Model
HCD-GZX33D/GZX55D/GZX88D
Malaysia Model
HCD-GZX33D/GZX55D
• Abbreviation
 
E4  
: African model
 
E12 
: 220 - 240 V AC area in E 
  
 
model
 
EA 
: Saudi Arabia model
 
MY 
: Malaysia model
 
SAF 
: South African model
DVD/CD Section
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM90-DVBU202//M
Optical Pick-up Name
CMS-S76RFS7G
,
,
,
– Continued on next page –
SPECIFICATIONS
Amplifi er section
The following are measured at AC 120 V – 240 V,
50/60 Hz
MHC-GZX88D
Front speaker
 
Power Output (rated):
 
350 W + 350 W (at 4 ohms, 1 kHz, 1% 
THD)
 
RMS output power (reference):
 
600 W + 600 W (per channel at 4 ohms, 
1 kHz)
Subwoofer
 
RMS output power (reference):
 
500 W + 500 W (per channel at 5 ohms,
100 Hz)
MHC-GZX55D
Front speaker
 
Power Output (rated):
 
350 W + 350 W (at 4 ohms, 1 kHz, 1% 
THD)
 
RMS output power (reference):
 
550 W + 550 W (per channel at 4 ohms, 
1 kHz)
Subwoofer
 
RMS output power (reference):
 
500 W (5 ohms, 100 Hz)
MHC-GZX33D
Front speaker
 
Power Output (rated):
 
350 W + 350 W (at 4 ohms, 1 kHz, 1% 
THD)
 
RMS output power (reference):
 
600 W + 600 W (per channel at 4 ohms, 
1 kHz)
Inputs
TV/SAT (AUDIO IN) L/R
 
Voltage 2 V, impedance 47 kilohms
PC/GAME (AUDIO IN) L/R
 
Voltage 2 V, impedance 47 kilohms
MIC
 
Sensitivity 1 mV, impedance 10 kilohms
 A (USB),   B (USB) port: Type A
Outputs
VIDEO OUT
 
Max. output level 1 Vp-p, unbalanced, 
Sync. negative load impedance 75 ohms
USB section
Supported bit rate
 
WMA: 48 kbps – 192 kbps, VBR, CBR
 
AAC: 48 kbps – 320 kbps, VBR, CBR
Sampling frequencies
 
WMA: 44.1 kHz
 
AAC: 44.1 kHz
Supported USB device
 
Mass Storage Class
Maximum current
 500 
mA
Disc/USB section
Supported bit rate
 MPEG1 
Layer-3:
 
32 kbps – 320 kbps, VBR
 MPEG2 
Layer-3:
 
8 kbps – 160 kbps, VBR
 MPEG1 
Layer-2:
 
32 kbps – 384 kbps, VBR
Sampling frequencies
 MPEG1 
Layer-3:
 
32 kHz/44.1 kHz/48 kHz
 MPEG2 
Layer-3:
 
16 kHz/22.05 kHz/24 kHz
 MPEG1 
Layer-2:
 
32 kHz/44.1 kHz/48 kHz
Xvid 
 
Video codec: Xvid video
 
Bit rate: 4.854 Mbps (MAX)
 
Resolution/Frame rate:  
720 × 480 30 fps 
720 × 576 25  fps
 
Audio codec: MP3
MPEG4
 
File format: MP4 File Format
 
Video codec:  
MPEG4 Simple Profi le (AVC is not com-
patible.)
 
Bit rate: 4 Mbps
 Resolution/Frame 
rate: 
720 × 576 30 fps
 
Audio codec: AAC-LC (HE-AAC is not 
compatible.)
 
DRM: Not compatible
Disc player section
System 
 
Compact disc and digital audio and video 
system
Laser Diode Properties 
Emission Duration: Continuous
 
Laser Output*: Less than 44.6 μW
*  This output is the value measurement at 
a distance of 200 mm from the objective 
lens surface on the Optical Pick-up Block 
with 7 mm aperture.
Frequency response
 
20 Hz – 20 kHz
Video color system format
 
NTSC and PAL
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
 
FM lead antenna
 
AM loop antenna
FM tuner section
Tuning range
 
87.5 MHz – 108.0 MHz 
 
(50 kHz step)
AM tuner section
Tuning range
 Saudi 
Arabia 
model:
 
531 kHz – 1,602 kHz (9 kHz step)
 Other 
models:
 
530 kHz – 1,610 kHz (10 kHz step)
 
531 kHz – 1,602 kHz (9 kHz step)
 is a trademark of DVD Format/Logo Licensing
Corporation.
“DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”, 
“DVD VIDEO”, and the “CD” logos are trademarks.
MPEG Layer-3 audio coding technology and patents 
licensed from Fraunhofer IIS and Thomson.
Windows Media is either a registered trademark or 
trademark of Microsoft Corporation in the United 
States and/or other countries.
This product is protected by certain intellectual 
property rights of Microsoft Corporation. Use 
or distribution of such technology outside of 
this product is prohibited without a license from 
Microsoft or an authorized Microsoft subsidiary.
“WALKMAN” and “WALKMAN” logo are 
registered trademarks of Sony Corporation.
This system incorporates Dolby* Digital. 
Manufactured under license from Dolby 
Laboratories. Dolby and the double-D symbol are 
trademarks of Dolby Laboratories.
The Bluetooth
®
 word mark and logos are registered 
trademarks owned by Bluetooth SIG, Inc. and any 
use of such marks by Sony Corporation is under 
license. Other trademarks and trade names are those 
of their respective owners.
The N Mark is a trademark or registered trademark 
of NFC Forum, Inc. in the United States and in other 
countries.
Android is a trademark of Google Inc.
THIS PRODUCT IS LICENSED UNDER 
THE MPEG-4 VISUAL PATENT PORTFOLIO 
LICENSE FOR THE PERSONAL AND NON-
COMMERCIAL USE OF A CONSUMER FOR
(i) ENCODING VIDEO IN COMPLIANCE WITH
  THE MPEG-4 VISUAL STANDARD (“MPEG-
 4 
VIDEO”)
AND/OR
(ii)DECODING MPEG-4 VIDEO THAT WAS 
  ENCODED BY A CONSUMER ENGAGED
  IN A PERSONAL AND NON-COMMERCIAL
  ACTIVITY AND/OR WAS OBTAINED FROM
 A VIDEO PROVIDER LICENSED TO 
 PROVIDE 
MPEG-4 
VIDEO.
NO LICENSE IS GRANTED OR SHALL BE 
IMPLIED FOR ANY OTHER USE. ADDITIONAL 
INFORMATION INCLUDING THAT RELATING
TO PROMOTIONAL, INTERNAL AND COM-
MERCIAL USES AND LICENSING MAY BE 
OBTAINED FROM MPEG LA, L.L.C.
HTTP://WWW.MPEGLA.COM
All other trademarks are trademarks of their 
respective owners.
HCD-GZX33D/GZX55D/GZX88D
2
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be 
damaged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 
repairing.
•  Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
•  Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous 
radiation exposure.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the 
following safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 
WT-540A. Follow the manufacturers’ instructions to use these 
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a 
VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)
1.5 k
Ω
0.15 
μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
This appliance is classified as a CLASS 1 
LASER product. This marking is located on 
the rear exterior.
Bluetooth section
Communication system
 
Bluetooth Standard version 3.0 + EDR
(Enhanced Date Rate)
Output
 
Bluetooth Standard Power Class 2
Maximum communication range
 
Line of sight approx. 10 m
1)
Frequency band
 
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
 
FHSS (Freq Hopping Spread Spectrum)
Compatible Bluetooth profiles
2)
 
A2DP (Advanced Audio Distribution Profile)
 
AVRCP 1.3 (Audio Video Remote Control
 Profile)
Supported codecs
 
SBC (Sub Band Codec)
 
AAC (Advanced Audio Coding)
1)
 The actual range will vary depending on factors such as obstacles between devices, 
magnetic fields around a micro-wave oven, static electricity, reception sensitivity, 
antenna’s performance, operating system, software application, etc.
2)
 Bluetooth standard profiles indicate the purpose of Bluetooth communication between 
devices.
General
Power requirements
 
AC 120 V – 240 V, 50/60 Hz
Power consumption
 
MHC-GZX88D: 350 W
 MHC-GZX55D: 
255 
W
 
MHC-GZX33D: 195 W
Dimensions (w/h/d) (excl. speakers) (Approx.)
 
270 mm × 363 mm × 364 mm
Mass (excl. speakers) (Approx.)
 5.2 
kg
Supplied accessories
 
Remote control (1)
 
R6 (Size AA) batteries (2)
 
FM lead/AM loop antenna (1)
 
Spacer (MHC-GZX88D only) (2)
 
Speaker pads (MHC-GZX88D only) (16)
 
Video cord (1)
Design and specifications are subject to change without notice.
HCD-GZX33D/GZX55D/GZX88D
3
TABLE  OF  CONTENTS
1. SERVICING 
NOTES
 ................................................  
4
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................   8
2-2.  Side-L Panel, Side-R Panel, Top Panel ...........................   9
2-3. Loading 
Panel 
.................................................................   9
2-4.  Front Panel Section .........................................................   10
2-5.  CD Mechanism Section (CDM90-DVBU202//M) .........   10
2-6. MB 
Board 
.......................................................................  11
2-7. Chassis 
Section 
...............................................................  11
2-8.  Service Optical Device, Wire (Flat Type) .......................   12
3. 
TEST  MODE
 .............................................................   13
4. 
ELECTRICAL  CHECK
 ..........................................   19
5. TROUBLESHOOTING
 ...........................................   20
6. DIAGRAMS
6-1.  Block Diagram - DVD/USB Section - ............................   27
6-2.  Block Diagram - MAIN Section - ...................................   28
6-3.  Block Diagram - AMP Section - .....................................   29
6-4.  Block Diagram - 
 
PANEL/POWER SUPPLY Section - ..............................   30
6-5.  Printed Wiring Board - 
 
MB Board (Component side) ..........................................   32
6-6.  Printed Wiring Board - 
 
MB Board (Conductor side) ...........................................   33
6-7.  Schematic Diagram - MB Board (1/9) - .........................   34
6-8.  Schematic Diagram - MB Board (2/9) - .........................   35
6-9.  Schematic Diagram - MB Board (3/9) - .........................   36
6-10.  Schematic Diagram - MB Board (4/9) - .........................   37
6-11.  Schematic Diagram - MB Board (5/9) - .........................   38
6-12.  Schematic Diagram - MB Board (6/9) - .........................   39
6-13.  Schematic Diagram - MB Board (7/9) - .........................   40
6-14.  Schematic Diagram - MB Board (8/9) - .........................   41
6-15.  Schematic Diagram - MB Board (9/9) - .........................   42
6-16.  Printed Wiring Board - STR Board - ..............................   43
6-17.  Schematic Diagram - STR Board - .................................   44
6-18.  Printed Wiring Board - DISPLAY Board ........................   45
6-19.  Schematic Diagram - DISPLAY Board - ........................   46
6-20.  Printed Wiring Board - MIC Board -  .............................   47
6-21.  Schematic Diagram - MIC Board - .................................   47
6-22.  Printed Wiring Board - VOLUME Board - .....................   48
6-23.  Schematic Diagram - VOLUME Board - .......................   48
6-24.  Printed Wiring Board - BASS BAZUCA Board - ..........   48
6-25.  Schematic Diagram - BASS BAZUCA Board - .............   48
7. 
EXPLODED  VIEWS
7-1.  Side Panel Section  .........................................................   62
7-2.  DC Fan, CDM90 Bracket Section  .................................   63
7-3.  Front Panel Section .........................................................   64
7-4. Chassis 
Section 
...............................................................  65
7-5.  CD Mechanism Section
(CDM90-DVBU202//M) ................................................   66
8. 
ELECTRICAL  PARTS  LIST
 ...............................   67
HCD-GZX33D/GZX55D/GZX88D
4
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
NOTE  OF  REPLACING  THE  IC502  AND  IC504  ON  
THE  MB  BOARD
IC502 and IC504 on the MB board cannot exchange with single. 
When these parts on the MB board are damaged, exchange the 
entire mounted board.
NOTE  OF  REPLACING  THE  IC100  ON  THE  MB  
BOARD
Once IC100 on the MB board is exchanged, perform “MODEL & 
DEST WRITE MODE” (refer page 15) before operating the set.
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1. Press 
[
\
/1
] button to turn the power on.
2.  Press the [DVD/CD] button to select DVD/CD function.
3.  While pressing the [
x
] button, press the [ENTER] button for 
more 5 seconds).
4.  The message “UNLOCKED” is displayed and the disc tray is 
unlocked.
Note: When 
LOCKED
 is displayed, the slot lock is not released by 
turning power on/off with the
 [
\
/1
]
 button.
MODEL  IDENTIFICATION
– Back Panel –
Model
Part No.
HCD-GZX88D
4-447-622-4[]
HCD-GZX55D
4-447-622-5[]
HCD-GZX33D
4-447-622-6[]
NOTES  ON  LASER DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
PART No.
Ver. 1.2
Page of 86
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Sony HCD-GZX33D / HCD-GZX55D / HCD-GZX88D Service Manual ▷ Download

  • DOWNLOAD Sony HCD-GZX33D / HCD-GZX55D / HCD-GZX88D Service Manual ↓ Size: 6.28 MB | Pages: 86 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony HCD-GZX33D / HCD-GZX55D / HCD-GZX88D in PDF for free, which will help you to disassemble, recover, fix and repair Sony HCD-GZX33D / HCD-GZX55D / HCD-GZX88D Audio. Information contained in Sony HCD-GZX33D / HCD-GZX55D / HCD-GZX88D Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.