Sony HCD-GZR777DA / MHC-GZR777DA Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-GZR777DA
DVD DECK RECEIVER
9-893-140-04
2012B33-1
©
2012.02
E Model
Ver. 1.3 2012.02
SPECIFICATIONS
• HCD-GZR777DA is the tuner, deck, DVD
and amplifi er section in MHC-GZR777DA.
DVD
Section
Section
Model Name Using Similar Mechanism
HCD-GZR777D
DVD Mechanism Type
CDM74HFVX-DVBU101
Optical Pick-up Name
KHM-313CAB
Tape Deck
Section
Section
Model Name Using Similar Mechanism
HCD-GZR777D
Tape Transport Mechanism Type
CFP42608
Amplifi er section
The following measured at AC 127 V, 220 V,
240 V, 50/60 Hz (Saudi Arabian model)
The following measured at AC 120 V, 220 V,
240 V, 50/60 Hz (Other models)
240 V, 50/60 Hz (Saudi Arabian model)
The following measured at AC 120 V, 220 V,
240 V, 50/60 Hz (Other models)
Power output (rated):
105 W + 105 W (at 6
, 1 kHz, 1%
THD)
RMS output power (reference):
RMS output power (reference):
210 W+ 210 W (per channel at 6
,
1
kHz)
Inputs
VIDEO/SAT VIDEO IN (phono jack):
1
1
Vp-p,
75
VIDEO/SAT AUDIO IN L/R (phono jacks):
voltage 250/450 mV, impedance
47
k
MIC (phone jack):
sensitivity 1 mV, impedance 10 k
Outputs
VIDEO OUT (phono jack):
max. output level 1 Vp-p, unbalanced,
Sync negative, load impedance 75
COMPONENT VIDEO OUT
Y: 1 Vp-p, 75
Pb: 0.7 Vp-p, 75
Pr: 0.7 Vp-p, 75
DVD DIGITAL OUT (Square optical
connector jack, rear panel):
connector jack, rear panel):
Wavelength 650 nm
PHONES (stereo mini jack):
accepts headphones of 8
or more
SUBWOOFER OUT:
Voltage 1 V, impedance 1 k
FRONT SPEAKERS:
Use only the supplied speaker
SS-GZR777D.
(USB) port: Type A
Maximum
current:
500
mA
Disc player section
System:
Compact disc and digital audio and
video
system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6
W
* This output is the value measurement
at a distance of 200mm from the
objective lens surface on the Optical
Pick-up Block with 7mm aperture.
– Continued on next page –
HCD-GZR777DA
2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
• Abbreviation
E3
E3
: 240V AC area in E model
E4
: 110 – 120V/220 – 240V AC area in E model
EA
: Saudi Arabia model
PH
: Philippines model
SP
: Singapore model
TH :
Thai
model
Model
Part No.
EA model
4-170-038-2[]
E3 model
4-278-556-0[]
E4 model
4-278-556-1[]
SP model
4-278-556-4[]
TH model
4-278-556-5[]
PH model
4-278-556-6[]
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
Parts No.
Frequency response
DVD (PCM 48 kHz): 2 Hz – 22 kHz
(±1
dB)
CD: 2 Hz – 20 kHz (±0.5 dB)
Video color system format:
NTSC and PAL
Tape deck section
Recording system:
4-track 2-channel, stereo
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range:
FM tuner section
Tuning range:
87.5 MHz – 108.0 MHz (50 kHz step)
Antenna:
FM lead antenna
Antenna terminals:
75
75
Ω unbalanced
Intermediate frequency:
10.7
10.7
MHz
AM tuner section
Tuning range
Saudi
Tuning range
Saudi
Arabian
model:
531 kHz – 1,602 kHz (9 kHz step)
Other
models:
531 kHz – 1,602 kHz (9 kHz step)
530 kHz – 1,610 kHz (10 kHz step)
Antenna:
AM loop antenna
Antenna terminals:
External antenna terminal
Intermediate frequency:
450
450
kHz
General
Power requirements
Thai
Thai
model:
AC 220 V, 50/60 Hz
Saudi
Arabian
model:
AC 120 V – 127 V, 220 V, 230 V – 240 V,
50/60 Hz, adjustable with voltage selector
Other
models:
AC 120 V, 220 V, 230 V – 240 V,
50/60 Hz, adjustable with voltage
selector
Power consumption:
160
Power consumption:
160
W
Dimensions (W/H/D) (excl. speakers):
Approx. 280 mm × 325 mm ×
430
mm
Mass (excl. speakers):
Approx. 11.6 kg
Supplied accessories:
Remote Commander (1)
AM loop antenna (1)
FM lead antenna (1)
Video cord (1)
Speaker pads (8)
Microphone (1) (Philippine model
only)
R6 (Size AA) batteries (2)
Design and specifi cations are subject to
change without notice.
change without notice.
Ver. 1.1
HCD-GZR777DA
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
HCD-GZR777DA
4
1.
SERVICING NOTES
............................................. 5
2. DISASSEMBLY
2-1. Case (Side-L), Case (Side-R) .......................................... 8
2-2. Top Panel Section ........................................................... 8
2-3. Loading
2-2. Top Panel Section ........................................................... 8
2-3. Loading
Panel
................................................................. 9
2-4. Chassis
............................................................................ 9
2-5. Front Panel Section ......................................................... 10
2-6. Back Panel Section ......................................................... 10
2-7. MAIN Board ................................................................... 11
2-8. POWER AMP Board ...................................................... 11
2-9. DVD Mechanism Deck, Tuner (TM901) ........................ 12
2-10. VOL-LED Board ............................................................ 12
2-11. LEFT Board, RIGHT Board, FRONT Board ................. 13
2-12. FL Board, MIC Board ..................................................... 13
2-13. TC-AMP Board ............................................................... 14
2-14. Tape Mechanism Deck .................................................... 14
2-15. Holder (TC) ..................................................................... 15
2-16. DRIVER Board, SW Board ............................................ 15
2-17. SENSOR Board .............................................................. 16
2-18. MOTOR (TB) Board....................................................... 16
2-19. MOTOR (LD) Board ...................................................... 17
2-20. Chassis ............................................................................ 17
2-21. DMB19 Board ................................................................. 18
2-22. Base Unit ......................................................................... 18
2-23. Optical Pick-up ............................................................... 19
2-6. Back Panel Section ......................................................... 10
2-7. MAIN Board ................................................................... 11
2-8. POWER AMP Board ...................................................... 11
2-9. DVD Mechanism Deck, Tuner (TM901) ........................ 12
2-10. VOL-LED Board ............................................................ 12
2-11. LEFT Board, RIGHT Board, FRONT Board ................. 13
2-12. FL Board, MIC Board ..................................................... 13
2-13. TC-AMP Board ............................................................... 14
2-14. Tape Mechanism Deck .................................................... 14
2-15. Holder (TC) ..................................................................... 15
2-16. DRIVER Board, SW Board ............................................ 15
2-17. SENSOR Board .............................................................. 16
2-18. MOTOR (TB) Board....................................................... 16
2-19. MOTOR (LD) Board ...................................................... 17
2-20. Chassis ............................................................................ 17
2-21. DMB19 Board ................................................................. 18
2-22. Base Unit ......................................................................... 18
2-23. Optical Pick-up ............................................................... 19
3.
TEST MODE
............................................................ 20
4. MECHANICAL
ADJUSTMENTS
...................... 24
5. ELECTRICAL
ADJUSTMENTS
........................ 25
6. DIAGRAMS
6-1. Block Diagram –RF/Servo Section– ............................... 29
6-2. Block Diagram –Video Section– .................................... 30
6-3. Block Diagram –Main Section– ..................................... 31
6-4. Block Diagram –Audio Section– .................................... 32
6-5. Block Diagram –Display/Power Section– ...................... 33
6-2. Block Diagram –Video Section– .................................... 30
6-3. Block Diagram –Main Section– ..................................... 31
6-4. Block Diagram –Audio Section– .................................... 32
6-5. Block Diagram –Display/Power Section– ...................... 33
TABLE OF CONTENTS
6-6. Printed Wiring Boards –Driver Section– ........................ 35
6-7. Schematic Diagram –Driver Section– ............................ 36
6-8. Printed Wiring Board –DMB19 Section (1/2)– .............. 37
6-9. Printed Wiring Board –DMB19 Section (2/2)– .............. 38
6-10. Schematic Diagram –DMB19 Section (1/4)– ................. 39
6-11. Schematic Diagram –DMB19 Section (2/4)– ................. 40
6-12. Schematic Diagram –DMB19 Section (3/4)– ................. 41
6-13. Schematic Diagram –DMB19 Section (4/4)– ................. 42
6-14. Printed Wiring Board –Main Section– ............................ 43
6-15. Schematic Diagram –Main Section (1/3)– ...................... 44
6-16. Schematic Diagram –Main Section (2/3)– ...................... 45
6-17. Schematic Diagram –Main Section (3/3)– ...................... 46
6-18. Printed Wiring Boards –Mic/HP/USB Section– ............. 47
6-19. Schematic Diagram –Mic/HP/USB Section– ................. 48
6-20. Printed Wiring Board –TC-Amp Section– ...................... 49
6-21. Schematic Diagram –TC-Amp Section– ........................ 50
6-22. Printed Wiring Board –Video Section–........................... 51
6-23. Schematic Diagram –Video Section– ............................. 52
6-24. Printed Wiring Boards –Front Section– .......................... 53
6-25. Schematic Diagram –Front Section– .............................. 54
6-26. Printed Wiring Boards –Panel Section– .......................... 55
6-27. Schematic Diagram –Panel Section– .............................. 56
6-28. Printed Wiring Board –FL Section–................................ 57
6-29. Schematic Diagram –FL Section– .................................. 58
6-30. Printed Wiring Board –Power Amp Section– ................. 59
6-31. Schematic Diagram –Power Amp Section– .................... 60
6-32. Printed Wiring Boards –Trans Section–.......................... 61
6-33. Schematic Diagram –Trans Section– .............................. 62
6-7. Schematic Diagram –Driver Section– ............................ 36
6-8. Printed Wiring Board –DMB19 Section (1/2)– .............. 37
6-9. Printed Wiring Board –DMB19 Section (2/2)– .............. 38
6-10. Schematic Diagram –DMB19 Section (1/4)– ................. 39
6-11. Schematic Diagram –DMB19 Section (2/4)– ................. 40
6-12. Schematic Diagram –DMB19 Section (3/4)– ................. 41
6-13. Schematic Diagram –DMB19 Section (4/4)– ................. 42
6-14. Printed Wiring Board –Main Section– ............................ 43
6-15. Schematic Diagram –Main Section (1/3)– ...................... 44
6-16. Schematic Diagram –Main Section (2/3)– ...................... 45
6-17. Schematic Diagram –Main Section (3/3)– ...................... 46
6-18. Printed Wiring Boards –Mic/HP/USB Section– ............. 47
6-19. Schematic Diagram –Mic/HP/USB Section– ................. 48
6-20. Printed Wiring Board –TC-Amp Section– ...................... 49
6-21. Schematic Diagram –TC-Amp Section– ........................ 50
6-22. Printed Wiring Board –Video Section–........................... 51
6-23. Schematic Diagram –Video Section– ............................. 52
6-24. Printed Wiring Boards –Front Section– .......................... 53
6-25. Schematic Diagram –Front Section– .............................. 54
6-26. Printed Wiring Boards –Panel Section– .......................... 55
6-27. Schematic Diagram –Panel Section– .............................. 56
6-28. Printed Wiring Board –FL Section–................................ 57
6-29. Schematic Diagram –FL Section– .................................. 58
6-30. Printed Wiring Board –Power Amp Section– ................. 59
6-31. Schematic Diagram –Power Amp Section– .................... 60
6-32. Printed Wiring Boards –Trans Section–.......................... 61
6-33. Schematic Diagram –Trans Section– .............................. 62
7.
EXPLODED VIEWS
7-1. Overall
Section
............................................................... 75
7-2. Front Panel Section-1 ...................................................... 76
7-3. Front Panel Section-2 ...................................................... 77
7-4. Top Panel Section ........................................................... 78
7-5. Chassis
7-3. Front Panel Section-2 ...................................................... 77
7-4. Top Panel Section ........................................................... 78
7-5. Chassis
Section
............................................................... 79
7-6. DVD Mechanism Deck Section-1 .................................. 80
7-7. DVD Mechanism Deck Section-2 .................................. 81
7-7. DVD Mechanism Deck Section-2 .................................. 81
8.
ELECTRICAL PARTS LIST
.............................. 82
