Sony HCD-GZR5D / MHC-GZR5D Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-GZR5D
DVD DECK RECEIVER
9-889-161-02
2008G04-1
©
2008.07
UK Model
E Model
Russian Model
Ver. 1.1 2008.07
• HCD-GZR5D is the
Amplifi er,
DVD player, tape deck, and tuner
section in MHC-GZR5D.
section in MHC-GZR5D.
DVD
Section
Section
Model Name Using Similar Mechanism
HCD-GNZ333D/GNZ444D
DVD Mechanism Type
CDM74HF-DVBU101
Optical Pick-up Name
KHM-313CAB/C2RP
TAPE
Section
Section
Model Name Using Similar Machanism
HCD-GT444
Tape Transport Mechanism Type
TCM-J1 or
CS-21SC-900TP
CS-21SC-900TP
SPECIFICATIONS
Amplifi er Section
The following are measured at AC 230 V, 50/60 Hz
(European and Russian models)
The following measured at AC 127, 240 V, 50/60 Hz
(Saudi Arabian model)
The following measured at AC 120, 220, 240 V, 50/60 Hz (Other models)
Power output (rated): 72 W + 72 W
(6
(European and Russian models)
The following measured at AC 127, 240 V, 50/60 Hz
(Saudi Arabian model)
The following measured at AC 120, 220, 240 V, 50/60 Hz (Other models)
Power output (rated): 72 W + 72 W
(6
Ω, 1 kHz, 1% THD)
RMS output power (reference)
120 W + 120 W
(per channel at 6
Ω, 1 kHz, 10% THD)
Inputs
AUDIO IN (stereo mini jack):
AUDIO IN (stereo mini jack):
Voltage 700 mV, impedance 47 kilohms
MIC (phone jack):
Sensitivity 2 mV, impedance 10 kilohms
Outputs
VIDEO OUT (phone jack):
VIDEO OUT (phone jack):
Max. output level 1 Vp-p, unbalanced, Sync.
negative, load impedance 75 ohms
DVD DIGTAL OUT (Square optical connector jack, rear panel):
Wavelength 650 nm
PHONES (stereo mini jack):
accepts headphones of 8 ohms or more
USB section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3): 32 – 320 kbps
WMA: 48 – 192 kbps
AAC: 48 – 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3): 32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
(USB) port:
Maximum current: 500 mA
Disc player section
System :
System :
Compact disc and digital audio and video system
Laser Diode Properties
Emission duration: Continuous Laser Output*:
Less than 44.6
μW
*This output is the value measurement at a distance
of 200 mm from the objective lens surface on the
Optical Pick-up Block with 7 mm aperture.
Frequency response
DVD (PCM 48 kHz): 2 Hz – 22 kHz (±1 dB)
CD: 2 Hz – 20 kHz (±0.5 dB)
Video color system format
European and Russian models: PAL
Other models: NTSC and PAL
Tape deck section
Recording system:
Recording system:
4-track 2-channel stereo
– Continued on next page –
HCD-GZR5D
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range:
Tuning range:
87.5 – 108.0 MHz (50 kHz step)
Antenna:
FM lead antenna
Antenna terminals:
75 ohms unbalanced
Intermediate frequency: 10.7 MHz
AM tuner section
Tuning range:
Tuning range:
European, Russian and Saudi Arabian models:
531 – 1,602 kHz (9 kHz step)
Other
models:
531 – 1,602 kHz (with 9 kHz tuning interval)
530 – 1,610 kHz (with 10 kHz tuning interval)
Antenna:
AM loop antenna
Antenna terminals:
External antenna terminal
Intermediate frequency: 450 kHz
General
Power requirements
European and Russian models:
Power requirements
European and Russian models:
AC 230 V, 50/60 Hz
Saudi Arabian model:
AC 120 – 127, 220 – 240 V
50/60 Hz, adjustable with voltage selector
Thai model:
AC 220 V, 50/60 Hz
Other models:
AC 120, 220, 230 – 240 V, 50/60 Hz, adjustable
with voltage selector
Power consumption:
190 W
Dimensions (w/h/d) (excl. speakers):
Approx. 200 × 306 × 415 mm
Mass (excl. speakers): Approx. 7.9 kg
Design and specifi cations are subject to change without notice.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveform is output several times.
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveform is output several times.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
Ver. 1.1
HCD-GZR5D
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
• Abbreviation
E3
E3
: 240V AC area in E model
E12
: 220 – 240V AC area in E model
E15
: Iran model
EA
: Saudi Arabia model
PH
: Philippines model
RU :
Russian
model
SP
: Singapore model
TH :
Thai
model
Model
Part No.
SP model
3-289-544-0
[]
EA model
3-289-544-1
[]
RU model
3-289-544-2
[]
E3, E15 models
3-289-544-3
[]
PH model
3-289-544-4
[]
TH model
3-289-544-5
[]
E12 model
3-289-544-6
[]
UK model
3-289-544-7
[]
MODEL IDENTIFICATION
-Back Panel-
-Back Panel-
Tape Deck Name
Tape Deck Part No.
Belt Part No.
TCM-J1
A-1527-851-A
2-670-389-01 BELT (1)
3-214-817-01 BELT (FR)
3-214-817-01 BELT (FR)
CS-21SC-900TP
1-797-575-11
2-688-621-01 BELT (R/F)
2-688-622-01 BELT (MAIN)
2-688-622-01 BELT (MAIN)
HOW TO DISTINGUISH TAPE MECHANISM DECK
Two kinds of tape mechanism decks installed by this set exist.
Two kinds of tape mechanism decks installed by this set exist.
Please do the repair exchange after confi rming which tape mechanism deck set of the repair according to how to distinguish the fi gure
below.
below.
motor
Metal part: TCM-J1
Mold part: CS-21SC-900TP
Mold part: CS-21SC-900TP
tape deck
Parts No.
Ver. 1.1
HCD-GZR5D
4
1.
SERVICING NOTES
.............................................. 5
1-1. CDM Service Position .................................................... 5
1-2. Opening The Try Manual ................................................ 5
1-3. Note for Handling The BU ............................................. 6
1-4. Arrangement of The Coad .............................................. 6
1-2. Opening The Try Manual ................................................ 5
1-3. Note for Handling The BU ............................................. 6
1-4. Arrangement of The Coad .............................................. 6
2. GENERAL
Guide to Parts and Controls ............................................ 7
3. DISASSEMBLY
3-1. Side Panel (R), Side Panel (L) ........................................ 15
3-2. Top Panel Section ........................................................... 15
3-3. Door
3-2. Top Panel Section ........................................................... 15
3-3. Door
(CD)
....................................................................... 16
3-4. Front Panel Section ........................................................ 16
3-5. Main
3-5. Main
Board
..................................................................... 17
3-6. DC
Fan
............................................................................ 17
3-7. Rear
Panel
....................................................................... 18
3-8. AMP
Board
..................................................................... 18
3-9. PT
Board
......................................................................... 19
3-10. Cover (CDM) .................................................................. 19
3-11. DVD Mechanism Section ............................................... 20
3-12. DMB18 Board ................................................................. 20
3-13. Optical Pick-up ............................................................... 21
3-14. Belt (DLM3A) ................................................................ 21
3-15. Mechanism Deck ............................................................ 22
3-16. Belt (Main), Belt (R/F) ................................................... 22
3-11. DVD Mechanism Section ............................................... 20
3-12. DMB18 Board ................................................................. 20
3-13. Optical Pick-up ............................................................... 21
3-14. Belt (DLM3A) ................................................................ 21
3-15. Mechanism Deck ............................................................ 22
3-16. Belt (Main), Belt (R/F) ................................................... 22
4.
TEST MODE ....................................................... 23
5. MECHANICAL
ADJUSTMENTS ..................... 27
6. ELECTRICAL
ADJUSTMENTS ...................... 27
7. DIAGRAMS
7-1. Block Diagram – RF/Servo Section – ............................. 31
7-2. Block Diagram – Video Section – .................................. 32
7-3. Block Diagram – Main Section – ................................... 33
7-4. Block Diagram – Display Section – ............................... 34
7-2. Block Diagram – Video Section – .................................. 32
7-3. Block Diagram – Main Section – ................................... 33
7-4. Block Diagram – Display Section – ............................... 34
TABLE OF CONTENTS
7-5. Circuit Boards Location .................................................. 36
7-6. Printed Wiring Board – Main Section – .......................... 37
7-7. Schematic Diagram – Main Section (1/3) – .................... 38
7-8. Schematic Diagram – Main Section (2/3) – .................... 39
7-9. Schematic Diagram – Main Section (3/3) – .................... 40
7-10. Schematic Diagram – DMB Section (1/5) – ................... 41
7-11. Schematic Diagram – DMB Section (2/5) – ................... 42
7-12. Schematic Diagram – DMB Section (3/5) – ................... 43
7-13. Schematic Diagram – DMB Section (4/5) – ................... 44
7-14. Schematic Diagram – DMB Section (5/5) – ................... 45
7-15. Printed Wiring Board – DMB Section (1/2) – ................ 46
7-16. Printed Wiring Board – DMB Section (2/2) – ................ 47
7-17. Printed Wiring Board – Deck Section – .......................... 48
7-18. Schematic Diagram – Deck Section – ............................ 49
7-19. Printed Wiring Board – AMP Section – .......................... 50
7-20. Schematic Diagram – AMP Section –............................. 51
7-21. Printed Wiring Boards – USB Section – ......................... 52
7-22. Schematic Diagram – USB Section – ............................. 53
7-23. Printed Wiring Board – Panel Section – ......................... 54
7-24. Schematic Diagram – Panel Section – ............................ 55
7-25. Printed Wiring Boards – Key Section – .......................... 56
7-26. Schematic Diagram – Key Section – .............................. 57
7-27. Printed Wiring Boards – MIC/Jack Section – ................. 58
7-28. Schematic Diagram – MIC Section – ............................. 59
7-29. Schematic Diagram – Jack Section – .............................. 60
7-30. Printed Wiring Board – PT Section – ............................. 61
7-31. Schematic Diagram – PT Section – ................................ 62
7-32. Schematic Diagram – Reg Section – .............................. 63
7-6. Printed Wiring Board – Main Section – .......................... 37
7-7. Schematic Diagram – Main Section (1/3) – .................... 38
7-8. Schematic Diagram – Main Section (2/3) – .................... 39
7-9. Schematic Diagram – Main Section (3/3) – .................... 40
7-10. Schematic Diagram – DMB Section (1/5) – ................... 41
7-11. Schematic Diagram – DMB Section (2/5) – ................... 42
7-12. Schematic Diagram – DMB Section (3/5) – ................... 43
7-13. Schematic Diagram – DMB Section (4/5) – ................... 44
7-14. Schematic Diagram – DMB Section (5/5) – ................... 45
7-15. Printed Wiring Board – DMB Section (1/2) – ................ 46
7-16. Printed Wiring Board – DMB Section (2/2) – ................ 47
7-17. Printed Wiring Board – Deck Section – .......................... 48
7-18. Schematic Diagram – Deck Section – ............................ 49
7-19. Printed Wiring Board – AMP Section – .......................... 50
7-20. Schematic Diagram – AMP Section –............................. 51
7-21. Printed Wiring Boards – USB Section – ......................... 52
7-22. Schematic Diagram – USB Section – ............................. 53
7-23. Printed Wiring Board – Panel Section – ......................... 54
7-24. Schematic Diagram – Panel Section – ............................ 55
7-25. Printed Wiring Boards – Key Section – .......................... 56
7-26. Schematic Diagram – Key Section – .............................. 57
7-27. Printed Wiring Boards – MIC/Jack Section – ................. 58
7-28. Schematic Diagram – MIC Section – ............................. 59
7-29. Schematic Diagram – Jack Section – .............................. 60
7-30. Printed Wiring Board – PT Section – ............................. 61
7-31. Schematic Diagram – PT Section – ................................ 62
7-32. Schematic Diagram – Reg Section – .............................. 63
8.
EXPLODED VIEWS
8-1. Overall
Section
............................................................... 78
8-2. Front Panel Section ......................................................... 79
8-3. Main Board Section ........................................................ 80
8-4. Rear Panel Section .......................................................... 81
8-5. Chassis
8-3. Main Board Section ........................................................ 80
8-4. Rear Panel Section .......................................................... 81
8-5. Chassis
Section
............................................................... 82
8-6. Top Panel Section ........................................................... 83
8-7. DVD Mechanism Deck Section ...................................... 84
8-7. DVD Mechanism Deck Section ...................................... 84
9.
ELECTRICAL PARTS LIST ............................ 85