Sony HCD-GZR33D / HCD-LCD7DI / LBT-LCD7DI / MHCGZR33DI Service Manual ▷ View online
HCD-GZR33D/LCD7Di
HCD-GZR33D/LCD7Di
33
33
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• 2 : Nonfl ammable resistor.
• C : Panel designation.
• C : Panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M
Ω).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F :
F :
AUDIO
f :
TUNER
L :
VIDEO
g : COMPONENT VIDEO
E :
E :
iPod
J
: DVD (AUDIO)
c : DVD (RF)
I : DVD (DIGITAL)
N :
I : DVD (DIGITAL)
N :
USB
• Abbreviation
AUS :
AUS :
Australian
model
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
•
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Abbreviation
AUS :
AUS :
Australian
model
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
• Waveforms
– DMB19 Board –
– LCD CTRL Board –
2
IC101 ol (CVBS)
1
IC101 9 (XTALI)
3
IC101 <z/x (SY/Y/G)
500 mV/DIV, 20 μsec/DIV
500 mV/DIV, 20 nsec/DIV
500 mV/DIV, 20 μsec/DIV
5
IC101 <z/v (CR/R)
4
IC101 <z/c (SC/CB/B)
6
IC101 <zxb (RFIP)
500 mV/DIV, 20 μsec/DIV
500 mV/DIV, 20 μsec/DIV
200 mV/DIV, 100 nsec/DIV
0.9 Vp-p
27 MHz
1 Vp-p
H
0.3 Vp-p
H
0.5 Vp-p
H
0.5 Vp-p
H
700 mVp-p
1
IC002 tf (XOUT)
1 V/DIV, 50 nsec/DIV
2.2 Vp-p
27 MHz
Note:
The components identi-
fi
The components identi-
fi
ed by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specifi ed.
cal for safety.
Replace only with part
number specifi ed.
Note:
Les composants identifi és
par une marque 0 sont
critiques pour la sécurité.
Ne les remplacer que par
une pièce portant le nu-
méro spécifi é.
Les composants identifi és
par une marque 0 sont
critiques pour la sécurité.
Ne les remplacer que par
une pièce portant le nu-
méro spécifi é.
2
IC501 og (X1)
1
IC501 os (XT1)
0.5 V/DIV, 20 nsec/DIV
0.5 V/DIV, 20 μsec/DIV
1.6 Vp-p
32.768 kHz
0.7 Vp-p
20 MHz
– MAIN Board –
– IP Board –
3
IC1007 qa (XOUT)
1 V/DIV, 0.1 μsec/DIV
1
IC1005 5
(Except AEP model)
1 V/DIV, 50 nsec/DIV
2
IC1005 7
(HCD-GZR33D)
1 V/DIV, 50 nsec/DIV
3.6 Vp-p
5 MHz
4.8 Vp-p
14.31818 MHz
4.6 Vp-p
17.734475 MHz
HCD-GZR33D/LCD7Di
HCD-GZR33D/LCD7Di
34
34
1
A
B
C
D
E
F
G
H
2
3
4
5
6
7
8
9
10
11
12
13
14
(DISC TRAY ADDRESS DETECT)
1
2
1
4
3
9
1
9
1
4
1
2
1
2
B
C
E
(TABLE)
(LOADING)
CN751
CLOSE OPEN
IC731
CN731
CN741
M741
CN742
CN721
M751
MAIN
BOARD
CN641
A
C715
C731
C735
C736
R701
R711
R731
R721
R722
R723
R736
R732
R733
R734
D701
D71
1
C751
IC712
IC701
CN704
C737
R713
R712
C741
R702
JW702
JW703
JW704
JW705
JW706
JW707
JW708
JW711
CN703
CN702
CN705
R751
C752
JW712
JW701
JW709
JW710
JW713
JW714
RE701
RE701
CN711
CN701
Q731
S751
(OPEN/CLOSE DETECT)
S751
5-7. PRINTED WIRING BOARDS – DRIVER Section –
• See page 26 for Circuit Boards Location.
(Page 42)
•
: Uses unleaded solder.
HCD-GZR33D/LCD7Di
HCD-GZR33D/LCD7Di
35
35
IC B/D
IC B/D
Ĺ
R751
C752
CN705
CN704
CN721
CN751
C751
IC701
IC712
R701
R713
R711
R723
R721
R722
C735
C736
C737
R736
R733
R731
C731
Q731
C741
CN703
IC731
CN731
CN741
CN742
C715
R702
R712
R732
R734
D711
M751
M741
S751
CN701
D701
CN702
CN711
RE701
5-8. SCHEMATIC DIAGRAM – DRIVER Section –
• See page 67 for IC Block Diagrams.
(Page 43)
HCD-GZR33D/LCD7Di
HCD-GZR33D/LCD7Di
36
36
1
A
B
C
D
E
F
G
H
I
2
3
4
5
6
7
8
9
10
11
IC101
IC104
1
7
1
9
1
3
1
1
28
54
27
1
32
33
96
128
97
65
64
9
1
4
2
24
1
23
1
6
1
7
1
6
C1504
C1510
CN201
RED
GRY
GRY
GRY
GRY
GRY
R
111
0
CN4602
R230
R1114
R231
R232
CN601
R1121
R1123
R1123
C4608
R246
R247
JL001
JL002
JL003
JL004
JL005
JL006
C216
JL007
C217
C218
CL105
CL106
C602
CL107
C603
CL108
C604
CL109
JL201
JL202
JL203
JL010
C220
JL205
JL012
JL206
JL014
R4601
JL016
JL017
C611
JL210
JL211
JL212
JL213
JL214
JL215
R1151
R1152
C620
C621
C622
C623
FB1264
FB1265
R1
168
D001
D002
D003
D004
FB1284
FB1285
FB1286
R1187
RB105
ET001
RB106
ET002
RB107
ET003
RB108
ET004
R
B111
RB1
12
RB1
13
RB1
14
RB1
15
JL1201
JL1202
JL1203
JL1204
JL1205
JL1206
JL1207
JL1208
JL1209
JL1210
JL1211
JL1212
JL1213
JL1214
JL1216
JL1218
JL1220
R102
R103
R107
R114
CN101
CN105
C101
C105
R142
C106
X101
C112
C1
13
C1
18
R156
C124
CL206
CL207
CL208
JL113
JL114
JL115
CL213
R1249
R1257
R1258
R1259
R1260
R1263
FB1266
C152
C153
R1269
R191
R192
R193
R195
R197
R198
R1271
R1270
C160
R1276
R1277
FB4835
FB4836
R1281
R1282
R1283
JL1101
JL1102
JL1105
JL1106
JL1107
JL1108
C190
JL1110
JL1111
JL1112
JL1113
JL1114
JL1115
JL1116
JL1117
CL1138
JL1118
CL1139
JL1119
CL1
140
JL1120
CL1141
JL1121
CL1142
JL1122
JL1123
JL1124
CL1146
CL1147
CL1148
CL1149
CN1103
CN1
104
CN1105
CN1106
CL1
150
CL1151
CL1152
OPTICAL
PICK-UP
BLOCK
DMB19 BOARD
(SIDE A)
(SIDE A)
12
(12)
1-878-221-
F
VIDEO
BOARD
CN1500
CN1500
B
MAIN BOARD
CN504
G
VIDEO BOARD
CN1503
C
MAIN BOARD
CN191
D
MAIN BOARD
CN951
E
MIC BOARD
CN706
FOR
LINE-JIG
JL1
131
JL1
132
JL1
133
JL1
134
5-9. PRINTED WIRING BOARD – DMB19 Section (1/2) –
•
: Uses unleaded solder.
• See page 26 for Circuit Boards Location.
(Page 42)
(Page 42)
(Page 52)
(Page 52)
(Page 42)
(Page 46)
Click on the first or last page to see other HCD-GZR33D / HCD-LCD7DI / LBT-LCD7DI / MHCGZR33DI service manuals if exist.