Sony HCD-GTZ4 / HCD-GTZ4I / HCD-GTZ5 / LBT-GTZ4I / MHC-GTZ4 / MHC-GTZ4I / MHC-GTZ5 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-GTZ4/GTZ4i/GTZ5
SPECIFICATIONS
COMPACT DISC RECEIVER
9-889-503-03
2012F33-1
©
2012.06
US Model
AEP Model
Australian Model
HCD-GTZ4i
E Model
HCD-GTZ4/GTZ5
Ver. 1.2 2012.06
• HCD-GTZ4 is the amplifi er, USB, Disc player, tuner and
iPod section in MHC-GTZ4.
• HCD-GTZ4i is the amplifi er, USB, Disc player, tuner and
iPod section in LBT-GTZ4i, MHC-GTZ4i.
• HCD-GTZ5 is the amplifi er, USB, Disc player, tuner and
iPod section in MHC-GTZ5.
Photo: HCD-GTZ5
Model Name Using Similar Mechanism
NEW
Mechanism Type
CDM88B-DVBU101
Optical Pick-up Block Name
KHM-313CAB
“WALKMAN” and “WALKMAN”
logo are registered trademarks of
Sony Corporation.
logo are registered trademarks of
Sony Corporation.
MICROVAULT is a trademark of
Sony Corporation.
Sony Corporation.
MPEG Layer-3 audio coding technol-
ogy and patents licensed from Fraun-
hofer IIS and Thomson.
ogy and patents licensed from Fraun-
hofer IIS and Thomson.
Windows Media is a registered trade-
mark of Microsoft Corporation in the
United States and/or other countries.
mark of Microsoft Corporation in the
United States and/or other countries.
“Memory Stick” is a trademark of
Sony Corporation.
Sony Corporation.
iPod is a trademark of Apple Inc., reg-
istered in the U.S. and other countries.
istered in the U.S. and other countries.
USB section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32 – 320 kbps, VBR
WMA: 48 – 192 kbps
AAC: 48 – 320 kbps
32 – 320 kbps, VBR
WMA: 48 – 192 kbps
AAC: 48 – 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
Transfer speed
Full-Speed
Supported USB device
Mass Storage Class
Maximum current
500 mA
Disc player section
System
Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6
Laser Output*: Less than 44.6
PW
* This output is the value measurement at a distance of
200 mm from the objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
Pick-up Block with 7 mm aperture.
Frequency response
20 Hz – 20 kHz
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 88 dB
Amplifier section
HCD-GTZ5
Front speaker
Power output (rated): 110 W + 110 W
(at 6
(at 6
:, 1 kHz, 1% THD)
RMS output power (reference):
200 W + 200 W (per channel at 6
200 W + 200 W (per channel at 6
:, 1 kHz, 10% THD)
Subwoofer
RMS output power (reference): 200 W
(at 6
(at 6
:, 100 Hz, 10% THD)
HCD-GTZ4 / GTZ4i
The following are measured at
European model:
European model:
AC 230 V, 50 Hz
Other models:
AC 120, 220, 240 V, 50/60 Hz
Front speaker
Power output (rated): 90 W + 90 W
(at 6
(at 6
:, 1 kHz, 1% THD)
RMS output power (reference):
155 W + 155 W (per channel at 6
155 W + 155 W (per channel at 6
:, 1 kHz, 10% THD)
Subwoofer
RMS output power (reference): 150 W
(at 6
(at 6
:, 100 Hz, 10% THD)
Inputs
PC (AUDIO IN) L/R:
Voltage 700 mV
impedance 47 kilohms
MIC: sensitivity 1 mV, impedance 10 kilohms
PC (AUDIO IN) L/R:
Voltage 700 mV
impedance 47 kilohms
MIC: sensitivity 1 mV, impedance 10 kilohms
(USB) port: Type A
Outputs
PHONES: accepts headphones of 8
PHONES: accepts headphones of 8
: or more
FRONT SPEAKER: accepts impedance of 6
:
SUBWOOFER: accepts impedance of 6
:
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
AM tuner section
Tuning range
Tuning range
Pan American and Oceanian models:
530 – 1,710 kHz (with 10 kHz tuning interval)
531 – 1,710 kHz (with 9 kHz tuning interval)
European models:
531 – 1,602 kHz (with 9 kHz tuning interval)
Other models:
530 – 1,610 kHz (with 10 kHz tuning interval)
531 – 1,602 kHz (with 9 kHz tuning interval)
530 – 1,710 kHz (with 10 kHz tuning interval)
531 – 1,710 kHz (with 9 kHz tuning interval)
European models:
531 – 1,602 kHz (with 9 kHz tuning interval)
Other models:
530 – 1,610 kHz (with 10 kHz tuning interval)
531 – 1,602 kHz (with 9 kHz tuning interval)
Antenna: AM loop antenna, external antenna terminal
Intermediate frequency: 450 kHz
Intermediate frequency: 450 kHz
iPod section
DC5V 500mA MAX
General
Power requirements
Power consumption
Dimensions (w/h/d) (excl. speakers)
Approx. 231 × 361 × 430.5 mm
(9 1/8 × 14 1/4 × 17 1/4 inch)
(9 1/8 × 14 1/4 × 17 1/4 inch)
Mass (excl. speakers)
HCD-GTZ5 / GTZ4 / GTZ4i:
10.0 kg (22 lb 1 oz)
10.0 kg (22 lb 1 oz)
Design and specifications are subject to change without notice.
AUDIO POWER SPECIFICATION
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
DISTORTION:
(HCD-GTZ4i: US model only)
With 6 ohm loads, both channels driven, from
120 Hz – 10 kHz; rated 110 watts per channel minimum RMS
power, with no more than 0.7% total harmonic distortion from
250 miliwatts to rated output.
120 Hz – 10 kHz; rated 110 watts per channel minimum RMS
power, with no more than 0.7% total harmonic distortion from
250 miliwatts to rated output.
The following are measured at
Mexican model:
Mexican model:
AC 127 V, 60 Hz
Other models:
AC 120, 220, 240 V, 50/60 Hz
HCD-GTZ4i (US model)
The following are measured at AC 120 V 60 Hz
Front speaker
Front speaker
RMS output power (reference):
::SHUFKDQQHODWN+]7+'
::SHUFKDQQHODWN+]7+'
Subwoofer
RMS output power (reference): 180 W
DW+]7+'
(AEP, Australian, Argentina models)
Tuning range:
North American model:
87.5 – 108.0 MHz (100 kHz step)
Other models:
87.5 – 108.0 MHz (50 kHz step)
87.5 – 108.0 MHz (100 kHz step)
Other models:
87.5 – 108.0 MHz (50 kHz step)
North American model: AC 120 V, 60 Hz
European models: AC 230 V, 50/60 Hz
Oceanian model: AC 230 – 240 V, 50/60 Hz
Mexican model: AC 127 V, 60 Hz
European models: AC 230 V, 50/60 Hz
Oceanian model: AC 230 – 240 V, 50/60 Hz
Mexican model: AC 127 V, 60 Hz
Argentine model: AC 220 V, 50/60 Hz
Other models: AC 120, 220 or 230 – 240 V, 50/60 Hz,
Adjustable with voltage selector
MHC-GTZ5: 250 W
MHC-GTZ4 / GTZ4i (Other models): 300 W
HCD-GTZ4i (American model): 240W
6WDQGE\SRZHUFRQVXPSWLRQ:
+DORJHQDWHGIODPHUHWDUGDQWVDUHQRWXVHGLQWKHFHUWDLQ
printed wiring boards.
+DORJHQDWHGIODPHUHWDUGDQWVDUHQRWXVHGLQWKHFHUWDLQ
printed wiring boards.
HCD-GTZ4/GTZ4i/GTZ5
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 4
2-2. Case (Side-L/R) .............................................................. 4
2-3. Top Case.......................................................................... 5
2-4. Front Panel Block ........................................................... 5
2-5. DC Fan (M101) ............................................................... 6
2-6. Back
2-2. Case (Side-L/R) .............................................................. 4
2-3. Top Case.......................................................................... 5
2-4. Front Panel Block ........................................................... 5
2-5. DC Fan (M101) ............................................................... 6
2-6. Back
Panel
...................................................................... 6
2-7. MAIN Board ................................................................... 7
2-8. DC Fan (M102), POWER AMP Board ........................... 7
2-9. HUB Board, DMB19 Board ........................................... 8
2-10. CD Mechanism Block (CDM88B-DVBU101) ............... 8
2-11. Optical Pick-up Block (KHM-313CAB) ........................ 9
2-12. Belt (DLM3A) ................................................................ 9
2-8. DC Fan (M102), POWER AMP Board ........................... 7
2-9. HUB Board, DMB19 Board ........................................... 8
2-10. CD Mechanism Block (CDM88B-DVBU101) ............... 8
2-11. Optical Pick-up Block (KHM-313CAB) ........................ 9
2-12. Belt (DLM3A) ................................................................ 9
3.
TEST MODE
............................................................ 10
4.
ELECTRICAL CHECK
......................................... 12
5. DIAGRAMS
5-1. Block Diagram - RF SERVO, USB Section - ................. 13
5-2. Block Diagram - MAIN Section - ................................... 14
5-3. Block Diagram - AMP Section - ..................................... 15
5-4. Block
5-2. Block Diagram - MAIN Section - ................................... 14
5-3. Block Diagram - AMP Section - ..................................... 15
5-4. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 16
5-5. Printed Wiring Board - DMB19 Board - ........................ 18
5-6. Schematic Diagram - DMB19 Board (1/3) - .................. 19
5-7. Schematic Diagram - DMB19 Board (2/3) - .................. 20
5-8. Schematic Diagram - DMB19 Board (3/3) - .................. 21
5-9. Printed Wiring Board - MAIN Board - ........................... 22
5-10. Schematic Diagram - MAIN Board (1/3) - ..................... 23
5-11. Schematic Diagram - MAIN Board (2/3) - ..................... 24
5-12. Schematic Diagram - MAIN Board (3/3) - ..................... 25
5-13. Printed Wiring Board - HUB Board - ............................. 26
5-14. Schematic Diagram - HUB Board - ................................ 27
5-15. Printed Wiring Board - POWER AMP Board - .............. 28
5-16. Schematic Diagram - POWER AMP Board - ................. 29
5-17. Printed Wiring Board - DISPLAY Board - ..................... 30
5-18. Schematic Diagram - DISPLAY Board - ........................ 31
5-19. Printed Wiring Boards - PANEL Section - ..................... 32
5-20. Schematic Diagram - PANEL Section - .......................... 33
5-21. Printed Wiring Board - TRANS Board - ......................... 34
5-22. Schematic Diagram - TRANS Board - ........................... 35
5-6. Schematic Diagram - DMB19 Board (1/3) - .................. 19
5-7. Schematic Diagram - DMB19 Board (2/3) - .................. 20
5-8. Schematic Diagram - DMB19 Board (3/3) - .................. 21
5-9. Printed Wiring Board - MAIN Board - ........................... 22
5-10. Schematic Diagram - MAIN Board (1/3) - ..................... 23
5-11. Schematic Diagram - MAIN Board (2/3) - ..................... 24
5-12. Schematic Diagram - MAIN Board (3/3) - ..................... 25
5-13. Printed Wiring Board - HUB Board - ............................. 26
5-14. Schematic Diagram - HUB Board - ................................ 27
5-15. Printed Wiring Board - POWER AMP Board - .............. 28
5-16. Schematic Diagram - POWER AMP Board - ................. 29
5-17. Printed Wiring Board - DISPLAY Board - ..................... 30
5-18. Schematic Diagram - DISPLAY Board - ........................ 31
5-19. Printed Wiring Boards - PANEL Section - ..................... 32
5-20. Schematic Diagram - PANEL Section - .......................... 33
5-21. Printed Wiring Board - TRANS Board - ......................... 34
5-22. Schematic Diagram - TRANS Board - ........................... 35
6.
EXPLODED VIEWS
6-1. Case
Section
.................................................................... 44
6-2. Loading Panel Section .................................................... 45
6-3. DISPLAY Board Section ................................................ 46
6-4. Front Panel Section ......................................................... 47
6-5. Back Panel Section ......................................................... 48
6-6. MAIN Board Section ...................................................... 49
6-7. Chassis
6-3. DISPLAY Board Section ................................................ 46
6-4. Front Panel Section ......................................................... 47
6-5. Back Panel Section ......................................................... 48
6-6. MAIN Board Section ...................................................... 49
6-7. Chassis
Section
............................................................... 50
6-8. CD Mechanism Section (CDM88B-DVBU101) ............ 51
7.
ELECTRICAL PARTS LIST
.............................. 52
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classified as a CLASS 1
LASER product. This marking is located on
the rear exterior.
LASER product. This marking is located on
the rear exterior.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Ver. 1.1
HCD-GTZ4/GTZ4i/GTZ5
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE OF REPLACING THE IC102 ON THE DMB19
BOARD
IC102 on the DMB19 board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.
BOARD
IC102 on the DMB19 board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press
1. Press
[I/
1
STANDBY] button to turn the power on.
2. Press the [CD] button to select CD function.
3. While pressing the [
3. While pressing the [
x
] button, press the [
Z
OPEN/CLOSE]
button for more 5 seconds).
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When
“
LOCKED
”
is displayed, the slot lock is not released by
turning power on/off with the
[I/
1
STANDBY]
button.
NOTE OF REPLACING THE IC800 ON THE POWER
AMP BOARD (HCD-GTZ4i: US model only)
The IC800 on the POWER AMP board has been changed from
the midway of production. Therefor, the IC800 of Former type is
limited to the stock quantity of service parts.
Refer to service manual SUPPLEMENT-1 for handling method.
(HCD-GTZ4i: US model only)
AMP BOARD (HCD-GTZ4i: US model only)
The IC800 on the POWER AMP board has been changed from
the midway of production. Therefor, the IC800 of Former type is
limited to the stock quantity of service parts.
Refer to service manual SUPPLEMENT-1 for handling method.
(HCD-GTZ4i: US model only)
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
PART No.
• Abbreviation
AR :
AR :
Argentina
model
AUS :
Australian
model
E2
: 120V AC area in E model
E51 :
Chilean and Peruvian models
MX
: Mexican model
Model
Part No.
HCD-GTZ5: E2, E51
4-124-494-0[]
HCD-GTZ5: AR
4-124-494-1[]
HCD-GTZ5: MX
4-124-494-3[]
HCD-GTZ4: E2, E51
4-131-035-0[]
HCD-GTZ4: AR
4-131-035-1[]
HCD-GTZ4i: AUS
4-131-035-6[]
HCD-GTZ4i: AEP
4-131-035-7[]
HCD-GTZ4i: US
4-131-035-8[]
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
HOW TO OPEN THE TRAY WHEN POWER SWITCH
TURN OFF
TURN OFF
Note: Work after removing the case (side-R) referring to “2-2. CASE
(SIDE-L/R)” on disassembly (page 4).
gear
lever
1
Turn a gear by
a driver till a lever
rises up to the
position of the figure.
state of opening the CD tray
Ver. 1.2
HCD-GTZ4/GTZ4i/GTZ5
4
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
2-2. CASE
(SIDE-L/R)
(Page
4)
2-3. TOP
CASE
(Page
5)
2-4. FRONT PANEL BLOCK
(Page
(Page
5)
2-5. DC FAN (M101)
(Page
(Page
6)
2-6. BACK
PANEL
(Page
6)
2-7. MAIN
BOARD
(Page
7)
2-9. HUB BOARD, DMB19 BOARD
(Page
(Page
8)
2-8. DC FAN (M102),
POWER
POWER
AMP
BOARD
(Page
7)
2-10. CD MECHANISM BLOCK (CDM88B-DVBU101)
(Page
(Page
8)
2-11. OPTICAL PICK-UP BLOCK (KHM-313CAB)
(Page
(Page
9)
SET
2-12. BELT (DLM3A)
(Page
(Page
9)
Note: Follow the disassembly procedure in the numerical order given.
2-2. CASE
(SIDE-L/R)
(Mexican)
(Mexican)
2
three screws
(BVTP3
u 8)
4
case (side-R)
1
three screws
(case 3 TP2)
3
2
three screws
(BVTP3
u 8)
4
case (side-L)
1
three screws
(case 3 TP2)
1
screw (case 3 TP2)
3
1
screw (case 3 TP2)
Ver. 1.1