Sony HCD-GTZ2 / HCD-GTZ2I / HCD-GTZ3 / HCD-GTZ3I / MHC-GTZ2 / MHC-GTZ2I / MHC-GTZ3 / MHC-GTZ3I Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-GTZ2/GTZ2i/
GTZ3/GTZ3i
SPECIFICATIONS
COMPACT DISC RECEIVER
9-889-506-02
2009H05-1
©
2009.08
AEP Model
HCD-GTZ2i/GTZ3i
UK Model
HCD-GTZ3i
E Model
HCD-GTZ2/GTZ3
Ver. 1.1 2009.08
• HCD-GTZ2 is the amplifi er, USB, Disc player, tuner and
iPod section in MHC-GTZ2.
• HCD-GTZ2i is the amplifi er, USB, Disc player, tuner and
iPod section in MHC-GTZ2i.
• HCD-GTZ3 is the amplifi er, USB, Disc player, tuner and
iPod section in MHC-GTZ3.
• HCD-GTZ3i is the amplifi er, USB, Disc player, tuner and
iPod section in MHC-GTZ3i.
Photo: HCD-GTZ3
Model Name Using Similar Mechanism
NEW
Mechanism Type
CDM88B-DVBU101
Optical Pick-up Block Name
KHM-313CAB
“WALKMAN” and “WALKMAN” logo are
registered trademarks of Sony Corporation.
registered trademarks of Sony Corporation.
MICROVAULT is a trademark of Sony Cor-
poration.
poration.
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and
Thomson.
patents licensed from Fraunhofer IIS and
Thomson.
Windows Media is a registered trademark of
Microsoft Corporation in the United States and/
or other countries.
Microsoft Corporation in the United States and/
or other countries.
“Memory Stick” is a trademark of Sony Cor-
poration.
poration.
iPod is a trademark of Apple Inc., registered in
the U.S. and other countries.
the U.S. and other countries.
Amplifier section
HCD-GTZ3 / GTZ3i
The following are measured at
The following are measured at
European model:
AC 230 V, 50 Hz
Mexican model:
AC 127 V, 60 Hz
Other models:
AC 120, 220, 240 V, 50/60 Hz
Front speaker
Power output (rated): 75 W + 75 W
(at 6
(at 6
:, 1 kHz, 1% THD)
RMS output power (reference):
135 W + 135 W (per channel at 6
135 W + 135 W (per channel at 6
:, 1 kHz, 10%
THD)
Subwoofer
RMS output power (reference): 130 W
(at 6
(at 6
:, 100 Hz, 10% THD)
HCD-GTZ2 / GTZ2i
The following are measured at
The following are measured at
European model:
AC 230 V, 50 Hz
Other models:
AC 120, 220, 240 V, 50/60 Hz
Front speaker
Power output (rated): 60 W + 60 W
(at 6
(at 6
:, 1 kHz, 1% THD)
RMS output power (reference):
100 W + 100 W (per channel at 6
100 W + 100 W (per channel at 6
:, 1 kHz, 10%
THD)
Inputs
PC (AUDIO IN) L/R:
Voltage 700 mV
impedance 47 kilohms
MIC: sensitivity 1 mV, impedance 10 kilohms
PC (AUDIO IN) L/R:
Voltage 700 mV
impedance 47 kilohms
MIC: sensitivity 1 mV, impedance 10 kilohms
(USB) port: Type A
Outputs
PHONES: accepts headphones of 8
PHONES: accepts headphones of 8
: or more
FRONT SPEAKER: accepts impedance of 6
:
SUBWOOFER
(HCD-GTZ3 / GTZ3i only):
accepts impedance of 6
(HCD-GTZ3 / GTZ3i only):
accepts impedance of 6
:
USB section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32 – 320 kbps, VBR
WMA: 48 – 192 kbps
AAC: 48 – 320 kbps
32 – 320 kbps, VBR
WMA: 48 – 192 kbps
AAC: 48 – 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
Transfer speed
Full-Speed
Supported USB device
Mass Storage Class
Maximum current
500 mA
AM tuner section
Tuning range
Tuning range
European models:
531 – 1,602 kHz (with 9 kHz tuning interval)
Other models:
530 – 1,610 kHz (with 10 kHz tuning interval)
531 – 1,602 kHz (with 9 kHz tuning interval)
531 – 1,602 kHz (with 9 kHz tuning interval)
Other models:
530 – 1,610 kHz (with 10 kHz tuning interval)
531 – 1,602 kHz (with 9 kHz tuning interval)
Antenna: AM loop antenna, external antenna
terminal
Intermediate frequency: 450 kHz
terminal
Intermediate frequency: 450 kHz
iPod section
DC5V 500mA MAX
General
Power requirements
European models: AC 230 V, 50/60 Hz
Argentine model: AC 220 V, 50/60 Hz
Other models: AC 120, 220 or 230 – 240 V,
50/60 Hz, Adjustable with voltage selector
Other models: AC 120, 220 or 230 – 240 V,
50/60 Hz, Adjustable with voltage selector
Power consumption
HCD-GTZ3 / GTZ3i: 280 W
HCD-GTZ2 / GTZ2i: 190 W
HCD-GTZ2 / GTZ2i: 190 W
Dimensions (w/h/d) (excl. speakers)
Approx. 231 × 361 × 430.5 mm
(9 1/8 × 14 1/4 × 17 1/4 inch)
(9 1/8 × 14 1/4 × 17 1/4 inch)
Mass (excl. speakers)
HCD-GTZ3 / GTZ3i: 10.0 kg (22 lb 1 oz)
HCD-GTZ2 / GTZ2i: 8.0 kg
HCD-GTZ2 / GTZ2i: 8.0 kg
Design and specifications are subject to change without
notice.
notice.
Disc player section
System
Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6
Laser Output*: Less than 44.6
PW
* This output is the value measurement at a
distance of 200 mm from the objective lens
surface on the Optical Pick-up Block with
7 mm aperture.
surface on the Optical Pick-up Block with
7 mm aperture.
Frequency response
20 Hz – 20 kHz
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
Standby power consumption 0.5 W
Halogenated flame retardants are not used in the
Halogenated flame retardants are not used in the
certain printed wiring boards.
Mexican model:
AC 127 V, 60 Hz
87.5 – 108.0 MHz (50 kHz step)
Tuning range:
North American models:
North American models:
87.5 – 108.0 MHz (100 kHz step)
Other models:
Pan American models:
530 – 1,710 kHz (with 10 kHz tuning interval)
531 – 1,710 kHz (with 9 kHz tuning interval)
530 – 1,710 kHz (with 10 kHz tuning interval)
531 – 1,710 kHz (with 9 kHz tuning interval)
Mexican model: AC 127 V, 60 Hz
HCD-GTZ2/GTZ2i/GTZ3/GTZ3i
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 4
2-2. Case (Side-L/R) .............................................................. 4
2-3. Top Case.......................................................................... 5
2-4. Front Panel Block ........................................................... 5
2-5. DC Fan (M101) ............................................................... 6
2-6. Back
2-2. Case (Side-L/R) .............................................................. 4
2-3. Top Case.......................................................................... 5
2-4. Front Panel Block ........................................................... 5
2-5. DC Fan (M101) ............................................................... 6
2-6. Back
Panel
...................................................................... 6
2-7. MAIN Board ................................................................... 7
2-8. DC Fan (M102) (GTZ3/GTZ3i),
POWER
2-8. DC Fan (M102) (GTZ3/GTZ3i),
POWER
AMP
Board
......................................................
7
2-9. HUB Board, DMB19 Board ........................................... 8
2-10. CD Mechanism Block (CDM88B-DVBU101) ............... 8
2-11. Optical Pick-up Block (KHM-313CAB) ........................ 9
2-12. Belt (DLM3A) ................................................................ 9
2-10. CD Mechanism Block (CDM88B-DVBU101) ............... 8
2-11. Optical Pick-up Block (KHM-313CAB) ........................ 9
2-12. Belt (DLM3A) ................................................................ 9
3.
TEST MODE
............................................................ 10
4.
ELECTRICAL CHECK
......................................... 12
5. DIAGRAMS
5-1. Block Diagram - RF SERVO, USB Section - ................. 13
5-2. Block Diagram - MAIN Section - ................................... 14
5-3. Block Diagram - AMP Section - ..................................... 15
5-4. Block
5-2. Block Diagram - MAIN Section - ................................... 14
5-3. Block Diagram - AMP Section - ..................................... 15
5-4. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 16
5-5. Printed Wiring Board - DMB19 Board - ........................ 18
5-6. Schematic Diagram - DMB19 Board (1/3) - .................. 19
5-7. Schematic Diagram - DMB19 Board (2/3) - .................. 20
5-8. Schematic Diagram - DMB19 Board (3/3) - .................. 21
5-9. Printed Wiring Board - MAIN Board - ........................... 22
5-10. Schematic Diagram - MAIN Board (1/3) - ..................... 23
5-11. Schematic Diagram - MAIN Board (2/3) - ..................... 24
5-12. Schematic Diagram - MAIN Board (3/3) - ..................... 25
5-13. Printed Wiring Board - HUB Board - ............................. 26
5-14. Schematic Diagram - HUB Board - ................................ 27
5-6. Schematic Diagram - DMB19 Board (1/3) - .................. 19
5-7. Schematic Diagram - DMB19 Board (2/3) - .................. 20
5-8. Schematic Diagram - DMB19 Board (3/3) - .................. 21
5-9. Printed Wiring Board - MAIN Board - ........................... 22
5-10. Schematic Diagram - MAIN Board (1/3) - ..................... 23
5-11. Schematic Diagram - MAIN Board (2/3) - ..................... 24
5-12. Schematic Diagram - MAIN Board (3/3) - ..................... 25
5-13. Printed Wiring Board - HUB Board - ............................. 26
5-14. Schematic Diagram - HUB Board - ................................ 27
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
5-15. Printed Wiring Board - POWER AMP Board - .............. 28
5-16. Schematic Diagram - POWER AMP Board - ................. 29
5-17. Printed Wiring Board - DISPLAY Board - ..................... 30
5-18. Schematic Diagram - DISPLAY Board - ........................ 31
5-19. Printed Wiring Boards - PANEL Section - ..................... 32
5-20. Schematic Diagram - PANEL Section - .......................... 33
5-21. Printed Wiring Board - TRANS1S Board
5-16. Schematic Diagram - POWER AMP Board - ................. 29
5-17. Printed Wiring Board - DISPLAY Board - ..................... 30
5-18. Schematic Diagram - DISPLAY Board - ........................ 31
5-19. Printed Wiring Boards - PANEL Section - ..................... 32
5-20. Schematic Diagram - PANEL Section - .......................... 33
5-21. Printed Wiring Board - TRANS1S Board
(GTZ2: Chilean and Peruvian models) - ......................... 34
5-22. Schematic Diagram - TRANS1S Board
(GTZ2: Chilean and Peruvian models) - ......................... 35
5-23. Printed Wiring Board - TRANSX Board
(GTZ2: Mexican model/GTZ2i) - ................................... 36
5-24. Schematic Diagram - TRANSX Board
(GTZ2: Mexican model/GTZ2i) - ................................... 37
5-25. Printed Wiring Board
- TRANS Board (GTZ3/GTZ3i) - ................................... 38
5-26. Schematic Diagram
- TRANS Board (GTZ3/GTZ3i) - ................................... 39
6.
EXPLODED VIEWS
6-1. Case
Section
.................................................................... 48
6-2. Loading Panel Section .................................................... 49
6-3. DISPLAY Board Section ................................................ 50
6-4. Front Panel Section ......................................................... 51
6-5. Back Panel Section ......................................................... 52
6-6. MAIN Board Section ...................................................... 53
6-7. Chassis
6-3. DISPLAY Board Section ................................................ 50
6-4. Front Panel Section ......................................................... 51
6-5. Back Panel Section ......................................................... 52
6-6. MAIN Board Section ...................................................... 53
6-7. Chassis
Section
............................................................... 54
6-8. CD Mechanism Section (CDM88B-DVBU101) ............ 55
7.
ELECTRICAL PARTS LIST
.............................. 56
Accessories are given in the last of the electrical parts list.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classified as a CLASS 1
LASER product. This marking is located on
the rear exterior.
LASER product. This marking is located on
the rear exterior.
Ver. 1.1
Note: Refer to supplement-1 for the DISPLAY board of printed
wiring board, schematic diagram and electrical parts list of
Mexican model.
Mexican model.
HCD-GTZ2/GTZ2i/GTZ3/GTZ3i
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE OF REPLACING THE IC102 ON THE DMB19
BOARD
IC102 on the DMB19 board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.
BOARD
IC102 on the DMB19 board cannot exchange with single. When
this part is damaged, exchange the entire mounted board.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press
1. Press
[I/
1
STANDBY] button to turn the power on.
2. Press the [CD] button to select CD function.
3. While pressing the [
3. While pressing the [
x
] button, press the [
Z
OPEN/CLOSE]
button for more 5 seconds).
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When
“
LOCKED
”
is displayed, the slot lock is not released by
turning power on/off with the
[I/
1
STANDBY]
button.
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
PART No.
• Abbreviation
AR :
AR :
Argentina
model
E2
: 120V AC area in E model
E3
: 240V AC area in E model
E51 :
Chilean and Peruvian models
MX
: Mexican model
Model
Part No.
HCD-GTZ3: E2, E51
4-131-036-0[]
HCD-GTZ3: MX
4-131-036-3[]
HCD-GTZ3: AR
4-131-036-1[]
HCD-GTZ3i: AEP, UK
4-131-036-7[]
HCD-GTZ3: E3
4-131-036-8[]
HCD-GTZ2: E51
4-131-037-0[]
HCD-GTZ2: MX
4-131-037-3[]
HCD-GTZ2i: AEP
4-131-037-7[]
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Ver. 1.1
HCD-GTZ2/GTZ2i/GTZ3/GTZ3i
4
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
2-2. CASE
(SIDE-L/R)
(Page
4)
2-3. TOP
CASE
(Page
5)
2-4. FRONT PANEL BLOCK
(Page
(Page
5)
2-5. DC FAN (M101)
(Page
(Page
6)
2-6. BACK
PANEL
(Page
6)
2-7. MAIN
BOARD
(Page
7)
2-9. HUB BOARD, DMB19 BOARD
(Page
(Page
8)
2-8. DC FAN (M102) (GTZ3/GTZ3i),
POWER
POWER
AMP
BOARD
(Page
7)
2-10. CD MECHANISM BLOCK (CDM88B-DVBU101)
(Page
(Page
8)
2-11. OPTICAL PICK-UP BLOCK (KHM-313CAB)
(Page
(Page
9)
SET
2-12. BELT (DLM3A)
(Page
(Page
9)
Note: Follow the disassembly procedure in the numerical order given.
2-2. CASE
(SIDE-L/R)
(Mexican)
(Mexican)
2
three screws
(BVTP3
u 8)
2
three screws
(BVTP3
u 8)
4
case (side-L)
4
case (side-R)
1
three screws
(case 3 TP2)
1
screw (case 3 TP2)
1
three screws
(case 3 TP2)
1
screw (case 3 TP2)
3
3
Ver. 1.1