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37

MOTOR (LD) board

SENSOR board

SW board

MOTOR (TB) board

DRIVER board

MAIN board

MIC board

JOG board

FUNCTION board

PANEL board

BD91 board

USB board

USB CONNECTOR board

POWER board

TRANS board

PRIMARY board

CD-SW board

TUNER PACK

EFFECTOR board

SWITCHING POWER

SUBWOOFER board

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• X

: parts extracted from the component side.

• Y

: parts extracted from the conductor side.

•

: Pattern from the side which enables seeing.

(The other layer’s patterns are not indicated.)

Caution:
Pattern face side:

Parts on the pattern face side seen from

(Conductor Side)

the pattern face are indicated.

Parts face side:

Parts on the parts face side seen from

(Component Side) the parts face are indicated.

•

Indication of transistor.

•

A

: B+ Line.

•

B

: B– Line.

• Voltage and waveforms are dc with respect to ground

under no-signal (detuned) conditions.

• BD91 and Driver sections.

no mark : CD PLAY

• Except BD91 and Driver sections.

no mark : FM
(

) : CD PLAY

<

> : TAPE PLAY

[

] : TAPE REC

∗

: Impossible to measure

• Voltages are taken with a VOM (Input impedance 10 M

Ω

).

Voltage variations may be noted due to normal produc-
tion tolerances.

• Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc-
tion tolerances.

• Circled numbers refer to waveforms.

• Signal path.

F

: AUDIO

f

: TUNER

E

: TAPE PLAY (DECK A)

d

: TAPE PLAY (DECK B)

G

: TAPE REC (DECK B)

N

: MIC

J

: CD PLAY

c

: DIGITAL

I

: USB

• Abbreviation

AR

: Argentina model

E2

: 120V AC area in E model

E51

: Chilean and Peruvian model

MX

: Mexican Model

Note: The components identified by mark 

0

 or dotted line

with mark 

0

 are critical for safety.

Replace only with part number specified.

Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.

C

B

These are omitted.

E

Q

B

These are omitted.

C

E

Q

B

These are omitted.

C

E

Q

Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)

50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in 

Ω

 and 

1

/

4

 

W or less unless otherwise

specified.

•

2

: nonflammable resistor.

•

C

: panel designation.

39

39

HCD-GTX66/GTX77/GTX77BP

40

40

HCD-GTX66/GTX77/GTX77BP

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1-872-620-

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