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The following are measured at
Mexican model: 

AC 127 V, 60 Hz

Other models: 

AC 120, 220, 240 V, 50/60 Hz

Front/Surround speaker 
Power Output (rated): 

210 W + 210 W (at 6 

Ω, 1 kHz, 1% THD, 

   

 

at LINK MODE)

Front speaker 
RMS  output power (reference): 
   

 

280 W + 280 W (per channel at 8 

Ω, 

   

 

1 kHz, 10% THD)

Surround speaker
RMS output power (reference): 
   

 

110 W + 110 W (per channel at 24 

Ω,

   

 

1 kHz, 10% THD)

Subwoofer
RMS output power (reference): 
   

 

160 W + 160 W (per channel at 6 

Ω,

   

 

100 Hz, 10% THD)

The following are measured at
Mexican model: 

AC 127 V, 60 Hz

Other models: 

AC 120, 220, 240 V, 50/60 Hz

Front/Surround speaker
Power Output (rated): 

215 W + 215 W (at 6 

Ω, 1 kHz, 1% THD, at LINK MODE)

Front speaker
RMS output power (reference):
   

 

285 W + 285 W (per channel at 8 

Ω, 1 kHz, 10% THD)

Surround speaker
RMS output power (reference): 

110 W + 110 W (per channel at 24 

Ω, 

   

 

  

1 kHz, 10% THD)

Subwoofer
RMS output power (reference): 

210 W (at 8 

Ω, 100 Hz, 10% THD)

2010I08-1

© 2010. 09

± C ontinued on next page ±

·  HCD-GTR6/GTR7/GTR8 
  are the tuner, CD and 
  amplifi er section in
 MHC-GTR6/GTR7/GTR8
·  HCD-GTR6B/GTR8B 
  are the tuner, deck, CD and 
  amplifi er section in
 MHC-GTR6/GTR7/GTR8

Photo : HCD-GTR8B (E Model)

CD

Section

Model Name Using Similar Mechanism

NEW

CD Mechanism Type

CDM74HF-DVBU101//M

Optical Pick-up Name

KHM-313CAB/C2NP

Tape Deck Section

only for HCD-GTR6B/GTR8B

Model Name Using Similar Mechanism

HCD-GTX777/GTX787/GTX888

Tape Mechanism Type

CFP42608

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.  RE-
PLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE  
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR  
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.

The following are measured at
   

 

AC 120, 220, 240 V, 50/60 Hz

Front/Surround speaker
Power Output (rated): 

200 W + 200 W (at 4 

Ω, 1 kHz, 1% THD, at LINK MODE)

Front speaker
RMS output power (reference):
 

 

225 W + 225 W (per channel at 8 

Ω, 1 kHz, 10% THD)

Surround speaker
RMS output power (reference):
 

 

225 W + 225 W (per channel at 8 

Ω, 1 kHz, 10% THD)

Inputs
VIDEO (AUDIO IN) L/R:
 

 

Voltage 250 mV, impedance 47 kilohms

PC IN L/R: 

Voltage 700 mV, impedance 47 kilohms

MIC: 

Sensitivity 1 mV, impedance 10 kilohms

 (USB) port: 

Type A 

Outputs
PHONES: 

Accepts headphones of 8 

Ω or more

System 

Compact disc and digital audio system

Laser Diode Properties  Emission Duration: Continuous
 

 

Laser Output*: Less than 44.6 µW

 

 

* This output is the value measurement

 

 

  at a distance of 200 mm from the

 

 

  objective lens surface on the Optical

 

 

  Pick-up Block with 7 mm aperture.

Frequency response 

20 Hz – 20 kHz

Signal-to-noise ratio 

More than 90 dB

Dynamic range 

More than 88 dB

Tape deck section
(Except for Latin American and Mexican models)
Recording system 

4-track 2-channel stereo

Tuner section
FM stereo, FM/AM superheterodyne tuner

FM tuner section
Tuning range
North American models:
 

 

87.5 – 108.0 MHz (100 kHz step)

Other models: 

87.5 – 108.0 MHz (50 kHz step)

Antenna 

FM lead antenna

Antenna terminals 

75 ohms unbalanced

Intermediate frequency  10.7 MHz

AM tuner section
Tuning range 

Pan-American and Oceanian models:

 

 

530 – 1,710 kHz (with the interval set at 10 kHz)

 

 

531 – 1,710 kHz (with the interval set at 9 kHz)

Other models: 

530 – 1,610 kHz (with the interval set at 10 kHz)

 

 

531 – 1,602 kHz (with the interval set at 9 kHz)

Antenna 

AM loop antenna

Antenna terminals 

External antenna terminal

Intermediate frequency  450 kHz

USB section
Supported bit rate 

MP3 (MPEG 1 Audio Layer 3): 32 – 320 kbps, VBR

 

 

WMA: 48 – 192 kbps AAC: 48 – 320 kbps

Sampling frequencies 

MP3 (MPEG 1 Audio Layer 3): 32/44.1/48 kHz

 

 

WMA: 44.1 kHz 

 

 

AAC: 44.1 kHz

Transfer speed 

Full-Speed

Supported USB device  Mass Storage Class
Maximum current 

500 mA

General
Power requirements
Mexican model: 

127 V AC, 60 Hz

Australian model: 

230 – 240 V AC, 50/60 Hz

Argentina model:  

220 V AC, 50/60 Hz

Other models:  

120 V, 220 V or 230 – 240 V AC, 50/60 Hz, 

 

 

adjustable with voltage selector

Power consumption 

MHC-GTR8: 460 W

 

 

MHC-GTR7: 440 W

 

 

MHC-GTR6: 300 W

Dimensions (w/h/d) (Approx.)
  

HCD-GTR8/HCD-GTR8B/

  

HCD-GTR7/

 

 

HCD-GTR6/HCD-GTR6B: 295x380x457mm

 
Mass (Approx.) 

HCD-GTR8B: 16.5 kg

 

 

HCD-GTR8/HCD-GTR7: 15.8 kg

 

 

HCD-GTR6B: 14.5 kg

 

 

HCD-GTR6: 13.8 kg

Design and specifi cations are subject to change without notice.

• Standby power consumption: 0.5 W
• Halogenated fl ame retardants are not
  used in the certain printed wiring boards.

Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous 
radiation exposure.

The laser diode in the optical pick-up block may suffer electrostatic 
breakdown because of the potential difference generated by the 
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

Notes on Chip Component Replacement
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be
  damaged by heat.

Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270°C during 

repairing.

• Do not touch the soldering iron on the same conductor of the 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering or 

unsoldering.

UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead 
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than 

ordinary solder.

  Ordinary soldering irons can be used but the iron tip has to be 

applied to the solder joint for a slightly longer time.

  Soldering irons using a temperature regulator should be set to 

about 350 °C.

  Caution: The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

• Strong viscosity
  Unleaded solder is more viscou-s (sticky, less prone to fl ow) than 

ordinary solder so use caution not to let solder bridges occur such 
as on IC pins, etc.

• Usable with ordinary solder
  It is best to use only unleaded solder but unleaded solder may also 

be added to ordinary solder.

This appliance is
claassifi ed as a CLASS 1
LASER product. This
label is located on the
rear exterior.

NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on 
the disc refl ective surface by the objective lens in the optical pick-up 
block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

·  Abbreviation
  E2 

: 120V AC area in E model

  E3 

: 240V AC area in E model

  E51  : Chilean and Peruvian model
  AR  : Argentina model
  AUS  : Australian model
  MX  : Mexican model

MODEL

Parts No

GTR8B: E3

4-126-681-0s

GTR8: E2/E51

4-126-681-1s

GTR8: AR

4-126-681-3s

GTR8B: AUS

4-126-681-5s

GTR8: MX

4-126-681-6s

GTR7: E2/E51

4-135-808-1s

GTR7: AR

4-135-808-3s

GTR7: MX

4-135-808-4s

GTR6B: E3

4-135-809-0s

GTR6: E2/E51

4-135-809-1s

GTR6B: AR

4-135-809-3s

GTR6B: AUS

4-135-809-4s

PART NO