Sony HCD-GT220 / HCD-GT440 / HCD-GT660 / MHC-GT220 / MHC-GT440 / MHC-GT660 Service Manual ▷ View online
HCD-GT220/GT440/GT660
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
HCD-GT220/GT440/GT660
3
1.
SERVICING NOTES
............................................. 4
2. GENERAL
.................................................................. 6
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 7
3-2. Case (Side-L), Case (Side-R) .......................................... 8
3-3. Case (Top) ....................................................................... 8
3-4. LID (CD) ......................................................................... 9
3-5. CD Mechanism Deck, USB R Board .............................. 9
3-6. Front Panel Block ........................................................... 10
3-7. Mecha Deck (CWM42FF609) ........................................ 10
3-8. Back Panel Block ............................................................ 11
3-9. MAIN Board, POWER Board ........................................ 11
3-10. CD Board ........................................................................ 12
3-11. DRIVER Board, SW Board ............................................ 12
3-12. Optical Pick-up Block (KSM-213D) .............................. 13
3-13. SENSOR Board .............................................................. 13
3-14. MOTOR (TB) Board....................................................... 14
3-15. MOTOR (LD) Board ...................................................... 14
3-2. Case (Side-L), Case (Side-R) .......................................... 8
3-3. Case (Top) ....................................................................... 8
3-4. LID (CD) ......................................................................... 9
3-5. CD Mechanism Deck, USB R Board .............................. 9
3-6. Front Panel Block ........................................................... 10
3-7. Mecha Deck (CWM42FF609) ........................................ 10
3-8. Back Panel Block ............................................................ 11
3-9. MAIN Board, POWER Board ........................................ 11
3-10. CD Board ........................................................................ 12
3-11. DRIVER Board, SW Board ............................................ 12
3-12. Optical Pick-up Block (KSM-213D) .............................. 13
3-13. SENSOR Board .............................................................. 13
3-14. MOTOR (TB) Board....................................................... 14
3-15. MOTOR (LD) Board ...................................................... 14
4. TEST
MODE
............................................................. 15
5. MECHANICAL
ADJUSTMENTS
...................... 19
6. ELECTRICAL
ADJUSTMENTS
........................ 20
7. DIAGRAMS
7-1. Block Diagram - CD SERVO, USB Section - ................ 23
7-2. Block Diagram - MAIN Section - ................................... 24
7-3. Block Diagram - AMP Section - ..................................... 25
7-4. Block
7-2. Block Diagram - MAIN Section - ................................... 24
7-3. Block Diagram - AMP Section - ..................................... 25
7-4. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 26
7-5. Printed Wiring Board - CD Board - ................................ 28
7-6. Schematic Diagram - CD Board - ................................... 29
7-7. Printed Wiring Boards - CHANGE Section - ................. 30
7-8. Schematic Diagram - CHANGE Section - ..................... 31
7-9. Printed Wiring Board - USB R Board - .......................... 32
7-10. Schematic Diagram - USB R Board - ............................. 33
7-11. Printed Wiring Board - TC Board - ................................. 34
7-12. Schematic Diagram - TC Board - ................................... 35
7-13. Printed Wiring Boards - MAIN Section - ....................... 37
7-14. Schematic Diagram - MAIN Section (1/4) - ................... 38
7-15. Schematic Diagram - MAIN Section (2/4) - ................... 39
7-16. Schematic Diagram - MAIN Section (3/4) - ................... 40
7-17. Schematic Diagram - MAIN Section (4/4) - ................... 41
7-18. Printed Wiring Board - MIC Board - .............................. 42
7-19. Schematic Diagram - MIC Board - ................................. 43
7-20. Printed Wiring Board
7-6. Schematic Diagram - CD Board - ................................... 29
7-7. Printed Wiring Boards - CHANGE Section - ................. 30
7-8. Schematic Diagram - CHANGE Section - ..................... 31
7-9. Printed Wiring Board - USB R Board - .......................... 32
7-10. Schematic Diagram - USB R Board - ............................. 33
7-11. Printed Wiring Board - TC Board - ................................. 34
7-12. Schematic Diagram - TC Board - ................................... 35
7-13. Printed Wiring Boards - MAIN Section - ....................... 37
7-14. Schematic Diagram - MAIN Section (1/4) - ................... 38
7-15. Schematic Diagram - MAIN Section (2/4) - ................... 39
7-16. Schematic Diagram - MAIN Section (3/4) - ................... 40
7-17. Schematic Diagram - MAIN Section (4/4) - ................... 41
7-18. Printed Wiring Board - MIC Board - .............................. 42
7-19. Schematic Diagram - MIC Board - ................................. 43
7-20. Printed Wiring Board
- AMP Board (GT220/GT660) - ..................................... 44
7-21. Schematic Diagram - AMP Board (GT220/GT660) - ..... 45
7-22. Printed Wiring Board - AMP Board (GT440) - .............. 46
7-23. Schematic Diagram - AMP Board (GT440) - ................. 47
7-24. Printed Wiring Boards
7-22. Printed Wiring Board - AMP Board (GT440) - .............. 46
7-23. Schematic Diagram - AMP Board (GT440) - ................. 47
7-24. Printed Wiring Boards
- SUB WOOFER Section (GT440/GT660) - .................. 48
7-25. Schematic Diagram
- SUB WOOFER Section (GT440/GT660) - .................. 49
7-26. Printed Wiring Boards - PANEL Section - ..................... 50
7-27. Schematic Diagram - PANEL Section - .......................... 51
7-28. Printed Wiring Boards - KEY Section - .......................... 52
7-29. Schematic Diagram - KEY Section - .............................. 53
7-30. Printed Wiring Board
7-27. Schematic Diagram - PANEL Section - .......................... 51
7-28. Printed Wiring Boards - KEY Section - .......................... 52
7-29. Schematic Diagram - KEY Section - .............................. 53
7-30. Printed Wiring Board
- TRANSFORMER Board (GT220/GT660) - ................ 54
TABLE OF CONTENTS
7-31. Schematic Diagram
- TRANSFORMER Board (GT220/GT660) - ................ 55
7-32. Printed Wiring Board
- TRANSFORMER Board (GT440) -............................. 56
7-33. Schematic Diagram
- TRANSFORMER Board (GT440) -............................. 57
8.
EXPLODED VIEWS
8-1. Case Section .................................................................... 66
8-2. KEY TOP Board Section ................................................ 67
8-3. TC Mecha Deck Section ................................................. 68
8-4. PANEL Board Section .................................................... 69
8-5. Front Panel Section ......................................................... 70
8-6. MAIN Board Section ...................................................... 71
8-7. POWER Board, SUB WOOFER Board Section ............ 72
8-8. Chassis Section ............................................................... 73
8-9. CD Mechanism Deck, Section-1
(CDM74KF-K6BD91UR-WOD)
8-2. KEY TOP Board Section ................................................ 67
8-3. TC Mecha Deck Section ................................................. 68
8-4. PANEL Board Section .................................................... 69
8-5. Front Panel Section ......................................................... 70
8-6. MAIN Board Section ...................................................... 71
8-7. POWER Board, SUB WOOFER Board Section ............ 72
8-8. Chassis Section ............................................................... 73
8-9. CD Mechanism Deck, Section-1
(CDM74KF-K6BD91UR-WOD)
...................................
74
8-10. CD Mechanism Deck, Section-2
(CDM74KF-K6BD91UR-WOD)
(CDM74KF-K6BD91UR-WOD)
...................................
75
9.
ELECTRICAL PARTS LIST
.............................. 76
Accessories are given in the last of the electrical parts list.
HCD-GT220/GT440/GT660
4
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
RELEASING THE ANTITHEFT LOCK
The disc table lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc table lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn the power on.
2. Press the [CD] button to select “CD”.
3. While pressing the [
3. While pressing the [
x
] button, press the [
Z
] button until “UN-
LOCKED” displayed on the fl uorescent indicator tube (around
5 seconds).
5 seconds).
Note: When
“
LOCKED
”
is displayed, the antitheft lock is not released
by turning power on/off with the
[
?/1
]
button.
HOW TO OPEN THE TRAY WHEN POWER SWITCH
TURN OFF
TURN OFF
Note: Work after removing the side panel refering to SECTION 3 DIS-
ASSEMBLY (page 7).
Turn the gear (loading A)
to the direction of the arrow.
HCD-GT220/GT440/GT660
5
SERVICE POSITION
In checking the CD mechanism deck, prepare jig (extension cable J-2501-248-A (27 core/300 mm))/J-2501-077-A (13 core/300 mm)
In checking the CD mechanism deck, prepare jig (extension cable J-2501-248-A (27 core/300 mm))/J-2501-077-A (13 core/300 mm)
Connect jig (extension cable J-2501-248-A)
to the flexible flat cable (27 core) and
CD board (CN202).
to the flexible flat cable (27 core) and
CD board (CN202).
MAIN board
CD mechanism deck
Connect jig (extension cable J-2501-077-A)
to the flexible flat cable (13 core) and
DRIVER board (CN701).
to the flexible flat cable (13 core) and
DRIVER board (CN701).
