DOWNLOAD Sony HCD-GS200 / MHC-GS200 Service Manual ↓ Size: 7.2 MB | Pages: 64 in PDF or view online for FREE

Model
HCD-GS200 MHC-GS200
Pages
64
Size
7.2 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-gs200-mhc-gs200.pdf
Date

Sony HCD-GS200 / MHC-GS200 Service Manual ▷ View online

21
HCD-GS200
CD  SECTION
Note:
1. CD Block is basically designed to operate without adjustment. There-
fore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10M
 impedance.
4. Clean the object lens by an applicator with neutral detergent when the
signal level is low than specified value with the following checks.
S-curve Check
Connection:
Procedure:
1.
Connect an oscilloscope to test point TP (FE1) and TP (DVC)
on the CD board.
2.
Turn the power on.
3.
Put the disc (YEDS-18) in and turned power switch on again
and actuate the focus search. (actuate the focus search when
disc table is moving in and out)
4.
Check the oscilloscope waveform (S-curve) is symmetrical
between A and B. And confirm peak to peak level within 2 
±
 1
Vp-p.
S-curve waveform
Note:
• Try to measure several times to make sure than the ratio of A : B
or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the
brightness to obtain best waveform.
Checking Location: CD board (Conductor side)
(See page 22.)
+
CD board
TP (FE1)
TP (DVC)
oscilloscope
A
B
symmetry
within 2 
±
 1 Vp-p
RFAC Level Check
Connection:
Procedure:
1.
Connect an oscilloscope to test point TP (RFAC) and TP (DVC)
on the CD board.
2.
Turn the power on.
3.
Put the disc (YEDS-18) in to playback the number five track.
4.
Confirm that oscilloscope waveform is clear and check RFAC
signal level is correct or not.
Note:
A clear RFAC signal waveform means that the shape “
” can be
clearly distinguished at the center of the waveform.
       RFAC signal waveform
Checking Location: CD board (Conductor side)
(See page 22.)
+
CD board
TP (RFAC)
TP (DVC)
oscilloscope
VOLT/DIV: 200 mV
TIME/DIV: 500 ns 
level: 1.35 
±
 0.4 Vp-p
22
HCD-GS200
E-F Balance Check
Connection:
Procedure:
1.
Connect an oscilloscpe to test point TP (TE1) and TP (DVC)
on the CD board.
2.
Turn the power on.
3.
Select the function “CD”.
4.
Press three buttons of 
[ENTER]
,
M
, and
[TIMER SELECT]
 simultaneously to set the CD service mode.
5.
Put the disc (YEDS-18) in to playback the number five track.
6.
Press the  
.
    button. The message “TRAVERSE” is
displayed. (The tracking servo and the sledding servo are turned
OFF)
7.
Check the level B of the oscilliscope's waveform and the A
(DC voltage) of the center of the Traverse waveform.
Confirm the following :
A/B x 100 = less than 
±
 22%
Traverse Waveform
8.
Press the  
.
    button. The message “TRAVERSE” is
displayed. (The tracking servo and sledding servo are turned
ON)
Confirm the C (DC voltage) is almost equal to the A (DC
voltage) is step 5.
9. To exit from this mode, perform as follows.
1) Move the optical pick-up to the most inside track.
2) Press three buttons of
x
[CLEAR]
, and 
[DISPLAY]
simultaneously. (cold reset)
Notes:
• Always move the optical pick-up to most inside track when
exiting from this mode. Otherwise, a disc will not be unloaded.
• Do not run the sled motor excessively, otherwise the gear can
be chipped.
Traverse Waveform
Checking Location: CD board (Conductor side)
+
CD board
TP (TE1)
TP (DVC)
oscilloscope
Checking Location:
– CD BOARD (Conductor Side) –
TP (FE1)
IC104
IC101
IC103
TP (TE1)
TP (RFAC)
TP (DVC)
0V
B
level: 1.15 
±
 0.5 Vp-p
Center of 
the waveform
A (DC 
voltage)
0V
Tracking servo
Sled servo
ON
C (DC 
voltage)
Tracking servo
Sled servo
OFF
23
23
HCD-GS200
SECTION 7
DIAGRAMS
7-1. Circuit Boards Location
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in 
µ
F unless otherwise noted.  pF: 
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
2
: nonflammable resistor.
5
: fusible resistor.
C
: panel designation.
For printed wiring boards.
Note:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
f
: internal component.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
A
: B+ Line.
B
: B– Line.
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Indication of transistor
B
These are omitted.
C
E
C
B
These are omitted.
E
Q
Note:
The components identi-
fied by mark 
0
 or dotted
line with mark 
0
 are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 
0
 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce por tant le numéro
spécifié.
• Signal path.
F
: FM
f
: AM
J
: CD
c
: DIGITAL OUT
E
: TAPE (PB)
a
: TAPE (REC)
j
: AUDIO IN
k
: VIDEO IN
• Abbreviation
CND : Canadian model.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component A)
the parts face are indicated.
• Waveforms
– CD Board –
0.96Vp-p
1
 IC101 t; (RFAC)
(CD Play Mode)
2
 IC101 el (FE)
(CD Play Mode)
200mV/DIV, 1 
µs/DIV
100mV/DIV, 200 
µs/DIV
100mV/DIV, 200 
µs/DIV
1V/DIV, 20ns/DIV
250mVp-p
470mVp-p
3
 IC101 ra (TE)
(CD Play Mode)
4
 IC104 yd (XO)
3.9Vp-p
59ns
– MAIN Board –
– DISPLAY Board –
6
 IC801 qd (XOUT)
1V/DIV, 40ns/DIV
1V/DIV, 20 
µs/DIV
5
 IC801 qa (SUBXOUT)
3.5Vp-p
30.6 
µ
s
3.2Vp-p
62ns
1V/DIV, 100ns/DIV
7
 IC701 id (X1)
3.8Vp-p
250ns
MAIN board
AMP board
POWER board
D.SENSOR (OUT) board
T.SENSOR board
D.SENSOR (IN) board
L.T MOTOR board
LOAD SW board
CD LED board
CD board
DISPLAY board
GAME LINK board
DOOR LED board
KEY board
HEADPHONE board
24
24
HCD-GS200
7-2. Block Diagrams  – CD Section –
: CD
• Signal Path
• R-CH is omitted due to same as L-CH
: DIGITAL OUT
OPTICAL PICK-UP
BLOCK
(KSM-213BFN)
A
B
C
D
E
F
LD
VC
+5V
GND
PD
VR
LD
DRIVE
FOCUS
COIL
TRACKING
COIL
Q101
RF AMP
IC103
VC
27
A
6
B
7
C
8
D
9
E
10
F
11
LD
1
PD
2
IC150
MOTOR/COIL DRIVE
CH1RO
18
CH1FO
17
CH2FO
12
CH2RO
11
CH3FO
14
CH3RO
13
M
SLED
MOTOR
CH4RO
16
CH4FO
15
M
SPINDLE
MOTOR
F+
F-
T+
T-
22
CH1RI
23
CH1FI
6
CH2FI
7
CH2RI
4
CH3FI
5
CH3RI
2
CH4INS
20
MUTE
MDP
25
SRDR
30
SFDR
29
TRDR
32
TFDR
31
FRDR
34
FFDR
33
DIGITAL SIGNAL PROC.
IC101
DIGITAL SERVO
64
D OUT
RFAC
50
29
RFDCI
28
RFDCO
16
FE
17
FEI
12
SW
RFDC
43
FE
39
TE
41
SE
40
66
PCMD
OPTICAL
OUT
IC309
26
RO
4
DATA
R-CH
L-OUT
6
CLOK
5
XLAT
77
SQCK
8
SCLK
15
SCOR
76
SQSO
26
SSTP
2
XRST
S101
LIMIT
IN SW
C-DATA
28
C-CLK
35
C-XLAT
23
C-SQCK(SCLK)
33
C-SCOR
19
C-SQSO
32
7
SENS
C-SENSE
27
OUT(CD)
OPTICAL
IC801 (1/4)
SYSTEM CONTROL
15
RF AC
18
TE
+3.3V
IC104
D/A CONV,
MP3 DECODER
SDIO
12
3
23
LO
67
BCLK
BCKIA
13
65
LRCK
LRCKIA
14
71
XTAI
CKO
60
72
XTAO
XI
62
XO
63
X201
16.9MHz
5
MIDIO
6
SCL
7
MIACK
39
PO7
1
RESET
MP3-DI
6
MP3-DO
5
MP3-SCL
7
3
MICS
MP3-CS
97
4
MILP
MP3-LATCH
34
MP3-ACK
81
MP3-RESET
84
MP3-REQ
18
C-XRST
21
PWM3
26
PWM2
24
PWM1
22
LD ON
25
+3.3V
REG
+2.5V
REG
1
4
IC121
+3.3V
5
+2.5V
+5V
91
88
93
T-SENS3
T-SENS2
T-SENS1
IC11
TABLE
SENSOR
IC13
TABLE
SENSOR
IC12
TABLE
SENSOR
LOAD IN SW 86
LOAD OUT SW 87
LOAD IN
LOAD OUT
S842
(LOAD)
D-SENS 92
D441, Q841
DISC IN
DETECT SENSOR
Q801, 802,
805, 806
AMP
LOAD NEG 3
LOAD POS 2
Q406, 408
LOADING
MOTOR CONTROL
TABLE POS 1
Q402, 404
TABLE
MOTOR CONTROL
TABLE NEG 100
3
2
RN1
FN1
16
17
MOTOR
DRIVE
9
8
10
11
MOTOR
DRIVE
OUT1 –
OUT1 +
OUT2 –
OUT2 +
RIN2
FIN2
IC401
LOADING/TABLE
MOTOR DRIVE
M441
(LOADING)
M
M
M442
(TABLE)
A
AMP
SECTION
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