Sony HCD-GPX5 Service Manual ▷ View online
SERVICE MANUAL
COMPACT DISC DECK RECEIVER
AEP Model
UK Model
HCD-GPX5
Ver 1.0 2004.04
9-877-795-01
Sony Corporation
2004D05-1
Home Audio Company
© 2004.04
Published by Sony Engineering Corporation
SPECIFICATIONS
HCD-GPX5 is the amplifier, CD player, tape deck
and tuner section in CMT-GPX5.
and tuner section in CMT-GPX5.
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM80B-K6BD80A
Section
Base Unit Name
BU-K6BD80A
Optical Pick-up Block Name
KSM-213DAP
Tape deck
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Type
CMAL1Z234A
Continuous RMS power output (reference):
35 + 35 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Music power output (reference):
60 + 60 W
Inputs
MD/VIDEO:
MD/VIDEO:
Sensitivity 450/250 mV,
impedance 47 kilohms
impedance 47 kilohms
Outputs
PHONES:
PHONES:
Accepts headphones with
an impedance of 8 ohms or
more
an impedance of 8 ohms or
more
SPEAKER:
Accepts impedance of 6 to
16 ohms.
16 ohms.
CD player section
Laser
Semiconductor laser
(
(
λ=780 nm)
Emission duration:
continuous
continuous
Frequency response
20 Hz – 20 kHz
Wavelength
780 – 790 nm
Tape deck section
Recording system
4-track 2-channel, stereo
Frequency response
50 – 13,000 Hz (
±3 dB),
using Sony TYPE I
cassettes
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna, external
antenna terminal
antenna terminal
Intermediate frequency
450 kHz
Amplifier section
UK model:
DIN power output (rated): 40 + 40 W (6 ohms at 1
DIN power output (rated): 40 + 40 W (6 ohms at 1
kHz, DIN)
Continuous RMS power output (reference):
50 + 50 W (6 ohms at 1
kHz, 10% THD)
kHz, 10% THD)
Music power output (reference):
90 + 90 W
AEP model:
DIN power output (rated): 30 + 30 W
DIN power output (rated): 30 + 30 W
(6 ohms at 1 kHz, DIN)
General
Power requirements
230 V AC, 50/60 Hz
Power consumption
UK model:
UK model:
95 W
0.25 W (in Power Saving
Mode)
0.25 W (in Power Saving
Mode)
AEP model:
80 W
0.25 W (in Power Saving
Mode)
0.25 W (in Power Saving
Mode)
Dimensions (w/h/d)
Approx. 181.5
× 261.5 ×
357.5 mm incl. projecting
parts and controls
parts and controls
Mass
Approx. 5.8 kg
Design and specifications are subject to change
without notice.
without notice.
HCD-GPX5
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
HCD-GPX5
3
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
6
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
8
3-2. Side Plate (L)/(R) ............................................................
9
3-3. Top Block Assy ...............................................................
9
3-4. Tape Mechanism Deck (CMAL1Z234A) ....................... 10
3-5. Front Panel Section ......................................................... 10
3-6. MAIN Board ................................................................... 11
3-7. CD Mechanism Deck Block ........................................... 11
3-8. Base Unit (BU-K6BD80A) ............................................. 12
3-9. Motor Gear Assy (Sled) (M102), BD Board .................. 12
3-10. Driver Board .................................................................... 13
3-11. Chassis (Top) ................................................................... 13
3-12. Lever (Loading-L/R) ....................................................... 14
3-13. Lever (Disc Sensor)/(Disc Stop) ..................................... 15
3-14. Holder (BU215) Assy ..................................................... 15
3-15. Lever (BU Lock) ............................................................. 16
3-16. Close Lever ..................................................................... 16
3-17. Lever (Dir), Gear (IDL-B) .............................................. 17
3-18. Gear (IDL-C) ................................................................... 17
3-5. Front Panel Section ......................................................... 10
3-6. MAIN Board ................................................................... 11
3-7. CD Mechanism Deck Block ........................................... 11
3-8. Base Unit (BU-K6BD80A) ............................................. 12
3-9. Motor Gear Assy (Sled) (M102), BD Board .................. 12
3-10. Driver Board .................................................................... 13
3-11. Chassis (Top) ................................................................... 13
3-12. Lever (Loading-L/R) ....................................................... 14
3-13. Lever (Disc Sensor)/(Disc Stop) ..................................... 15
3-14. Holder (BU215) Assy ..................................................... 15
3-15. Lever (BU Lock) ............................................................. 16
3-16. Close Lever ..................................................................... 16
3-17. Lever (Dir), Gear (IDL-B) .............................................. 17
3-18. Gear (IDL-C) ................................................................... 17
4.
TEST MODE
.............................................................. 18
5.
ELECTRICAL ADJUSTMENTS
Deck Section ................................................................... 20
CD Section ...................................................................... 21
CD Section ...................................................................... 21
6.
DIAGRAMS
6-1. Block Diagram – CD SERVO Section – ....................... 22
6-2. Block Diagram – MAIN Section – ................................ 23
6-3. Block Diagram
6-2. Block Diagram – MAIN Section – ................................ 23
6-3. Block Diagram
– PANEL/POWER SUPPLY Section – .......................... 24
6-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 25
6-5. Printed Wiring Board – BD Board – ............................. 26
6-6. Schematic Diagram – BD Board – ................................ 27
6-7. Printed Wiring Board – DRIVER Board – .................... 28
6-8. Schematic Diagram – DRIVER Board – ....................... 28
6-9. Printed Wiring Board – CN Board – ............................. 29
6-10. Printed Wiring Board – MAIN Board – ........................ 30
6-11. Schematic Diagram – MAIN Board (1/3) – .................. 31
6-12. Schematic Diagram – MAIN Board (2/3) – .................. 32
6-13. Schematic Diagram – MAIN Board (3/3) – .................. 33
6-14. Printed Wiring Board – AMP Board – .......................... 34
6-15. Schematic Diagram – AMP Board – ............................. 35
6-16. Printed Wiring Board – PANEL (1) Board – ................ 36
6-17. Schematic Diagram – PANEL (1) Board – ................... 37
6-18. Printed Wiring Board – PANEL (2) Board – ................ 38
6-19. Schematic Diagram – PANEL (2) Board – ................... 39
6-20. Printed Wiring Board – POWER Board – ..................... 40
6-21. Schematic Diagram – POWER Board – ........................ 41
6-6. Schematic Diagram – BD Board – ................................ 27
6-7. Printed Wiring Board – DRIVER Board – .................... 28
6-8. Schematic Diagram – DRIVER Board – ....................... 28
6-9. Printed Wiring Board – CN Board – ............................. 29
6-10. Printed Wiring Board – MAIN Board – ........................ 30
6-11. Schematic Diagram – MAIN Board (1/3) – .................. 31
6-12. Schematic Diagram – MAIN Board (2/3) – .................. 32
6-13. Schematic Diagram – MAIN Board (3/3) – .................. 33
6-14. Printed Wiring Board – AMP Board – .......................... 34
6-15. Schematic Diagram – AMP Board – ............................. 35
6-16. Printed Wiring Board – PANEL (1) Board – ................ 36
6-17. Schematic Diagram – PANEL (1) Board – ................... 37
6-18. Printed Wiring Board – PANEL (2) Board – ................ 38
6-19. Schematic Diagram – PANEL (2) Board – ................... 39
6-20. Printed Wiring Board – POWER Board – ..................... 40
6-21. Schematic Diagram – POWER Board – ........................ 41
7.
EXPLODED VIEWS
7-1. Side Plates Section .......................................................... 48
7-2. Front Panel Section ......................................................... 49
7-3. Top Block Section ........................................................... 50
7-4. MAIN Section ................................................................. 51
7-5. Chassis Section ............................................................... 52
7-6. CD Mechanism Deck Section-1
7-2. Front Panel Section ......................................................... 49
7-3. Top Block Section ........................................................... 50
7-4. MAIN Section ................................................................. 51
7-5. Chassis Section ............................................................... 52
7-6. CD Mechanism Deck Section-1
(CDM80B-K6BD80A) .................................................... 53
7-7. CD Mechanism Deck Section-2
(CDM80B-K6BD80A) .................................................... 54
7-8. CD Mechanism Deck Section-3
(CDM80B-K6BD80A) .................................................... 55
7-9. CD Mechanism Deck Section-4
(CDM80B-K6BD80A) .................................................... 56
7-10. Base Unit Section (BU-K6BD80A) ............................... 57
8.
ELECTRICAL PARTS LIST
............................... 58
4
HCD-GPX5
tape mechanism deck
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
check that the S curve waveforms is output three times.
SERVICE POSITION
– TAPE MECHANISM DECK –
– TAPE MECHANISM DECK –
