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  .............................................   4

2-1.   Side Case (L), Side Case (R)  .........................................   10
2-2.  Top Panel Section ...........................................................   11
2-3.   Front Panel Section .........................................................   12
2-4.   2CH DAMP Board ..........................................................   12
2-5.  Back Panel Section and Chassis .....................................   13
2-6.  CD Mechanism Deck ......................................................   13
2-7. Base 

Unit 

.........................................................................  14

2-8. Optical 

Pick-up 

...............................................................  14

  ............................................................   15

  ........................   17

5-1.  Block Diagram – CD/USB Section – .............................   19
5-2.  Block Diagram – MAIN Section – .................................   20
5-3.  Block Diagram – Display/Power Section – ....................   21
5-4.  Printed Wiring Board – DISPLAY Board – ....................   23
5-5.  Schematic Diagram – DISPLAY Board (1/2) – ..............   24
5-6.  Schematic Diagram – DISPLAY Board (2/2) – ..............   25
5-7.  Printed Wiring Board – BD76 Board – ...........................   26
5-8.  Schematic Diagram – BD76 Board (1/2) – .....................   27
5-9.  Schematic Diagram – BD76 Board (2/2) – .....................   28
5-10.  Printed Wiring Board – 
 

2CH DAMP Board (Component side) – .........................   29

5-11.  Printed Wiring Board – 
 

2CH DAMP Board (Conductor side) – ...........................   30

5-12.  Schematic Diagram – 2CH DAMP Board (1/2) – ..........   31
5-13.  Schematic Diagram – 2CH DAMP Board (2/2) – ..........   32
5-14.  Printed Wiring Board – VOLUME and USB Board – ....   33
5-15.  Schematic Diagram – VOLUME and USB Board – ......   34
5-16.  Printed Wiring Board – TUNER1AM3R Board – ..........   35
5-17.  Schematic Diagram – TUNER1AM3R Board – .............   36

6-1. Overall 

Section 

...............................................................  45

6-2.  Front Panel Section .........................................................   46
6-3.  Top Panel Section ...........................................................   47
6-4.  Back Panel Section .........................................................   48
6-5. Chassis 

Section 

...............................................................  49

  ..............................   50

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

• Abbreviation
 AR  : 

Argentina 

model

  E2 

: 120V AC area in E model

  E51 

: Chilean and Peruvian models

  MX 

: Mexican model

HCD-GPX3G: E2, E51, AR

4-411-594-0[]

HCD-GPX3G: MX

4-411-594-1[]

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1. Press 

[I/

1

 STANDBY] button to turn the power on.

2.  Press the [CD/DISC SKIP] button to select CD function.
3.  While pressing the [

x

] button, press the [ENTER] button for 

more 5 seconds).

4.  The message “UNLOCKED” is displayed and the disc tray is 

unlocked.

Note: When “LOCKED” is displayed, the slot lock is not released by 

turning power on/off with the [?/1 STANDBY] button.

Note : Refer to SUPPLEMENT-1 for adding SERVICING
 NOTES 

(TROUBLESHOOTING)