HCD-GPX3G — Sony Audio Service Manual (repair manual)

Model
HCD-GPX3G
Pages
61
Size
3.36 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-gpx3g.pdf
Date

View Sony HCD-GPX3G Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
HCD-GPX3G
9-890-598-05
2013C08-1
© 
2013.03
E Model
Ver. 1.4  2013.03
•  HCD-GPX3G is the amplifi er, USB, CD player 
and tuner section in MHC-GPX3.
COMPACT DISC RECEIVER
CD Section
Model Name Using Similar Mechanism
HCD-EX66/EX88/EX99
Mechanism Type
CDM76B-D1BD76
Optical Pick-up Block Name
DA11MMVGP
SPECIFICATIONS
Amplifi er section
The following are measured at
Mexican model:
 
AC 120 V – 240 V, 60 Hz
Other models:
 
AC 120 V – 240 V, 50/60 Hz
MHC-GPX3
Front speaker
 
Power Output (rated):
 
300 W + 300 W (at 4 ohms, 1 kHz,
 1% 
THD)
 
RMS output power (reference):
 
475 W + 475 W (per channel at
 
4 ohms, 1 kHz)
Inputs
TV/DVD/SAT (AUDIO IN) L/R
 
Voltage 1.2 V, impedance 47 kilohms
PC/GAME (AUDIO IN) L/R
 
Voltage 1.2 V, impedance 47 kilohms
 (USB) port: Type A
USB section
Supported bit rate
 
MP3 (MPEG 1 Audio Layer-3):
 
32 kbps – 320 kbps, VBR
 
WMA: 48 kbps – 192 kbps
 
AAC: 48 kbps – 320 kbps
Sampling frequencies
 
MP3 (MPEG 1 Audio Layer-3):
 
32 kHz/44.1 kHz/48 kHz
 
WMA: 44.1 kHz
 
AAC: 44.1 kHz
Supported USB device
 
Mass Storage Class
Maximum current
 500 
mA
Disc player section
System
 
Compact disc and digital audio system
Laser Diode Properties
 
Emission Duration: Continuous
 
Laser Output*: Less than 44.6 μW
 
* This output is the value measurement
 
  at a distance of 200 mm from the
 
  objective lens surface on the Optical
 
  Pick-up Block with 7 mm aperture.
Frequency response
 
20 Hz – 20 kHz
Signal-to-noise ratio
 
More than 90 dB
Dynamic range
 
More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
 
FM lead antenna
 
AM loop antenna
FM tuner section
Tuning range
 
87.5 MHz – 108.0 MHz (50 kHz step)
AM tuner section
Tuning range
 Pan 
American 
models:
 
530 kHz – 1,710 kHz (10 kHz step)
 
531 kHz – 1,710 kHz (9 kHz step)
 Other 
models:
 
530 kHz – 1,610 kHz (10 kHz step)
 
531 kHz – 1,602 kHz (9 kHz step)
General
Power requirements
 
Mexican model: AC 120 V – 240 V, 60 Hz
 
Other models: AC 120 V – 240 V, 50/60 Hz
Power consumption
 180 
W
Dimensions (w/h/d) (excl. speakers)
(Approx.)
 
280 mm × 335 mm × 440 mm
Mass (excl. speakers) (Approx.)
 6.0 
kg
Supplied accessories
 
Remote control (1)
 
R6 (Size AA) batteries (2)
 
FM lead/AM loop antenna (1)
Design and specifi cations are subject to
change without notice.
•  “WALKMAN” and “WALKMAN” logo are registered trademarks of 
 Sony 
Corporation.
•  MPEG Layer-3 audio coding technology and patents licensed from 
  Fraunhofer IIS and Thomson.
•  Windows Media is either a registered trademark or trademark of Microsoft
  Corporation in the United States and/or other countries.
•  This product contains technology subject to certain intellectual property 
  rights of Microsoft.
  Use or distribution of this technology outside of this product is prohibited
  without the appropriate license(s) from Microsoft.
HCD-GPX3G
2
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classifi ed as 
a CLASS 1 LASER product.
This marking is located on the 
rear exterior.
HCD-GPX3G
3
1. 
SERVICING  NOTES
  .............................................   4
2. DISASSEMBLY
2-1.   Side Case (L), Side Case (R)  .........................................   10
2-2.  Top Panel Section ...........................................................   11
2-3.   Front Panel Section .........................................................   12
2-4.   2CH DAMP Board ..........................................................   12
2-5.  Back Panel Section and Chassis .....................................   13
2-6.  CD Mechanism Deck ......................................................   13
2-7. Base 
Unit 
.........................................................................  14
2-8. Optical 
Pick-up 
...............................................................  14
3. 
TEST  MODE
  ............................................................   15
4. ELECTRICAL 
 
ADJUSTMENTS
  ........................   17
5. DIAGRAMS
5-1.  Block Diagram – CD/USB Section – .............................   19
5-2.  Block Diagram – MAIN Section – .................................   20
5-3.  Block Diagram – Display/Power Section – ....................   21
5-4.  Printed Wiring Board – DISPLAY Board – ....................   23
5-5.  Schematic Diagram – DISPLAY Board (1/2) – ..............   24
5-6.  Schematic Diagram – DISPLAY Board (2/2) – ..............   25
5-7.  Printed Wiring Board – BD76 Board – ...........................   26
5-8.  Schematic Diagram – BD76 Board (1/2) – .....................   27
5-9.  Schematic Diagram – BD76 Board (2/2) – .....................   28
5-10.  Printed Wiring Board – 
 
2CH DAMP Board (Component side) – .........................   29
5-11.  Printed Wiring Board – 
 
2CH DAMP Board (Conductor side) – ...........................   30
5-12.  Schematic Diagram – 2CH DAMP Board (1/2) – ..........   31
5-13.  Schematic Diagram – 2CH DAMP Board (2/2) – ..........   32
5-14.  Printed Wiring Board – VOLUME and USB Board – ....   33
5-15.  Schematic Diagram – VOLUME and USB Board – ......   34
5-16.  Printed Wiring Board – TUNER1AM3R Board – ..........   35
5-17.  Schematic Diagram – TUNER1AM3R Board – .............   36
6. 
EXPLODED  VIEWS
6-1. Overall 
Section 
...............................................................  45
6-2.  Front Panel Section .........................................................   46
6-3.  Top Panel Section ...........................................................   47
6-4.  Back Panel Section .........................................................   48
6-5. Chassis 
Section 
...............................................................  49
7. 
ELECTRICAL  PARTS  LIST
  ..............................   50
TABLE  OF  CONTENTS
HCD-GPX3G
4
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
• 
Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
• Abbreviation
 AR  : 
Argentina 
model
  E2 
: 120V AC area in E model
  E51 
: Chilean and Peruvian models
  MX 
: Mexican model
Model
Part No.
HCD-GPX3G: E2, E51, AR
4-411-594-0[]
HCD-GPX3G: MX
4-411-594-1[]
MODEL  IDENTIFICATION
– Model Number Lavel –
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1. Press 
[I/
1
 STANDBY] button to turn the power on.
2.  Press the [CD/DISC SKIP] button to select CD function.
3.  While pressing the [
x
] button, press the [ENTER] button for 
more 5 seconds).
4.  The message “UNLOCKED” is displayed and the disc tray is 
unlocked.
Note: When “LOCKED” is displayed, the slot lock is not released by 
turning power on/off with the [?/1 STANDBY] button.
ANTENNA
FM/AM
AUDIO
IN
L
TV/
DVD/
SAT
PC/
GAME
FRONT SPEAKERS
R
L
IMPEDANCE
USE 4
R
Parts No.
Ver. 1.4
Note : Refer to SUPPLEMENT-1 for adding SERVICING
 NOTES 
(TROUBLESHOOTING)
Page of 61
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Here you can view online or download Sony HCD-GPX3G Service Manual in pdf. This Service Manual can help you recover, restore, fix, disassemble and repair Sony HCD-GPX3G Audio. Information contained in Sony HCD-GPX3G service manual (repair manual) typically includes:

  • Disassembly, troubleshooting, programming, maintenance, remote, adjustment, installation and setup instructions.
  • Schematics, wiring and block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Parts list (bill of materials).