DOWNLOAD Sony HCD-GPX33 / HCD-GPX55 / HCD-GPX77 / HCD-GPX88 Service Manual ↓ Size: 6.32 MB | Pages: 82 in PDF or view online for FREE

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HCD-GPX33 HCD-GPX55 HCD-GPX77 HCD-GPX88
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82
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Service Manual
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Audio
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hcd-gpx33-hcd-gpx55-hcd-gpx77-hcd-gpx88.pdf
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Sony HCD-GPX33 / HCD-GPX55 / HCD-GPX77 / HCD-GPX88 Service Manual ▷ View online

SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
HCD-GPX33/GPX55/GPX77/
GPX88
SPECIFICATIONS
9-890-622-03
2014C80-1
© 
2014.03
Ver. 1.2  2014.03
•  HCD-GPX33 is the amplifi er, USB, CD player, 
Bluetooth, NFC and tuner section in MHC-GPX33.
•  HCD-GPX55 is the amplifi er, USB, CD player, 
Bluetooth, NFC and tuner section in MHC-GPX55.
•  HCD-GPX77 is the amplifi er, USB, CD player, 
Bluetooth, NFC and tuner section in MHC-GPX77.
•  HCD-GPX88 is the amplifi er, USB, CD player, 
Bluetooth, NFC and tuner section in MHC-GPX88.
Photo: HCD-GPX88
“WALKMAN” and “WALKMAN” logo are registered trademarks of Sony Corporation.
MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson.
Windows Media is either a registered trademark or trademark of Microsoft Corporation in the United States 
and/or other countries.
This product is protected by certain intellectual property rights of Microsoft Corporation. Use or distribution 
of such technology outside of this product is prohibited without a license from Microsoft or an authorized 
Microsoft subsidiary.
The Bluetooth
®
 word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use 
of such marks by Sony Corporation is under license. Other trademarks and trade names are those of their 
respective owners.
The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the United States and in other 
countries.
Android is a trademark of Google Inc.
All other trademarks and registered trademarks are of their respective holders. In this manual, ™ and ® marks 
are not specified.
CD Section
Model Name Using 
Similar Mechanism
NEW
CD Mechanism Type
CDM90-DVBU202//M
Optical Pick-up Name
CMS-S76RFS7G
COMPACT DISC RECEIVER
US Model
HCD-GPX55/GPX77
E Model
HCD-GPX33/GPX55/GPX77/GPX88
Argentina Model
HCD-GPX33/GPX55/GPX88
Australian Model
HCD-GPX77
Mexican Model
HCD-GPX33/GPX77/GPX88
Saudi Arabia Model
HCD-GPX33/GPX77
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC 
DISTORTION:
(USA model only)
With 4 ohm loads, both channels driven, from 
120 – 10,000 Hz; rated 130 watts per channel 
minimum RMS power, with no more than 
0.7% total harmonic distortion from 250 
milliwatts to rated output.
Amplifi er section
The following are measured at
USA model:
 
AC 120 V, 60 Hz
Mexican model:
 
AC 120 V – 240 V, 60 Hz
Other models:
 
AC 120 V – 240 V, 50/60 Hz
MHC-GPX88
Front speaker
 
Power Output (rated):
 350 
350 W (at 4 ohms, 1 kHz, 
 1% 
THD)
RMS output power (reference):
 
600 W + 600 W (per channel at 4 ohms,
 1 
kHz)
Subwoofer
 
RMS output power (reference):
 
500 W + 500 W (per channel at 5 ohms,
 100 
Hz)
LBT-GPX77/MHC-GPX77
HIGH speakers
 
Power Output (rated):
 
350 W + 350 W (at 4 ohms, 1 kHz,
 1% 
THD)
 
RMS output power (reference):
 
600 W + 600 W (per channel at 4 ohms, 
 1 
kHz)
LOW speakers
 
RMS output power (reference):
 
300 W + 300 W (8 ohms, 100 Hz)
LBT-GPX55/MHC-GPX55
Front speaker
 
Power Output (rated):
 
350 W + 350 W (at 4 ohms, 1 kHz,
 1% 
THD)
 
RMS output power (reference):
 
550 W + 550 W (per channel at 4 ohms,
 1 
kHz)
Subwoofer
 
RMS output power (reference):
 
500 W (5 ohms, 100 Hz)
MHC-GPX33
Front speaker
 
Power Output (rated):
 350 
350 W (at 4 ohms, 1 kHz, 
 1% 
THD)
RMS output power (reference):
 
600 W + 600 W (per channel at
 
4 ohms, 1 kHz)
Inputs
TV/DVD/SAT (AUDIO IN) L/R
 
Voltage 2 V, impedance 47 kilohms
PC/GAME (AUDIO IN) L/R
 
Voltage 2 V, impedance 47 kilohms
MIC (MHC-GPX88 only)
 
Sensitivity 1 mV, impedance 10 kilohms
     A (USB),     B (USB) port: Type A
USB section
Supported bit rate
 WMA:
 48 
kbps 
– 192 kbps, VBR, CBR
 AAC:
 
48 kbps – 320 kbps, VBR, CBR
Sampling frequencies
 
WMA: 44.1 kHz
 AAC: 
44.1 kHz
Supported USB device
 
Mass Storage Class
Maximum current
 500 
mA
Disc/USB section
Supported bit rate
 MPEG1 
Layer-3:
 
32 kbps – 320 kbps, VBR
 MPEG2 
Layer-3:
 
8 kbps – 160 kbps, VBR
 MPEG1 
Layer-2:
 
32 kbps – 384 kbps, VBR
Sampling frequencies
 MPEG1 
Layer-3:
 
32 kHz/44.1 kHz/48 kHz
 MPEG2 
Layer-3:
 
16 kHz/22.05 kHz/24 kHz
 MPEG1 
Layer-2:
 
32 kHz/44.1 kHz/48 kHz
Disc player section
System
 
Compact disc and digital audio system
Laser Diode Properties
 
Emission Duration: Continuous
 
Laser Output*: Less than 44.6 
W
 
* This output is the value measurement 
at a distance of 200 mm from the 
objective lens surface on the Optical 
Pick-up Block with 7 mm aperture.
Frequency response
 
20 Hz – 20 kHz
Signal-to-noise ratio
 
More than 90 dB
Dynamic range
 
More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
 
FM lead antenna
 
AM loop antenna
FM tuner section
Tuning range
 
USA and Brazilian models:
 
87.5 MHz – 108.0 MHz 
 
(100 kHz step)
Other models:
 
87.5 MHz – 108.0 MHz (50 kHz step)
AM tuner section
Tuning range
 
Pan American  and Australia  models:
 
531 kHz – 1,710 kHz (9 kHz step)
 
530 kHz – 1,710 kHz (10 kHz step)
 Saudi 
Arabian 
model:
 
531 kHz – 1,602 kHz (9 kHz step)
 Other 
models:
 
531 kHz – 1,602 kHz (9 kHz step)
 
530 kHz – 1,610 kHz (10 kHz step)
Bluetooth section
Communication system
 
Bluetooth Standard version 3.0 + 
 
EDR (Enhanced Date Rate)
Output
 
Bluetooth Standard Power Class 2
Maximum communication range
 
Line of sight approx. 10 m
1)
Frequency band
 
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
 
FHSS (Freq Hopping Spread Spectrum)
Compatible Bluetooth profiles
2)
 
A2DP (Advanced Audio Distribution 
 Profile)
 
AVRCP 1.3 (Audio Video Remote 
 Control 
Profile)
Supported codecs
 
SBC (Sub Band Codec)
 
AAC (Advanced Audio Coding)
1)
 The actual range will vary depending on 
factors such as obstacles between devices, 
magnetic fields around a microwave oven, 
static electricity, reception sensitivity, 
antenna’s performance, operating system, 
software application, etc.
2)
 Bluetooth standard profiles indicate the 
purpose of Bluetooth  communication 
between devices.
– Continued on next page –
HCD-GPX33/GPX55/GPX77/GPX88
2
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be 
damaged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 
repairing.
•  Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
•  Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the 
following safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 
WT-540A. Follow the manufacturers’ instructions to use these 
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a 
VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous 
radiation exposure.
1.5 k
Ω
0.15 
μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
This appliance is classified as a CLASS 1 
LASER product. This marking is located on 
the rear exterior.
General
Power requirements
 USA 
model:
 
AC 120 V, 60 Hz
 Mexican 
model:
 
AC 120 V – 240 V, 60 Hz
 Other 
models:
 
AC 120 V – 240 V, 50/60 Hz
Power consumption
 MHC-GPX88: 
350 
W
 LBT-GPX77/MHC-GPX77: 
265 
W
 LBT-GPX55/MHC-GPX55: 
255 
W
 MHC-GPX33: 
195 
W
Dimensions (w/h/d) (excl. speakers) (Approx.)
 
270 mm × 363 mm × 364 mm
 (10 
3
4
 in × 14 
3
8
 in × 14 
3
8
 in) 
Mass (excl. speakers) (Approx.)
 
HCD-GPX88/GPX77/GPX55/GPX33: 5.2 kg
 
(11 lb 8 oz)
Supplied accessories
 
Remote control (1)
 
R6 (Size AA) batteries (2)
 
FM lead/AM loop antenna (1)
 
Spacer (MHC-GPX88 only) (2)
 
Speaker pads (MHC-GPX88 only) (16)
 
Speaker pads (LBT-GPX77/MHC-GPX77 only) (8)
Design and specifications are subject to change without notice.
HCD-GPX33/GPX55/GPX77/GPX88
3
TABLE  OF  CONTENTS
1. SERVICING 
NOTES
 ................................................  
4
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................   8
2-2.  Side-L Panel, Side-R Panel, Top Panel ...........................   9
2-3. Loading 
Panel 
.................................................................   9
2-4.  Front Panel Section .........................................................   10
2-5.  CD Mechanism Section (CDM90-DVBU202//M) .........   10
2-6. MB 
Board 
.......................................................................  11
2-7. Chassis 
Section 
...............................................................  11
2-8.  Service Optical Device, Wire (Flat Type) .......................   12
3. 
TEST  MODE
 .............................................................   13
4. 
ELECTRICAL  CHECK
 ..........................................   16
5. TROUBLESHOOTING
 ...........................................   17
6. DIAGRAMS
6-1.  Block Diagram - CD/USB Section - ...............................   23
6-2.  Block Diagram - MAIN Section - ...................................   24
6-3.  Block Diagram - AMP Section - .....................................   25
6-4.  Block Diagram - 
 
PANEL/POWER SUPPLY Section - ..............................   26
6-5.  Printed Wiring Board - 
 
MB Board (Component side) ..........................................   28
6-6.  Printed Wiring Board - 
 
MB Board (Conductor side) ...........................................   29
6-7.  Schematic Diagram - MB Board (1/9) - .........................   30
6-8.  Schematic Diagram - MB Board (2/9) - .........................   31
6-9.  Schematic Diagram - MB Board (3/9) - .........................   32
6-10.  Schematic Diagram - MB Board (4/9) - .........................   33
6-11.  Schematic Diagram - MB Board (5/9) - .........................   34
6-12.  Schematic Diagram - MB Board (6/9) - .........................   35
6-13.  Schematic Diagram - MB Board (7/9) - .........................   36
6-14.  Schematic Diagram - MB Board (8/9) - .........................   37
6-15.  Schematic Diagram - MB Board (9/9) - .........................   38
6-16.  Printed Wiring Board - STR Board - ..............................   39
6-17.  Schematic Diagram - STR Board - .................................   40
6-18.  Printed Wiring Board - DISPLAY Board ........................   41
6-19.  Schematic Diagram - DISPLAY Board - ........................   42
6-20.  Printed Wiring Board - MIC Board (GPX88) -  .............   43
6-21.  Schematic Diagram - MIC Board (GPX88) - .................   43
6-22.  Printed Wiring Board - VOLUME Board - .....................   44
6-23.  Schematic Diagram - VOLUME Board - .......................   44
6-24.  Printed Wiring Board - BASS BAZUCA Board - ..........   44
6-25.  Schematic Diagram - BASS BAZUCA Board - .............   44
7. 
EXPLODED  VIEWS
7-1.  Side Panel Section ..........................................................   57
7-2.  DC Fan, CDM90 Bracket Section  .................................   58
7-3.  Front Panel Section .........................................................   59
7-4. Chassis 
Section 
...............................................................  60
7-5.  CD Mechanism Section
(CDM90-DVBU202//M) ................................................   61
8. 
ELECTRICAL  PARTS  LIST
 ...............................   62
HCD-GPX33/GPX55/GPX77/GPX88
4
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
NOTE  OF  REPLACING  THE  IC504  ON  THE  MB  
BOARD
IC504 on the MB board cannot exchange with single. When this 
part on the MB board ia damaged, exchange the entire mounted 
board.
NOTE  OF  REPLACING  THE  IC100  ON  THE  MB  
BOARD
Once IC100 on the MB board is exchanged, perform “MODEL & 
DEST WRITE MODE” (refer page 13) before operating the set.
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1. Press 
[
\
/1
 STANDBY] button to turn the power on.
2.  Press the [CD] button to select CD function.
3.  While pressing the [
x
] button, press the [ENTER] button for 
more 5 seconds).
4.  The message “UNLOCKED” is displayed and the disc tray is 
unlocked.
Note: When 
LOCKED
 is displayed, the slot lock is not released by 
turning power on/off with the
 [
\
/1
 STANDBY]
 button.
MODEL  IDENTIFICATION
– Back Panel –
Model
Part No.
HCD-GPX88: E2, E51
4-447-622-0 []
HCD-GPX77: E2, E51, EA, AUS, E4
4-447-622-1 []
HCD-GPX55: E2, E51
4-447-622-2 []
HCD-GPX33: E2, E51, EA
4-447-622-3 []
HCD-GPX88: MX
4-447-622-7 []
HCD-GPX77: MX
4-447-622-8 []
HCD-GPX33: MX
4-447-622-9 []
HCD-GPX77: US
4-463-681-0 []
HCD-GPX55: US
4-463-681-1 []
HCD-GPX88: AR
4-463-681-2 []
HCD-GPX55: AR
4-463-681-3 []
HCD-GPX33: AR
4-463-681-4 []
NOTES  ON  LASER DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
PART No.
Ver. 1.2
Page of 82
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Sony HCD-GPX33 / HCD-GPX55 / HCD-GPX77 / HCD-GPX88 Service Manual ▷ Download

  • DOWNLOAD Sony HCD-GPX33 / HCD-GPX55 / HCD-GPX77 / HCD-GPX88 Service Manual ↓ Size: 6.32 MB | Pages: 82 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony HCD-GPX33 / HCD-GPX55 / HCD-GPX77 / HCD-GPX88 in PDF for free, which will help you to disassemble, recover, fix and repair Sony HCD-GPX33 / HCD-GPX55 / HCD-GPX77 / HCD-GPX88 Audio. Information contained in Sony HCD-GPX33 / HCD-GPX55 / HCD-GPX77 / HCD-GPX88 Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.