Sony HCD-GPX33 / HCD-GPX55 / HCD-GPX77 / HCD-GPX88 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
HCD-GPX33/GPX55/GPX77/
GPX88
SPECIFICATIONS
9-890-622-03
2014C80-1
©
2014.03
Ver. 1.2 2014.03
• HCD-GPX33 is the amplifi er, USB, CD player,
Bluetooth, NFC and tuner section in MHC-GPX33.
• HCD-GPX55 is the amplifi er, USB, CD player,
Bluetooth, NFC and tuner section in MHC-GPX55.
• HCD-GPX77 is the amplifi er, USB, CD player,
Bluetooth, NFC and tuner section in MHC-GPX77.
• HCD-GPX88 is the amplifi er, USB, CD player,
Bluetooth, NFC and tuner section in MHC-GPX88.
Photo: HCD-GPX88
“WALKMAN” and “WALKMAN” logo are registered trademarks of Sony Corporation.
MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson.
Windows Media is either a registered trademark or trademark of Microsoft Corporation in the United States
and/or other countries.
and/or other countries.
This product is protected by certain intellectual property rights of Microsoft Corporation. Use or distribution
of such technology outside of this product is prohibited without a license from Microsoft or an authorized
Microsoft subsidiary.
of such technology outside of this product is prohibited without a license from Microsoft or an authorized
Microsoft subsidiary.
The Bluetooth
®
word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use
of such marks by Sony Corporation is under license. Other trademarks and trade names are those of their
respective owners.
respective owners.
The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the United States and in other
countries.
countries.
Android is a trademark of Google Inc.
All other trademarks and registered trademarks are of their respective holders. In this manual, ™ and ® marks
are not specified.
are not specified.
CD Section
Model Name Using
Similar Mechanism
Similar Mechanism
NEW
CD Mechanism Type
CDM90-DVBU202//M
Optical Pick-up Name
CMS-S76RFS7G
COMPACT DISC RECEIVER
US Model
HCD-GPX55/GPX77
E Model
HCD-GPX33/GPX55/GPX77/GPX88
Argentina Model
HCD-GPX33/GPX55/GPX88
Australian Model
HCD-GPX77
Mexican Model
HCD-GPX33/GPX77/GPX88
Saudi Arabia Model
HCD-GPX33/GPX77
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
(USA model only)
With 4 ohm loads, both channels driven, from
120 – 10,000 Hz; rated 130 watts per channel
minimum RMS power, with no more than
0.7% total harmonic distortion from 250
milliwatts to rated output.
DISTORTION:
(USA model only)
With 4 ohm loads, both channels driven, from
120 – 10,000 Hz; rated 130 watts per channel
minimum RMS power, with no more than
0.7% total harmonic distortion from 250
milliwatts to rated output.
Amplifi er section
The following are measured at
USA model:
The following are measured at
USA model:
AC 120 V, 60 Hz
Mexican model:
AC 120 V – 240 V, 60 Hz
Other models:
AC 120 V – 240 V, 50/60 Hz
MHC-GPX88
Front speaker
Front speaker
Power Output (rated):
350
W
+
350 W (at 4 ohms, 1 kHz,
1%
THD)
RMS output power (reference):
600 W + 600 W (per channel at 4 ohms,
1
kHz)
Subwoofer
RMS output power (reference):
500 W + 500 W (per channel at 5 ohms,
100
Hz)
LBT-GPX77/MHC-GPX77
HIGH speakers
HIGH speakers
Power Output (rated):
350 W + 350 W (at 4 ohms, 1 kHz,
1%
THD)
RMS output power (reference):
600 W + 600 W (per channel at 4 ohms,
1
kHz)
LOW speakers
RMS output power (reference):
300 W + 300 W (8 ohms, 100 Hz)
LBT-GPX55/MHC-GPX55
Front speaker
Front speaker
Power Output (rated):
350 W + 350 W (at 4 ohms, 1 kHz,
1%
THD)
RMS output power (reference):
550 W + 550 W (per channel at 4 ohms,
1
kHz)
Subwoofer
RMS output power (reference):
500 W (5 ohms, 100 Hz)
MHC-GPX33
Front speaker
Front speaker
Power Output (rated):
350
W
+
350 W (at 4 ohms, 1 kHz,
1%
THD)
RMS output power (reference):
600 W + 600 W (per channel at
4 ohms, 1 kHz)
Inputs
TV/DVD/SAT (AUDIO IN) L/R
TV/DVD/SAT (AUDIO IN) L/R
Voltage 2 V, impedance 47 kilohms
PC/GAME (AUDIO IN) L/R
Voltage 2 V, impedance 47 kilohms
MIC (MHC-GPX88 only)
Sensitivity 1 mV, impedance 10 kilohms
A (USB), B (USB) port: Type A
USB section
Supported bit rate
WMA:
48
Supported bit rate
WMA:
48
kbps
– 192 kbps, VBR, CBR
AAC:
48 kbps – 320 kbps, VBR, CBR
Sampling frequencies
WMA: 44.1 kHz
AAC:
44.1 kHz
Supported USB device
Mass Storage Class
Maximum current
500
500
mA
Disc/USB section
Supported bit rate
MPEG1
Supported bit rate
MPEG1
Layer-3:
32 kbps – 320 kbps, VBR
MPEG2
Layer-3:
8 kbps – 160 kbps, VBR
MPEG1
Layer-2:
32 kbps – 384 kbps, VBR
Sampling frequencies
MPEG1
MPEG1
Layer-3:
32 kHz/44.1 kHz/48 kHz
MPEG2
Layer-3:
16 kHz/22.05 kHz/24 kHz
MPEG1
Layer-2:
32 kHz/44.1 kHz/48 kHz
Disc player section
System
System
Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6
W
* This output is the value measurement
at a distance of 200 mm from the
objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
Frequency response
20 Hz – 20 kHz
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM lead antenna
AM loop antenna
FM tuner section
Tuning range
Tuning range
USA and Brazilian models:
87.5 MHz – 108.0 MHz
(100 kHz step)
Other models:
87.5 MHz – 108.0 MHz (50 kHz step)
AM tuner section
Tuning range
Tuning range
Pan American and Australia models:
531 kHz – 1,710 kHz (9 kHz step)
530 kHz – 1,710 kHz (10 kHz step)
Saudi
Arabian
model:
531 kHz – 1,602 kHz (9 kHz step)
Other
models:
531 kHz – 1,602 kHz (9 kHz step)
530 kHz – 1,610 kHz (10 kHz step)
Bluetooth section
Communication system
Communication system
Bluetooth Standard version 3.0 +
EDR (Enhanced Date Rate)
Output
Bluetooth Standard Power Class 2
Maximum communication range
Line of sight approx. 10 m
1)
Frequency band
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
FHSS (Freq Hopping Spread Spectrum)
Compatible Bluetooth profiles
2)
A2DP (Advanced Audio Distribution
Profile)
AVRCP 1.3 (Audio Video Remote
Control
Profile)
Supported codecs
SBC (Sub Band Codec)
AAC (Advanced Audio Coding)
1)
The actual range will vary depending on
factors such as obstacles between devices,
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
2)
Bluetooth standard profiles indicate the
purpose of Bluetooth communication
between devices.
between devices.
– Continued on next page –
HCD-GPX33/GPX55/GPX77/GPX88
2
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the
following safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the
following safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous
radiation exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous
radiation exposure.
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
This appliance is classified as a CLASS 1
LASER product. This marking is located on
the rear exterior.
LASER product. This marking is located on
the rear exterior.
General
Power requirements
USA
Power requirements
USA
model:
AC 120 V, 60 Hz
Mexican
model:
AC 120 V – 240 V, 60 Hz
Other
models:
AC 120 V – 240 V, 50/60 Hz
Power consumption
MHC-GPX88:
MHC-GPX88:
350
W
LBT-GPX77/MHC-GPX77:
265
W
LBT-GPX55/MHC-GPX55:
255
W
MHC-GPX33:
195
W
Dimensions (w/h/d) (excl. speakers) (Approx.)
270 mm × 363 mm × 364 mm
(10
3
⁄
4
in × 14
3
⁄
8
in × 14
3
⁄
8
in)
Mass (excl. speakers) (Approx.)
HCD-GPX88/GPX77/GPX55/GPX33: 5.2 kg
(11 lb 8 oz)
Supplied accessories
Remote control (1)
R6 (Size AA) batteries (2)
FM lead/AM loop antenna (1)
Spacer (MHC-GPX88 only) (2)
Speaker pads (MHC-GPX88 only) (16)
Speaker pads (LBT-GPX77/MHC-GPX77 only) (8)
Design and specifications are subject to change without notice.
HCD-GPX33/GPX55/GPX77/GPX88
3
TABLE OF CONTENTS
1. SERVICING
NOTES
................................................
4
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 8
2-2. Side-L Panel, Side-R Panel, Top Panel ........................... 9
2-3. Loading
2-3. Loading
Panel
................................................................. 9
2-4. Front Panel Section ......................................................... 10
2-5. CD Mechanism Section (CDM90-DVBU202//M) ......... 10
2-6. MB
2-5. CD Mechanism Section (CDM90-DVBU202//M) ......... 10
2-6. MB
Board
....................................................................... 11
2-7. Chassis
Section
............................................................... 11
2-8. Service Optical Device, Wire (Flat Type) ....................... 12
3.
TEST MODE
............................................................. 13
4.
ELECTRICAL CHECK
.......................................... 16
5. TROUBLESHOOTING
........................................... 17
6. DIAGRAMS
6-1. Block Diagram - CD/USB Section - ............................... 23
6-2. Block Diagram - MAIN Section - ................................... 24
6-3. Block Diagram - AMP Section - ..................................... 25
6-4. Block Diagram -
6-2. Block Diagram - MAIN Section - ................................... 24
6-3. Block Diagram - AMP Section - ..................................... 25
6-4. Block Diagram -
PANEL/POWER SUPPLY Section - .............................. 26
6-5. Printed Wiring Board -
MB Board (Component side) .......................................... 28
6-6. Printed Wiring Board -
MB Board (Conductor side) ........................................... 29
6-7. Schematic Diagram - MB Board (1/9) - ......................... 30
6-8. Schematic Diagram - MB Board (2/9) - ......................... 31
6-9. Schematic Diagram - MB Board (3/9) - ......................... 32
6-10. Schematic Diagram - MB Board (4/9) - ......................... 33
6-11. Schematic Diagram - MB Board (5/9) - ......................... 34
6-12. Schematic Diagram - MB Board (6/9) - ......................... 35
6-13. Schematic Diagram - MB Board (7/9) - ......................... 36
6-14. Schematic Diagram - MB Board (8/9) - ......................... 37
6-15. Schematic Diagram - MB Board (9/9) - ......................... 38
6-16. Printed Wiring Board - STR Board - .............................. 39
6-17. Schematic Diagram - STR Board - ................................. 40
6-18. Printed Wiring Board - DISPLAY Board ........................ 41
6-19. Schematic Diagram - DISPLAY Board - ........................ 42
6-8. Schematic Diagram - MB Board (2/9) - ......................... 31
6-9. Schematic Diagram - MB Board (3/9) - ......................... 32
6-10. Schematic Diagram - MB Board (4/9) - ......................... 33
6-11. Schematic Diagram - MB Board (5/9) - ......................... 34
6-12. Schematic Diagram - MB Board (6/9) - ......................... 35
6-13. Schematic Diagram - MB Board (7/9) - ......................... 36
6-14. Schematic Diagram - MB Board (8/9) - ......................... 37
6-15. Schematic Diagram - MB Board (9/9) - ......................... 38
6-16. Printed Wiring Board - STR Board - .............................. 39
6-17. Schematic Diagram - STR Board - ................................. 40
6-18. Printed Wiring Board - DISPLAY Board ........................ 41
6-19. Schematic Diagram - DISPLAY Board - ........................ 42
6-20. Printed Wiring Board - MIC Board (GPX88) - ............. 43
6-21. Schematic Diagram - MIC Board (GPX88) - ................. 43
6-22. Printed Wiring Board - VOLUME Board - ..................... 44
6-23. Schematic Diagram - VOLUME Board - ....................... 44
6-24. Printed Wiring Board - BASS BAZUCA Board - .......... 44
6-25. Schematic Diagram - BASS BAZUCA Board - ............. 44
6-21. Schematic Diagram - MIC Board (GPX88) - ................. 43
6-22. Printed Wiring Board - VOLUME Board - ..................... 44
6-23. Schematic Diagram - VOLUME Board - ....................... 44
6-24. Printed Wiring Board - BASS BAZUCA Board - .......... 44
6-25. Schematic Diagram - BASS BAZUCA Board - ............. 44
7.
EXPLODED VIEWS
7-1. Side Panel Section .......................................................... 57
7-2. DC Fan, CDM90 Bracket Section ................................. 58
7-3. Front Panel Section ......................................................... 59
7-4. Chassis
7-2. DC Fan, CDM90 Bracket Section ................................. 58
7-3. Front Panel Section ......................................................... 59
7-4. Chassis
Section
............................................................... 60
7-5. CD Mechanism Section
(CDM90-DVBU202//M) ................................................ 61
8.
ELECTRICAL PARTS LIST
............................... 62
HCD-GPX33/GPX55/GPX77/GPX88
4
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE OF REPLACING THE IC504 ON THE MB
BOARD
IC504 on the MB board cannot exchange with single. When this
part on the MB board ia damaged, exchange the entire mounted
board.
BOARD
IC504 on the MB board cannot exchange with single. When this
part on the MB board ia damaged, exchange the entire mounted
board.
NOTE OF REPLACING THE IC100 ON THE MB
BOARD
Once IC100 on the MB board is exchanged, perform “MODEL &
DEST WRITE MODE” (refer page 13) before operating the set.
BOARD
Once IC100 on the MB board is exchanged, perform “MODEL &
DEST WRITE MODE” (refer page 13) before operating the set.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press
1. Press
[
\
/1
STANDBY] button to turn the power on.
2. Press the [CD] button to select CD function.
3. While pressing the [
3. While pressing the [
x
] button, press the [ENTER] button for
more 5 seconds).
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When
“
LOCKED
”
is displayed, the slot lock is not released by
turning power on/off with the
[
\
/1
STANDBY]
button.
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
Model
Part No.
HCD-GPX88: E2, E51
4-447-622-0 []
HCD-GPX77: E2, E51, EA, AUS, E4
4-447-622-1 []
HCD-GPX55: E2, E51
4-447-622-2 []
HCD-GPX33: E2, E51, EA
4-447-622-3 []
HCD-GPX88: MX
4-447-622-7 []
HCD-GPX77: MX
4-447-622-8 []
HCD-GPX33: MX
4-447-622-9 []
HCD-GPX77: US
4-463-681-0 []
HCD-GPX55: US
4-463-681-1 []
HCD-GPX88: AR
4-463-681-2 []
HCD-GPX55: AR
4-463-681-3 []
HCD-GPX33: AR
4-463-681-4 []
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
PART No.
Ver. 1.2