Sony HCD-GNX600 / MHC-GNX600 Service Manual ▷ View online
2
HCD-GNX600
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
This appliance is classified as
a CLASS 1 LASER product.
This label is located on the rear
exterior.
a CLASS 1 LASER product.
This label is located on the rear
exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Latin American models:
Tuning range
Latin American models:
530 – 1,710 kHz
(with the interval set at 10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)
(with the interval set at 10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)
Other models:
531 – 1,602 kHz
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
Australian model:
Australian model:
230 – 240 V AC, 50/60 Hz
Argentina model:
220 V AC, 50/60 Hz
Other models:
120 V or 220 – 240 V AC,
50/60 Hz
Adjustable with voltage selector
50/60 Hz
Adjustable with voltage selector
Power consumption
110 watts
Dimensions (w/h/d) (Approx.)
280
×
326
×
385.5 mm
Mass (Approx.)
6.3 kg
Supplied accessories:
Remote Commander (1)
Batteries (2)
AM loop antenna (1)
FM lead antenna (1)
Front speaker pads (8)
Sub woofer pads (4)
Batteries (2)
AM loop antenna (1)
FM lead antenna (1)
Front speaker pads (8)
Sub woofer pads (4)
Design and specifications are subject to change
without notice.
without notice.
3
HCD-GNX600
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Locating the Controls ......................................................
5
Setting the Clock .............................................................
6
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
7
3-2.
Side Case, Top Case ........................................................
8
3-3.
Loading Panel ..................................................................
8
3-4.
Front Panel Assy ..............................................................
9
3-5.
Tuner Pack .......................................................................
9
3-6.
Tape Mechanism Deck, MIC Board ................................ 10
3-7.
PANEL Board, IR Board, VOL Board ............................ 10
3-8.
CD Mechanism Deck ...................................................... 11
3-9.
Back Panel, DC FAN (M891) ......................................... 11
3-10. MAIN Board, ADC Board ............................................... 12
3-11. POWER Board, SPEAKER Board .................................. 12
3-12. SMASTER Board ............................................................ 13
3-13. DRIVER Board, SW Board ............................................. 13
3-14. CD Board, Optical Pick-up ............................................. 14
3-15. SENSOR Board ............................................................... 14
3-16. MOTOR (TB) Board ....................................................... 15
3-17. MOTOR (LD) Board ....................................................... 15
3-11. POWER Board, SPEAKER Board .................................. 12
3-12. SMASTER Board ............................................................ 13
3-13. DRIVER Board, SW Board ............................................. 13
3-14. CD Board, Optical Pick-up ............................................. 14
3-15. SENSOR Board ............................................................... 14
3-16. MOTOR (TB) Board ....................................................... 15
3-17. MOTOR (LD) Board ....................................................... 15
4.
TEST MODE
.............................................................. 16
5.
MECHANICAL ADJUSTMENTS
....................... 20
6.
ELECTRICAL ADJUSTMENTS
Deck section .................................................................... 20
CD Section ...................................................................... 21
CD Section ...................................................................... 21
7.
DIAGRAMS .................................................................... 24
7-1.
Block Diagram – CD Section – ...................................... 26
7-2.
Block Diagram – Tape/Tuner Section – ......................... 27
7-3.
Block Diagram – Main Section – ................................... 28
7-4.
Block Diagram – AMP Section – ................................... 29
7-5.
Block Diagram – Display/Power Section – .................... 30
7-6.
Printed Wiring Board – CD Board – .............................. 31
7-7.
Schematic Diagram – CD Board – ................................. 32
7-8.
Printed Wiring Boards – CD Mechanism Sectiom – ...... 33
7-9.
Schematic Diagram – CD Mechanism Section – ........... 34
7-10. Printed Wiring Board – MAIN Board – ......................... 35
7-11. Schematic Diagram – MAIN Board (1/3) – ................... 36
7-12. Schematic Diagram – MAIN Board (2/3) – ................... 37
7-13. Schematic Diagram – MAIN Board (3/3) – ................... 38
7-14. Printed Wiring Board – PANEL Section – ..................... 39
7-15. Schematic Diagram – PANEL Section – ......................... 40
7-16. Printed Wiring Boards
7-11. Schematic Diagram – MAIN Board (1/3) – ................... 36
7-12. Schematic Diagram – MAIN Board (2/3) – ................... 37
7-13. Schematic Diagram – MAIN Board (3/3) – ................... 38
7-14. Printed Wiring Board – PANEL Section – ..................... 39
7-15. Schematic Diagram – PANEL Section – ......................... 40
7-16. Printed Wiring Boards
– MIC,VOL and SPEAKER Boards – ............................ 41
7-17. Schematic Diagram
– MIC,VOL and SPEAKER Boards – ............................ 42
7-18. Printed Wiring Board – ADC Board – ............................ 43
7-19. Schematic Diagram – ADC Board – .............................. 44
7-20. Printed Wiring Board – SMASTER Board (Side A)– ... 45
7-21. Printed Wiring Board – SMASTER Board (Side B)– .... 46
7-22. Schematic Diagram – SMASTER Board (1/2)– ............ 47
7-23. Schematic Diagram – SMASTER Board (2/2)– ............ 48
7-24. Printed Wiring Boards – Power Board – ........................ 49
7-25. Schematic Diagram – Power Board – ............................ 50
7-26. IC Pin Function Description ............................................ 54
7-19. Schematic Diagram – ADC Board – .............................. 44
7-20. Printed Wiring Board – SMASTER Board (Side A)– ... 45
7-21. Printed Wiring Board – SMASTER Board (Side B)– .... 46
7-22. Schematic Diagram – SMASTER Board (1/2)– ............ 47
7-23. Schematic Diagram – SMASTER Board (2/2)– ............ 48
7-24. Printed Wiring Boards – Power Board – ........................ 49
7-25. Schematic Diagram – Power Board – ............................ 50
7-26. IC Pin Function Description ............................................ 54
8.
EXPLODED VIEWS
8-1.
Case (Top), Back Panel Section ...................................... 61
8-2.
Front Panel Section ......................................................... 62
8-3.
Chassis Section ................................................................ 63
8-4.
CD Mechanism Deck Section-1 ...................................... 64
8-5. CD Mechanism Deck Section-2 ..................................... 65
9.
ELECTRICAL PARTS LIST
................................ 66
4
HCD-GNX600
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output several times.
that the S curve waveform is output several times.
• MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
MODEL
PART No.
E2 model
2-658-970-0[]
AUS model
2-658-970-2[]
E3 model
2-658-970-3[]
E51 model
2-658-970-4[]
AR model
2-658-970-5[]
• Abbreviation
AR
: Argentina model
AUS : Australian model
E2
E2
: 120 V AC Area in E model
E3
: 240 V AC Area in E model
E51 : Chilean and Peruvian model
PART No.
CHANGE OF THE COMBINED BOARD SUFFIX
Suffix of the Main, Panel and Power combined board was
changed from -12 to -13.
Suffix of the SMASTER combined board was changed from -12
to -13 or -21 (-13 and -21 are the same patterns).
changed from -12 to -13.
Suffix of the SMASTER combined board was changed from -12
to -13 or -21 (-13 and -21 are the same patterns).
Ver. 1.2
5
HCD-GNX600
SECTION 2
GENERAL
This section is extracted
from instruction manual.
from instruction manual.
LOCATING THE CONTROLS
ALBUM + qk
ALBUM – ql
CD es
CD SYNC 8
Deck A wh
Deck B qh
DIRECTION wg
DISC 1 ~ 3 qa
DISC SKIP/EX-CHANGE qs
Disc tray 6
DISPLAY 3
Display 5
ALBUM – ql
CD es
CD SYNC 8
Deck A wh
Deck B qh
DIRECTION wg
DISC 1 ~ 3 qa
DISC SKIP/EX-CHANGE qs
Disc tray 6
DISPLAY 3
Display 5
ECHO LEVEL wa
EQ BAND/MEMORY 4
GROOVE w;
ILLUMINATION/
EQ BAND/MEMORY 4
GROOVE w;
ILLUMINATION/
SUB WOOFER LEVEL 2
MASTER VOLUME ws
MIC 1/2 (jack) wf
MIC 1/2 LEVEL wd
MP3 BOOSTER 7
PHONES (jack) qj
POWER ILLUMINATOR wk
PRESET EQ wj
REC PAUSE/START 9
MIC 1/2 LEVEL wd
MP3 BOOSTER 7
PHONES (jack) qj
POWER ILLUMINATOR wk
PRESET EQ wj
REC PAUSE/START 9
SUB WOOFER ON/OFF ed
TAPE A/B e;
Tape lid qh, wh
TUNER/BAND ea
TV wl
TAPE A/B e;
Tape lid qh, wh
TUNER/BAND ea
TV wl
?/1 (power) ef
Z OPEN/CLOSE q;
N (play) qd
. OPERATION DIAL >
Z OPEN/CLOSE q;
N (play) qd
. OPERATION DIAL >
(forward/go backward) 1
M (fast forward) qk
m (rewind) ql
X (pause) qf
x (stop) qg
m (rewind) ql
X (pause) qf
x (stop) qg
PUSH Z (Eject A) wh
PUSH Z (Eject B) qh
PUSH Z (Eject B) qh
ALPHABETICAL ORDER
A-D
E-L
M-R
S-Z
SYMBOLS
Top Panel
Front Panel
1
5
4
3
2
6
789
qd
qf
qg
q;
qa
qs
qh
wg
wh
wj
wl
e;
qk
wd
ql
wf
ws
w;
ea
ed
ef
es
wa
wk
qj