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E Model

Australian Model

– Continued on next page –

• HCD-GNX600 is the Amplifier,

CD player, tape deck and tuner
section in MHC-GNX600.

Model Name Using Similar Mechanism

HCD-GNX800

CD

CD Mechanism Type

CDM74KFS-F1BD81A

Section

Base Unit Name

BU-F1BD81A

Optical Pick-up Name

KSM-215DCP/C2NP

TAPE

Model Name Using Similar Mechanism

HCD-GNX800

Section

Tape Transport Mechanism Type

CWN42FF601

The following are measured at

120 V, 220 V, 240 V AC,
50/60 Hz

Front speakers
DIN power output (rated)

130 + 130 watts
(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference)

160 + 160 watts(6 ohms at 1 kHz,
10% THD)

Sub woofer
Continuous RMS power output (reference)

200 watts
(4 ohms at 100 Hz,
10% THD)

TV (AUDIO) IN (phono jack)

voltage 250 mV,
impedance 47 kiloohms

MIC (phone jack)

sensitivity 1 mV,
impedance 10 kiloohms

Outputs
PHONES (stereo mini jack)

accepts headphones of
8 ohms or more

FRONT SPEAKER/SUB WOOFER OUT

Use only the supplied
speaker

System

 Compact disc and digital
audio system

Laser

Semiconductor laser
(

λ

=780 nm)

Emission duration:
continuous

Laser Output

Max. 44.6 

µ

W*

* This output is the value
measured at a distance of
200 mm from the objective
lens surface on the Optical
Pick-up Block with 7 mm
aperture.

Frequency response

2 Hz – 20 kHz (

±

0.5 dB)

Wave length

780 – 790 nm

Signal-to-noise ratio

More than 90 dB

Dynamic range

More than 90 dB

Tape deck section
Recording system

4-track 2-channel stereo

Frequency response

50 – 13,000 Hz (

±

3 dB),

using Sony TYPE I tape

2007L02-1
© 2007.12

2

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

 damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

 circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

 or unsoldering.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.

This appliance is classified as
a CLASS 1 LASER product.
This label is located on the rear
exterior.

0

0

Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40

°

C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°

C.

Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range

87.5 – 108.0 MHz

Antenna

FM lead antenna

Antenna terminals

75 ohm unbalanced

Intermediate frequency

10.7 MHz

AM tuner section
Tuning range
Latin American models:

530 – 1,710 kHz
(with the interval set at 10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)

Other models:

531 – 1,602 kHz
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)

Antenna

AM loop antenna

Antenna terminals

External antenna terminal

Intermediate frequency

450 kHz

Power requirements
Australian model:

230 – 240 V AC, 50/60 Hz

Argentina model:

220 V AC, 50/60 Hz

Other models:

120 V or 220 – 240 V AC,
50/60 Hz
Adjustable with voltage selector

Power consumption

110 watts

Dimensions (w/h/d) (Approx.)

280 

×

 326 

×

 385.5 mm

Mass (Approx.)

6.3 kg

Supplied accessories:

Remote Commander (1)
Batteries (2)
AM loop antenna (1)
FM lead antenna (1)
Front speaker pads (8)
Sub woofer pads (4)

Design and specifications are subject to change
without notice.

3

................................................

4

Locating the Controls ......................................................

5

Setting the Clock .............................................................

6

3-1.

Disassembly Flow ...........................................................

7

3-2.

Side Case, Top Case ........................................................

8

3-3.

Loading Panel ..................................................................

8

3-4.

Front Panel Assy ..............................................................

9

3-5.

Tuner Pack .......................................................................

9

3-6.

Tape Mechanism Deck, MIC Board ................................ 10

3-7.

PANEL Board, IR Board, VOL Board ............................ 10

3-8.

CD Mechanism Deck ...................................................... 11

3-9.

Back Panel, DC FAN (M891) ......................................... 11

3-10. MAIN Board, ADC Board ............................................... 12
3-11. POWER Board, SPEAKER Board .................................. 12
3-12. SMASTER Board ............................................................ 13
3-13. DRIVER Board, SW Board ............................................. 13
3-14. CD Board, Optical Pick-up ............................................. 14
3-15. SENSOR Board ............................................................... 14
3-16. MOTOR (TB) Board ....................................................... 15
3-17. MOTOR (LD) Board ....................................................... 15

.............................................................. 16

....................... 20

Deck section .................................................................... 20
CD Section ...................................................................... 21

7.

DIAGRAMS .................................................................... 24

7-1.

Block Diagram  – CD Section – ...................................... 26

7-2.

Block Diagram  – Tape/Tuner Section – ......................... 27

7-3.

Block Diagram  – Main Section – ................................... 28

7-4.

Block Diagram  – AMP Section – ................................... 29

7-5.

Block Diagram  – Display/Power Section – .................... 30

7-6.

Printed Wiring Board  – CD Board – .............................. 31

7-7.

Schematic Diagram  – CD Board – ................................. 32

7-8.

Printed Wiring Boards  – CD Mechanism Sectiom – ...... 33

7-9.

Schematic Diagram  – CD Mechanism Section – ........... 34

7-10. Printed Wiring Board  – MAIN Board – ......................... 35
7-11. Schematic Diagram  – MAIN Board (1/3) – ................... 36
7-12. Schematic Diagram  – MAIN Board (2/3) – ................... 37
7-13. Schematic Diagram  – MAIN Board (3/3) – ................... 38
7-14. Printed Wiring Board  – PANEL Section – ..................... 39
7-15. Schematic Diagram – PANEL Section – ......................... 40
7-16. Printed Wiring Boards

– MIC,VOL and SPEAKER Boards – ............................ 41

7-17. Schematic Diagram

– MIC,VOL and SPEAKER Boards – ............................ 42

7-18. Printed Wiring Board  – ADC Board – ............................ 43
7-19. Schematic Diagram  – ADC Board – .............................. 44
7-20. Printed Wiring Board  – SMASTER Board  (Side A)– ... 45
7-21. Printed Wiring Board  – SMASTER Board (Side B)– .... 46
7-22. Schematic Diagram  – SMASTER Board (1/2)– ............ 47
7-23. Schematic Diagram  – SMASTER Board (2/2)– ............ 48
7-24. Printed Wiring Boards  – Power Board – ........................ 49
7-25. Schematic Diagram  – Power Board – ............................ 50
7-26. IC Pin Function Description ............................................ 54

8-1.

Case (Top), Back Panel Section ...................................... 61

8-2.

Front Panel Section ......................................................... 62

8-3.

Chassis Section ................................................................ 63

8-4.

CD Mechanism Deck Section-1 ...................................... 64

8-5. CD Mechanism Deck Section-2 ..................................... 65

................................ 66

4

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output several times.

MODEL

PART No.

E2 model

2-658-970-0[]

AUS model

2-658-970-2[]

E3 model

2-658-970-3[]

E51 model

2-658-970-4[]

AR model

2-658-970-5[]

• Abbreviation

AR

: Argentina model

AUS : Australian model
E2

: 120 V AC Area in E model

E3

: 240 V AC Area in E model

E51 : Chilean and Peruvian model

PART No.

Suffix of the Main, Panel and Power combined board was
changed from -12 to -13.
Suffix of the SMASTER combined board was changed from -12
to -13 or -21 (-13 and -21 are the same patterns).