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E Model

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• HCD-GNX100 is the Amplifier,

CD player, tape deck and tuner
section in MHC-GNX100.

Model Name Using Similar Mechanism

HCD-GN880

CD

CD Mechanism Type

CDM74-F1BD81

Section

Base Unit Name

BU-F1BD81A

Optical Pick-up Name

KSM-215DCP/C2NP

TAPE

Model Name Using Similar Mechanism

NEW

Section

Tape Transport Mechanism Type

CMAT5Z2

The following are measured at

AC 120, 220, 240 V, 50/60 Hz

DIN power output (rated)

130 

× 2 + 130 × 2 watts

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference)

175 

× 2 + 175 × 2 watts

(6 ohms at 1 kHz, 10% THD)

Inputs
VIDEO/MD (AUDIO) IN (phono jacks):

voltage 250/450 mV,
impedance 47 kiloohms

TV (AUDIO) IN (phono jack): voltage 250 mV,

impedance 47 kiloohms

MIC (phone jack):

sensitivity 1 mV,
impedance 10 kiloohms

Outputs
PHONES (stereo mini jack):

accepts headphones of
8 ohms or more

FRONT SPEAKER:

Use only the supplied speaker
• SS-GNX100

SURROUND SPEAKER:

Use only the supplied speaker
• SS-RSX100

SUBWOOFER OUT:

Use only the supplied subwoofer
• SS-WG100

Disc player section
System

Compact disc and digital audio system

Laser

Semiconductor laser (

λ=780 nm)

Emission duration: continuous

Laser Output

Max. 44.6 

µW*

*This output is the value measured at a
  distance of 200 mm from the objective
  lens surface on the Optical Pick-up Block
  with 7 mm aperture.

Frequency response

2 Hz – 20 kHz (

±0.5 dB)

Wave length

780 – 790 nm

Signal-to-noise ratio

More than 90 dB

Dynamic range

More than 90 dB

OPTICAL CD DIGITAL OUT
(Square optical connector jack, rear panel)
Wave length

660 nm

Output Level

–18 dBm

2006F02-1
© 2006.06

2

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

 damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

 circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

 or unsoldering.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.

This appliance is classified as
a CLASS 1 LASER product.
This label is located on the rear
exterior.

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

Tape deck section
Recording system

4-track 2-channel stereo

Frequency response

50 – 13,000 Hz (

±3 dB),

using Sony TYPE I tape

Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range

87.5 – 108.0 MHz

Antenna

FM lead antenna

Antenna terminals

75 ohm unbalanced

Intermediate frequency

10.7 MHz

AM tuner section
Tuning range

531 – 1,602 kHz
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)

Antenna

AM loop antenna

Antenna terminals

External antenna terminal

Intermediate frequency

450 kHz

General
Power requirements

120 V, 220 V or 230 – 240 V AC,
50/60 Hz
Adjustable with voltage selector

Power consumption

350 watts

Dimensions (w/h/d) (Approx.) 280 

× 371 × 398.5 mm

Mass (Approx.)

15.6 kg

Supplied accessories:

Remote Commander (1)
Batteries (2)
AM loop antenna (1)
FM lead antenna (1)
Front speaker pads (8)
Surround speaker pads (8)
Subwoofer pads (4)

Design and specifications are subject to change without notice.

3

................................................

4

Location of Controls ........................................................

5

3-1.

Disassembly Flow ...........................................................

7

3-2.

Side Panel, Top Case .......................................................

8

3-3.

Loading Panel Assy .........................................................

8

3-4.

Front Panel Assy ..............................................................

9

3-5.

Tuner Pack .......................................................................

9

3-6.

Tape Mechanism Deck, Mic Board ................................. 10

3-7.

Panel Board, CD-SW Board ............................................ 10

3-8.

CD Mechanism Deck ...................................................... 11

3-9.

Back Panel ....................................................................... 11

3-10. Primary Board ................................................................. 12
3-11. Power AMP PC Board Assy, Main Board ....................... 12
3-12. Surround Board, PA Board .............................................. 13
3-13. Power Transformer (T1200) ............................................ 13
3-14. Driver Board, SW Board ................................................. 14
3-15. CD Board ......................................................................... 14
3-16. Sensor Board ................................................................... 15
3-17. Motor (TB) Board ........................................................... 15
3-18. Motor (LD) Board ........................................................... 16

.............................................................. 17

....................... 21

Deck section .................................................................... 21
CD Section ...................................................................... 22

7-1.

Circuit Board Location .................................................... 26

7-2.

Block Diagram  – CD Section – ...................................... 27

7-3.

Block Diagram  – Tape Section – .................................... 28

7-4.

Block Diagram  – Main Section – ................................... 29

7-5.

Block Diagram  – AMP Section – ................................... 30

7-6.

Block Diagram  – Display Section – ............................... 31

7-7.

Printed Wiring Board  – CD Board – .............................. 32

7-8.

Schematic Diagram  – CD Board – ................................. 33

7-9.

Printed Wiring Board  – CD Mechanism Board – ........... 34

7-10. Schematic Diagram  – CD Mechanism Board – ............. 35
7-11. Printed Wiring Boards  – Main Board – .......................... 36
7-12. Schematic Diagram  – Main Board (1/3) – ..................... 37
7-13. Schematic Diagram  – Main Board (2/3) – ..................... 38
7-14. Schematic Diagram  – Main Board (3/3) – ..................... 39
7-15. Printed Wiring Boards  – Panel Board – ......................... 40
7-16. Schematic Diagram – Panel Board – ............................... 41
7-17. Printed Wiring Board  – CD-SW, Jog, Mic Boards – ...... 42
7-18. Schematic Diagram  – CD-SW, Jog, Mic Board – .......... 43
7-19. Printed Wiring Board  – PA Board – ............................... 44
7-20. Schematic Diagram  – PA Board – .................................. 45
7-21. Printed Wiring Board  – Surround Board – ..................... 46
7-22. Schematic Diagram  –Surround Board (1/2) – ................ 47
7-23. Schematic Diagram  –Surround Board (2/2) – ................ 48
7-24. Printed Wiring Board  – Trans, Primary Boards – .......... 49
7-25. Schematic Diagram  – Trans, Primary Boards – ............. 50
7-26. IC Pin Function Description ............................................ 54

8-1.

Case (Top), Rear Panel Section ....................................... 60

8-2.

Front Panel Section ......................................................... 61

8-3.

Chassis Section ................................................................ 62

8-4.

CD Mechanism Deck Section-1

(CDM74-F1BD81) .......................................................... 63

8-5. CD Mechanism Deck Section-2

(CDM74-F1BD81) .......................................................... 64

................................ 65

4

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output several times.

Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°C.

Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.