Sony HCD-FX350I Service Manual ▷ View online
HCD-FX350i
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 5
2-2. Panel (Rear) Block .......................................................... 5
2-3. Top Panel Block .............................................................. 6
2-4. Front Panel Block ........................................................... 6
2-5. Knob
2-3. Top Panel Block .............................................................. 6
2-4. Front Panel Block ........................................................... 6
2-5. Knob
(VOL)
.................................................................... 7
2-6. Module (DAB Tuner) Block, MAIN Board .................... 7
2-7. Base
2-7. Base
Unit
......................................................................... 8
2-8. Optical Pick-up Block (DA11MMVGP) ........................ 8
3.
TEST MODE
............................................................ 9
4.
ELECTRICAL CHECK
......................................... 10
5 DIAGRAMS
5-1. Block Diagram - CD, TUNER Section - ........................ 12
5-2. Block
5-2. Block
Diagram
- OUTPUT, PANEL, POWER SUPPLY Section - ......... 13
5-3. Printed Wiring Board - BD73 Board - ............................ 16
5-4. Schematic Diagram - BD73 Board - ............................... 17
5-5. Schematic Diagram - MAIN Section (1/2) - ................... 18
5-6. Schematic Diagram - MAIN Section (2/2) - ................... 19
5-7. Printed Wiring Boards - MAIN Section - ....................... 20
5-8. Printed Wiring Board - IP Board - .................................. 21
5-9. Schematic Diagram - IP Board - ..................................... 21
5-10. Schematic Diagram - PANEL Board (1/2) - ................... 22
5-11. Schematic Diagram - PANEL Board (2/2) - ................... 23
5-12. Printed Wiring Board - PANEL Board - ......................... 24
5-13. Printed Wiring Board - PT Board - ................................. 25
5-14. Schematic Diagram - PT Board - .................................... 25
5-4. Schematic Diagram - BD73 Board - ............................... 17
5-5. Schematic Diagram - MAIN Section (1/2) - ................... 18
5-6. Schematic Diagram - MAIN Section (2/2) - ................... 19
5-7. Printed Wiring Boards - MAIN Section - ....................... 20
5-8. Printed Wiring Board - IP Board - .................................. 21
5-9. Schematic Diagram - IP Board - ..................................... 21
5-10. Schematic Diagram - PANEL Board (1/2) - ................... 22
5-11. Schematic Diagram - PANEL Board (2/2) - ................... 23
5-12. Printed Wiring Board - PANEL Board - ......................... 24
5-13. Printed Wiring Board - PT Board - ................................. 25
5-14. Schematic Diagram - PT Board - .................................... 25
6.
EXPLODED VIEWS
6-1. Overall
Section
............................................................... 28
6-2. Top Panel Section ........................................................... 29
6-3. Front Panel Section ......................................................... 30
6-4. Chassis
6-3. Front Panel Section ......................................................... 30
6-4. Chassis
Section
............................................................... 31
7.
ELECTRICAL PARTS LIST
.............................. 32
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
HCD-FX350i
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
MODEL IDENTIFICATION
- Back Panel -
- Back Panel -
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning on
the SW880. (push switch type)
The following checking method for the laser diode is operable.
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning on
the SW880. (push switch type)
The following checking method for the laser diode is operable.
• Method
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the SW880 as shown in Fig.1.
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the SW880 as shown in Fig.1.
Note: Do not push the detection lever strongly, or it may be bent or
damaged.
3. Check the object lens for confi rming normal emission of the
laser diode. If not emitting, there is a trouble in the automatic
power control circuit or the optical pick-up.
power control circuit or the optical pick-up.
In this operation, the object lens will move up and down 2
times along with inward motion for the focus search.
SW880
Fig. 1. Method to push the SW880
Model
Part No.
AEP and UK models
4-178-703-0
[]
Australian model
4-178-704-0
[]
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Part No.
Ver. 1.1
HCD-FX350i
4
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistors referring to the fi gure below.
• PT board (C905)
• MAIN board (C903, C904)
Both ends of respective capacitors.
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistors referring to the fi gure below.
• PT board (C905)
• MAIN board (C903, C904)
Both ends of respective capacitors.
– PT Board (Conductor Side) –
– MAIN Board (Conductor Side) –
800
:/2 W
800
:/2 W
800
:/2 W
C905
C903
C904
HCD-FX350i
5
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
2-3. TOP PANEL BLOCK
(Page
(Page
6)
2-2. PANEL (REAR) BLOCK
(Page
(Page
5)
2-7. BASE
UNIT
(Page
8)
2-4. FRONT PANEL BLOCK
(Page
(Page
6)
2-8. OPTICAL PICK-UP BLOCK
(DA11MMVGP)
(Page
(DA11MMVGP)
(Page
8)
2-5. KNOB
(VOL)
(Page
7)
2-6. MODULE (DAB TUNER) BLOCK,
MAIN
MAIN
BOARD
(Page
7)
SET
Note: Follow the disassembly procedure in the numerical order given.
2-2. PANEL (REAR) BLOCK
Note: This illustration sees the set from rear side.
3
2 two screws
(BVTP3
u 10)
4 panel (rear) block
1 three screws
(BVTP3
u 8)
2 four screws
(BVTP3
u 10)