Sony HCD-FC7 (serv.man2) Service Manual ▷ View online
2
HCD-FC7
LEAKAGE
The AC leakage from any exposed metal part to earth Ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
1.
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
1.
A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2.
A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
digital multimeter is suitable for this job.
3.
Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
0.15
µ
F
To Exposed Metal
Parts on Set
Parts on Set
1.5k
Ω
AC
voltmeter
(0.75V)
voltmeter
(0.75V)
Earth Ground
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
NOTES ON DMB03 BOARD EXCHANGE
If a DVD board is exchanged, “DRIVE AUTO ADJUSTMENT”
may be unable to be performed. In this case, initialize a memory in
the following procedure.
may be unable to be performed. In this case, initialize a memory in
the following procedure.
1. Starting Test Mode (see page 27).
2. Press the 2 button of remote commander to set the Drive
2. Press the 2 button of remote commander to set the Drive
Manual Operation (see page 29).
3. Press the 6 button of remote commander to set the Memory
Check (see page 31).
4. Press the [CLEAR] button of remote commander to initialize
a memory.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE
0
SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Ver 1.2
3
HCD-FC7
TABLE OF CONTENTS
1. SERVICING NOTE
·························································· 4
2. GENERAL
·········································································· 7
3. DISASSEMBLY
······························································ 10
3-1. FRONT PANEL SECTION,
SIDE PANEL (L)/(R) SECTION ································· 11
3-2. DDCON BOARD, LED BOARD, FL BOARD ·········· 12
3-3. KEY BOARD ······························································ 12
3-4. POWER BOARD ························································· 13
3-5. AMP BOARD ······························································ 13
3-6. DVD BOARD, DC FAN ·············································· 14
3-7. CD MECHANISM DECK (CDM69-DVBU16) ········· 15
3-8. SELECTOR BOARD, VIDEO BOARD,
3-3. KEY BOARD ······························································ 12
3-4. POWER BOARD ························································· 13
3-5. AMP BOARD ······························································ 13
3-6. DVD BOARD, DC FAN ·············································· 14
3-7. CD MECHANISM DECK (CDM69-DVBU16) ········· 15
3-8. SELECTOR BOARD, VIDEO BOARD,
LF BOARD ·································································· 16
3-9. AUDIO BOARD, S-VIDEO BOARD ························· 16
3-10. BASE UNIT (DVBU16) ············································ 17
3-11. PICK-UP UNIT (TDP022W) ····································· 17
3-12. SW BOARD, BRACKET (TOP) ASSY ···················· 18
3-13. RELAY BOARD ························································ 18
3-14. MOTOR (STOCKER) ASSY (STOCKER)(M761) ··· 19
3-15. MOTOR (STOCKER) ASSY (ROLLER)(M781) ····· 19
3-16. MOTOR (STOCKER) ASSY (MODE)(M771) ········· 20
3-17. RUBBER ROLLER (SLIDER) ASSY ······················· 20
3-18. TIMING BELT (FRONT/REAR) ······························ 21
3-19. CAM (GEAR) ···························································· 21
3-20. SENSOR BOARD ····················································· 22
3-10. BASE UNIT (DVBU16) ············································ 17
3-11. PICK-UP UNIT (TDP022W) ····································· 17
3-12. SW BOARD, BRACKET (TOP) ASSY ···················· 18
3-13. RELAY BOARD ························································ 18
3-14. MOTOR (STOCKER) ASSY (STOCKER)(M761) ··· 19
3-15. MOTOR (STOCKER) ASSY (ROLLER)(M781) ····· 19
3-16. MOTOR (STOCKER) ASSY (MODE)(M771) ········· 20
3-17. RUBBER ROLLER (SLIDER) ASSY ······················· 20
3-18. TIMING BELT (FRONT/REAR) ······························ 21
3-19. CAM (GEAR) ···························································· 21
3-20. SENSOR BOARD ····················································· 22
4. ASSEMBLY
······································································ 10
4-1. HOW TO INSTALL THE CAM (EJECT LOCK) ······· 23
4-2. HOW TO INSTALL THE CAM (GEAR) ··················· 23
4-3. HOW TO INSTALL THE GEAR (MODE 2) ·············· 24
4-4. HOW TO INSTALL THE GEAR (MODE CAM) ······· 24
4-5. HOW TO INSTALL
4-2. HOW TO INSTALL THE CAM (GEAR) ··················· 23
4-3. HOW TO INSTALL THE GEAR (MODE 2) ·············· 24
4-4. HOW TO INSTALL THE GEAR (MODE CAM) ······· 24
4-5. HOW TO INSTALL
THE ROTARY ENCODER (S702),
GEAR (STOCKER COMMUNICATION) ················· 25
GEAR (STOCKER COMMUNICATION) ················· 25
4-6. HOW TO INSTALL THE STOCKER ASSY ·············· 25
5. TEST MODE
···································································· 26
6. ELECTRICAL ADJUSTMENT
·································· 36
7. DIAGRAMS
7-1. CIRCUIT BOARDS LOCATION ······························· 35
7-2. BLOCK DIAGRAMS – RF/SERVO SECTION – ······ 36
7-2. BLOCK DIAGRAMS – RF/SERVO SECTION – ······ 36
– AUDIO SECTION – ················································· 37
– AUDIO OUT SECTION – ······································· 38
– VIDEO SECTION – ················································· 39
– POWER SECTION – ··············································· 40
– AUDIO OUT SECTION – ······································· 38
– VIDEO SECTION – ················································· 39
– POWER SECTION – ··············································· 40
7-3. PRINTED WIRING BOARD – RF SECTION – ········ 41
7-4. SCHEMATIC DIAGRAM – RF SECTION – ············· 42
7-5. PRINTED WIRING BOARD
7-4. SCHEMATIC DIAGRAM – RF SECTION – ············· 42
7-5. PRINTED WIRING BOARD
– CHANGER SECTION – ·········································· 43
7-6. SCHEMATIC DIAGRAM
– CHANGER SECTION – ·········································· 44
7-7. PRINTED WIRING BOARD
– DVD SECTION (SIDE A) – ···································· 45
7-8. PRINTED WIRING BOARD
– DVD SECTION (SIDE B) – ···································· 46
7-9. SCHEMATIC DIAGRAM
– DVD SECTION (1/10) – ·········································· 47
7-10. SCHEMATIC DIAGRAM
– DVD SECTION (2/10) – ·········································· 48
7-11. SCHEMATIC DIAGRAM
– DVD SECTION (3/10) – ·········································· 49
7-12. SCHEMATIC DIAGRAM
– DVD SECTION (4/10) – ·········································· 50
7-13. SCHEMATIC DIAGRAM
– DVD SECTION (5/10) – ·········································· 51
7-14. SCHEMATIC DIAGRAM
– DVD SECTION (6/10) – ·········································· 52
7-15. SCHEMATIC DIAGRAM
– DVD SECTION (7/10) – ·········································· 53
7-16. SCHEMATIC DIAGRAM
– DVD SECTION (8/10) – ·········································· 54
7-17. SCHEMATIC DIAGRAM
– DVD SECTION (9/10) – ·········································· 55
7-18. SCHEMATIC DIAGRAM
– DVD SECTION (10/10) – ········································ 56
7-19. PRINTED WIRING BOARD
– AMP SECTION (SIDE A) – ···································· 57
7-20. PRINTED WIRING BOARD
– AMP SECTION (SIDE B) – ···································· 58
7-21. SCHEMATIC DIAGRAM
– AMP SECTION (1/2) – ············································ 59
7-22. SCHEMATIC DIAGRAM
– AMP SECTION (2/2) – ············································ 60
7-23. PRINTED WIRING BOARD
– AUDIO SECTION – ················································· 61
7-24. SCHEMATIC DIAGRAM
– AUDIO SECTION – ················································· 62
7-25. PRINTED WIRING BOARD
– VIDEO SECTION – ················································· 63
7-26. SCHEMATIC DIAGRAM
– VIDEO SECTION – ················································· 64
7-27. PRINTED WIRING BOARD
– DDCOM SECTION – ·············································· 65
7-28. PRINTED WIRING BOARD
– CONTROL SECTION – ·········································· 66
7-29. SCHEMATIC DIAGRAM
– DDCOM/CONTROL SECTION – ·························· 67
7-30. PRINTED WIRING BOARD
– POWER SECTION – ··············································· 68
7-31. SCHEMATIC DIAGRAM
– POWER SECTION – ··············································· 69
7-32. IC BLOCK DIAGRAMS ············································ 71
7-33. IC PIN FUNCTION DESCRIPTION ························· 82
7-33. IC PIN FUNCTION DESCRIPTION ························· 82
8. EXPLODED VIEWS
8-1. CASE SECTION ······················································· 106
8-2. FRONT PANEL SECTION ······································· 107
8-3. CHASSIS SECTION-1 ············································· 108
8-4. CHASSIS SECTION-2 ············································· 109
8-5. CHASSIS SECTION-3 ············································· 110
8-6. MECHANISM DECK SECTION-1 ························· 111
8-2. FRONT PANEL SECTION ······································· 107
8-3. CHASSIS SECTION-1 ············································· 108
8-4. CHASSIS SECTION-2 ············································· 109
8-5. CHASSIS SECTION-3 ············································· 110
8-6. MECHANISM DECK SECTION-1 ························· 111
(CDM69-DVBU16) ··················································· 111
8-7. MECHANISM DECK SECTION-2 ························· 112
(CDM69-DVBU16) ··················································· 112
8-8. MECHANISM DECK SECTION-3 ························· 113
(CDM69-DVBU16) ··················································· 113
8-9. MECHANISM DECK SECTION-4 ························· 114
(CDM69-DVBU16) ··················································· 114
8-10. MECHANISM DECK SECTION-5
(CDM69-DVBU16) ··················································· 115
8-11. MECHANISM DECK SECTION-6
(CDM69-DVBU16) ··················································· 116
8-12. BASE UNIT SECTION (DVBU16) ·························· 117
9. ELECTRICAL PARTS LIST
····································· 118
4
HCD-FC7
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output several times.
that the S curve waveform is output several times.
JIG ON REPAIRING
When repairing this set, etc., connect the extension cable as the
figure shown below.
figure shown below.
•
Service position of mechanism block
MODEL IDENTIFICATION
— BACK PANEL —
Part No.
SECTION 1
SERVICING NOTE
J-2501-103-A
(1mm/29P/L300)
(1mm/29P/L300)
RF board
RELAY board
J-2501-249-A
(1mm/28P/L300)
(1mm/28P/L300)
Model
US, Canadian models
Singapore model
Australian model
PARTS No.
4-248-520-0s
4-248-520-1s
4-248-520-2s
5
HCD-FC7
•
Service position of POWER board
POWER board
power cord
Power cord is directly connected
without going via LF board .
without going via LF board .
•
Service position of DVD board
DVD board
AMP board
J-2501-242-A
(1mm/11P/L300)
(1mm/11P/L300)
J-2501-231-A
(1mm/15P/L300)
(1mm/15P/L300)
POWER board
