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UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

•  Strong viscosity
 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

• Abbreviation
  AR 

: Argentina model

  E2 

: 120V AC area in E model

  E4 

: 220 – 240V AC area in E model

  E51 

: Chilean and Peruvian models

  EA 

: Saudi Arabia model

  MX 

: Mexican model

EX99: MX model

4-263-771-0[]

EX99: AR model

4-263-772-0[]

EX88: E2, E51 models

4-263-773-0[]

EX88: MX model

4-263-774-0[]

EX88: AR model

4-263-775-0[]

EX66: E4 model

4-263-778-0[]

EX66: EA model

4-263-779-0[]

EX66: E2, E51 models

4-263-780-0[]

EX66: AR model

4-263-782-0[]

EX99: E2, E51 models

*

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1.  Press [

?/1

] button to turn the power on.

2.  Press the [FUNCTION] button to select CD function.
3.  While pressing the [

x

] button for more 5 seconds.

4.  The message “CHILD LOCK OFF” is displayed and the disc 

tray is unlocked.

Note: When “CHILD LOCK ON” is displayed, the slot lock is not re-

leased by turning power on/off with the [?/1] button.

*

: Since the HCD-EX99: E2 and E51 models have their model 

number labels marked directly on the back panel, the model 
number labels have no relative part numbers.

  Because of this, determine the model through the marked model 

number when comparing the difference between these models.

:/2 W

:/2 W

When installing a new OP unit, be sure to connect the fl exible 
printed circuit board fi rst of all before removing the static electric-
ity prevention solder bridge by unsoldering. 
Remove the static electricity prevention solder bridge by unsolder-
ing after the fl exible printed circuit board has already been con-
nected. 
(Do not remove nor unsolder the solder bridge as long as the OP 
unit is kept standalone.)