DOWNLOAD Sony HCD-EC719IP / HCD-EC919IP Service Manual ↓ Size: 6.51 MB | Pages: 38 in PDF or view online for FREE

2013K33-1

© 

2013.11

•  HCD-EC719iP is compact disc receiver in MHC-EC719iP.
•  HCD-EC919iP is compact disc receiver in MHC-EC919iP.

Model Name Using Similar Mechanism

NEW

Mechanism Type

TDL-5

Photo: HCD-EC919iP

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  0  SUR  
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES  
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  FONC-
TIONNEMENT.  NE  REMPLACER  CES  COMPOSANTS  QUE  
PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  DON-
NÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS  
PUBLIÉS  PAR  SONY.

 .............................................  

4

2-1. Disassembly 

Flow 

...........................................................   7

2-2.  Side Cover, Top Cover Block .........................................   8
2-3.  Power Cord (AC1), Rear Panel Block ............................   9
2-4. CD 

Door 

..........................................................................  10

2-5.  Front Panel Block ...........................................................   10
2-6.  MAIN Board Block ........................................................   11
2-7. MAIN 

Board 

...................................................................  11

2-8. POWER 

Board 

................................................................  12

2-9. FRONT 

Board 

.................................................................  13

2-10. USB Board ......................................................................   14
2-11.  Loader with FFC (TDL-5) (CDM1) ...............................   14

 ............................................................   15

 .........................................   15

5-1. Block 

Diagram 

................................................................  16

5-2.  Printed Wiring Board - MAIN Board - ...........................   18
5-3.  Schematic Diagram - MAIN Board (1/7) - .....................   19

5-4.  Schematic Diagram - MAIN Board (2/7) - .....................   20
5-5.  Schematic Diagram - MAIN Board (3/7) - .....................   21
5-6.  Schematic Diagram - MAIN Board (4/7) - .....................   22
5-7.  Schematic Diagram - MAIN Board (5/7) - .....................   23
5-8.  Schematic Diagram - MAIN Board (6/7) - .....................   24
5-9.  Schematic Diagram - MAIN Board (7/7) - .....................   25
5-10.  Printed Wiring Board - FRONT Board - .........................   26
5-11.  Schematic Diagram - FRONT Board - ...........................   27
5-12.  Printed Wiring Board - POWER Board - ........................   28
5-13.  Schematic Diagram - POWER Board - ..........................   29
5-14. Schematic Diagram 

- USB/TUNER/DOCKING Boards - ..............................   30

5-15. Printed Wiring Boards 

- USB/TUNER/DOCKING Boards - ..............................   31

6-1. Cover 

Section 

..................................................................  32

6-2.  Rear Panel Section ..........................................................   33
6-3.  Front Panel Section .........................................................   34
6-4. Main 

Section 

...................................................................  35

 ..............................   36

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

ABOUT  PART  REPAIR  OF  EACH  BOARD
When boards installed by this unit are defective, replace the com-
plete board. However, AMP IC (U481, U482 and U483 (U483 is 
EC919iP only)) on the MAIN board and fuse (F501) on the POW-
ER board are replaceable.
Printed wiring board and schematic diagram that have been de-
scribed on this service manual are for reference.

TEST  DISCS
Use following TEST DISC (for CD) when this unit confi rms the 
operation and checks it.

Part No.

   

Description

3-702-101-01 DISC 

(YEDS-18), 

TEST

4-225-203-01 DISC 

(PATD-012), 

TEST

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of sample disc in the 
shop is equipped.

Releasing Procedure:
1.  Press the [

?/1

] button to turn the power on.

2.  Press two buttons of the [x] and [Z] simultaneously for fi ve 

seconds.

3.  The message “UNLOCKED” is displayed on the fluorescent 

indicator tube and the disc tray is unlocked.

Note: When “LOCKED” is displayed, the disc tray lock is not released by 

turning power on/off with the [?/1] button.

CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING
When checking the board, the electrical discharge is necessary for 
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.

• POWER 

Board

 CE503, 

CE504

:/2 W

:/2 W