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2009I05-1

© 

2009.09

•  HCD-EC69 is the amplifi er, USB, CD player and 

tuner section in MHC-EC69.

•  HCD-EC79 is the amplifi er, USB, CD player and 

tuner section in MHC-EC79.

•  HCD-EC99 is the amplifi er, USB, CD player and 

tuner section in MHC-EC99.

Photo: HCD-EC99

• “WALKMAN” and “WALKMAN” logo are registered trademarks of Sony Corporation.

• MICROVAULT is a trademark of Sony Corporation.

• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and 

Thomson.

• Windows Media is a registered trademark of Microsoft Corporation in the United States 

and/or other countries.

The following measured at AC 230 V, 50/60 Hz (European and 
Russian models)
The following measured at AC 120, 127, 220, 240 V, 50/60 Hz 
(Other models) 

Front Speaker:
Power output (rated):

Low channel
50 W + 50 W (at 8 Ω, 1 kHz, 1% THD)
High channel
50 W + 50 W (at 8 Ω, 8 kHz, 1% THD)

RMS output power (reference):

Low channel
65 W + 65 W (per channel at 8 Ω, 1 kHz, 10% THD)
High channel
65 W + 65 W (per channel at 8 Ω, 8 kHz, 10% THD)

Subwoofer:
RMS output power (reference):

90 W (at 4 Ω, 80 Hz, 10% THD)

Power output (rated):

Low channel
55 W + 55 W (at 8 Ω, 1 kHz, 1% THD)
High channel
55 W + 55 W (at 8 Ω, 8 kHz, 1% THD)

RMS output power (reference):

Low channel
75 W + 75 W (per channel at 8 Ω, 1 kHz, 10% THD)
High channel
75 W + 75 W (per channel at 8 Ω, 8 kHz, 10% THD)

Power output (rated):

50 W + 50 W (at 6 Ω, 1 kHz, 1% THD)

RMS output power (reference):

70 W + 70 W (per channel at 6 Ω, 1 kHz, 10% THD)

PC IN (stereo mini jack):

Sensitivity 800 mV, impedance 22 kilohms

PHONES (stereo mini jack): 

accepts headphones with an impedance of 
8 Ω or more

SPEAKER: impedance

HCD-EC79/EC99: 8 Ω
HCD-EC69: 6 Ω

SUBWOOFER (HCD-EC99 only): impedance 4 Ω

Supported bit rate:

MP3 (MPEG 1 Audio Layer-3)/WMA/AAC: 32 

− 320 kbps, 

VBR

Sampling frequencies:

MP3 (MPEG 1 Audio Layer-3)/WMA/AAC: 32/44.1/48 kHz

 (USB) port: 

Maximum current: 500 mA

System: 

Compact disc and digital audio system

Laser Diode Properties

Emission Duration: Continuous
Laser Output*: Less than 44.6μW
*

measurement at a distance of 200mm from 
the objective lens surface on the Optical 
Pick-up Block with 7mm aperture.

Frequency response: 20 Hz 

− 20 kHz

Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB

This output is the value

FM stereo, FM/AM superheterodyne tuner Antenna:

FM lead antenna
AM loop antenna

FM tuner section:

Tuning range:

87.5 

− 108.0 MHz (50 kHz step)

Intermediate frequency: 10.7 MHz

AM tuner section:

Tuning range
European and Russian models:

531 

− 1,602 kHz (with 9 kHz tuning interval)

Latin American models:

530 

− 1,710 kHz (with 10 kHz tuning interval)

531 

− 1,710 kHz (with 9 kHz tuning interval)

Other models:

531 

− 1,602 kHz (with 9 kHz tuning interval)

530 

− 1,610 kHz (with 10 kHz tuning interval)

Intermediate frequency: 450 kHz

Power requirements

European and Russian models: 

Mexican model: 

Argentine model: 

Other models:
AC 120, 220, 230 

− 240 V, 50/60 Hz, adjustable with voltage 

selector

Power consumption

HCD-EC99: 175 W (0.5 W at the Power Saving Mode)
HCD-EC79: 170 W (0.5 W at the Power Saving Mode)
HCD-EC69: 110 W (0.5 W at the Power Saving Mode)

Dimensions (w/h/d) (excl. speakers)

Approx. 200 × 306 × 415 mm

Mass (excl. speakers)

HCD-EC99: Approx. 6.5 kg
HCD-EC79: Approx. 6.4 kg
HCD-EC69: Approx. 5.4 kg

Design and specifications are subject to change without notice.

AC 220 V, 50/60 Hz

AC 127 V, 60 Hz

AC 230 V, 50/60 Hz

Model Name Using Similar Mechanism

HCD-EC78

Mechanism Type

CDM88A-K6BD90-WOD

Base Unit Name

BU-K6BD90-WOD

Optical Pick-up Block Name

KSM-213DCP

 .............................................  

3

 ..................................................................  

6

3-1. Disassembly 

Flow 

...........................................................   8

3-2.  Side Panel (L)/(R) ...........................................................   9
3-3. Panel 

(Top) 

......................................................................   9

3-4. MAIN 

Board 

...................................................................  10

3-5.  Front Panel Block ...........................................................   10
3-6.  Back Panel Block ............................................................   11
3-7.  CD Mechanism Block .....................................................   11
3-8. Base 

Unit 

.........................................................................  12

3-9.  OP Base Assy (KSM-213D) ...........................................   12
3-10. Belt (DLM3A) ................................................................   13

TEST  MODE 

 ............................................................   14

ADJUSTMENTS 

 ........................   18

6-1.  Block Diagram - CD, TUNER Section - ........................   20
6-2.  Block Diagram - MAIN Section - ...................................   21
6-3. Block 

Diagram 

 

- PANEL, POWER SUPLLY Section - ...........................   22

6-4.  Printed Wiring Board - CD Board - ................................   24
6-5.  Schematic Diagram - CD Board - ...................................   25
6-6.  Printed Wiring Board - USB Board - ..............................   26
6-7.  Schematic Diagram - USB Board - .................................   27
6-8.  Schematic Diagram - MAIN Board (1/2) - .....................   28
6-9.  Schematic Diagram - MAIN Board (2/2) - .....................   29
6-10.  Printed Wiring Board - MAIN Board - ...........................   30
6-11.  Printed Wiring Boards - AMP Section -..........................   31
6-12.  Schematic Diagram - 2CH-4CH AMP Board - ...............   32
6-13.  Schematic Diagram - 3CH AMP Board (EC99) - ...........   33
6-14.  Printed Wiring Board - PANEL Board - .........................   34
6-15.  Schematic Diagram - PANEL Board - ............................   35
6-16.  Printed Wiring Boards - AUDIO IN/OUT, KEY, 
 

POWER SUPPLY Section - ............................................   36

6-17.  Schematic Diagram - AUDIO IN/OUT, KEY, POWER 

SUPPLY Section - ...........................................................   37

 

7-1. Panel 

Section 

...................................................................  45

7-2.  Front Panel Section .........................................................   46
7-3. Chassis 

Section 

...............................................................  47

7-4. Main 

Section 

...................................................................  48

7-5.  CD Mechanism Section (CDM88A-K6BD90-WOD) ....   49

  ..............................   50

Accessories are given in the last of the electrical parts list.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

This appliance is classifi ed as 
a CLASS 1 LASER product.
This marking is located on the 
rear or bottom exterior.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

RELEASING  THE  DISC  TRAY  LOCK 
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1. Press 

[

?

/

1

] button to turn the power on.

2.  Press the [FUNCTION] button to select CD function.
3.  While pressing the [

x

] button, press the [

Z

] button for more 5 

seconds).

4.  The message “UNLOCKED” is displayed and the disc tray is 

unlocked.

Note: When “LOCKED” is displayed, the slot lock is not released by turn-

ing power on/off with the [?/1] button.

EC69: AEP

4-133-259-0[]

EC69: RU

4-133-260-0[]

EC69: E2, E51

4-133-263-0[]

EC69: MX

4-133-261-0[]

EC69: AR

4-133-262-0[]

EC79: AEP

4-133-249-0[]

EC79: E2, E51

4-133-253-0[]

EC79: MX

4-133-251-0[]

EC79: AR

4-133-252-0[]

EC99: AEP

4-133-243-0[]

EC99: RU

4-133-244-0[]

EC99: E2, E51

4-133-247-0[]

EC99: MX

4-133-245-0[]

EC99: AR

4-133-246-0[]

• Abbreviation
 AR  : 

Argentina 

model

  E2 

: 120V AC area in E model

  E51 

: Chilean and Peruvian models

  MX 

: Mexican model

  RU 

: Russian model

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

1 Turn a gear by a driver 

2 Pull the tray by the hand.