DOWNLOAD Sony HCD-EC68W / MHC-EC68W Service Manual ↓ Size: 3.08 MB | Pages: 56 in PDF or view online for FREE

Model
HCD-EC68W MHC-EC68W
Pages
56
Size
3.08 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-ec68w-mhc-ec68w.pdf
Date

Sony HCD-EC68W / MHC-EC68W Service Manual ▷ View online

SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-EC68W
SPECIFICATIONS
COMPACT DISC DECK RECEIVER
9-889-417-01
2009C05-1
© 
2009.03
Mexican Model
Ver. 1.0  2009.03
•  HCD-EC68W is the amplifi er, CD player, tape 
deck and tuner section in MHC-EC68W.
section
Power output (rated):
50 W + 50 W (at 6 Ω, 1 kHz, 1% THD)
RMS output power (reference):
70 W + 70 W (per channel at 6 Ω, 1 kHz, 10% THD)
Inputs
AUDIO IN (stereo mini jack): Sensitivity 800 mV, impedance
22 kilohms
Outputs
PHONES (stereo mini jack): Accepts headphones with an
impedance of 8 Ω or more
SPEAKER: impedance
6 Ω
CD player section
System: Compact disc and digital audio system
Laser: Semiconductor laser (
λ
=770 – 810 nm)
Emission duration: continuous
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB
Tape deck section
Recording system: 4-track 2-channel, stereo
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM lead antenna
AM loop antenna
FM tuner section:
Tuning range:
87.5 – 108.0 MHz (50 kHz step)
Intermediate frequency: 10.7 MHz
AM tuner section:
Tuning range
530 – 1,710 kHz (with 10 kHz tuning interval)
531 – 1,710 kHz (with 9 kHz tuning interval)
Intermediate frequency: 450 kHz
General
Power requirements:
AC 127 V, 60 Hz
Power consumption:
100 W
Dimensions (w/h/d) (excl. speakers):
Approx. 200 × 306 × 415 mm
Mass (excl. speakers):
Approx. 5.3 kg
CD
Section
Model Name Using Similar Mechanism
HCD-EC68
Mechanism Type
CDM88A-K6BD90-WOD
Optical Pick-up Block Name
KSM-213DCP
Tape deck 
Section 
Model Name Using Similar Mechanism
HCD-EC68
Tape Transport Mechanism Type
TCM-J1 or 
CS-21SC-900TP
HCD-EC68W
2
1. 
SERVICING  NOTES
  .............................................   3
2. GENERAL
  ..................................................................   6
3. DISASSEMBLY
3-1. Disassembly 
Flow 
...........................................................   8
3-2. Side 
Panel 
(L)/(R) 
...........................................................   9
3-3.  Top Panel Block ..............................................................   9
3-4.  Tape Mechanism Deck ....................................................   10
3-5. MAIN 
Board 
...................................................................  10
3-6.  Front Panel Section .........................................................   11
3-7.  Back Panel Block ............................................................   11
3-8. CD 
Mechanism 
Block 
.....................................................  12
3-9. BU 
Block 
........................................................................  12
3-10.  OP Base Assy (KSM-213D) ...........................................   13
3-11. Belt (DLM3A) ................................................................   13
4. 
TEST  MODE 
 ............................................................   14
5. MECHANICAL 
 
ADJUSTMENTS 
 ......................   18
6. ELECTRICAL 
 
ADJUSTMENTS 
 ........................   18
7. DIAGRAMS
7-1.  Printed Wiring Board - CD Board - ................................   24
7-2.  Schematic Diagram - CD Board - ...................................   25
7-3.  Printed Wiring Board - DECK Board - ...........................   26
7-4.  Schematic Diagram - DECK Board - .............................   26
7-5.  Printed Wiring Board - MAIN Board - ...........................   27
7-6.  Schematic Diagram - MAIN Board (1/2) - .....................   28
7-7.  Schematic Diagram - MAIN Board (2/2) - .....................   29
7-8.  Printed Wiring Board - PANEL Board - .........................   30
7-9.  Schematic Diagram - PANEL Board - ............................   31
7-10. Printed Wiring Boards 
- AUDIO IN/OUT, KEY, POWER SUPPLY Section - ...   32
7-11. Schematic Diagram 
- AUDIO IN/OUT, KEY, POWER SUPPLY Section - ...   33
8. 
EXPLODED  VIEWS
8-1. Panel 
Section 
...................................................................  39
8-2.  Tape Deck Section ..........................................................   40
8-3.  Front Panel Section .........................................................   41
8-4. Chassis 
Section 
...............................................................  42
8-5. Main 
Section 
...................................................................  43
8-6.  CD Mechanism Section (CDM88A-K6BD90-WOD) ....   44
9. 
ELECTRICAL  PARTS  LIST
  ..............................   45
TABLE  OF  CONTENTS
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classifi ed as 
a CLASS 1 LASER product.
This marking is located on the 
rear exterior.
HCD-EC68W
3
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the 
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1. Press 
[
?/1
] button to turn the power on.
2.  Press the [FUNCTION] button to select CD function.
3.  While pressing the [
x
] button, press the [
Z
] button for more 5 
seconds).
4.  The message “UNLOCKED” is displayed and the disc tray is 
unlocked.
Note: When 
LOCKED
 is displayed, the slot lock is not released by 
turning power on/off with the
 [
?/1
]
 button.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
HCD-EC68W
4
HOW  TO  REMOVE  THE  KNOB (VOL)
HOW  TO  OPEN  THE  TRAY  WHEN  POWER  SWITCH  TURN  OFF
 door (CD)
 pull the tray by the hand.
 Turn a gear by a driver 
 
till a lever falls down 
 
to the position of the figure.
lever
state of opening the CD tray
gear
Note:
 Please take out the side panel (R) from a set refer to DISASSEMBLY (page 9).
 knob (VOL)
hole
Push the knob (VOL) by the flat head driver.
front panel block 
(back view) 
Page of 56
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Sony HCD-EC68W / MHC-EC68W Service Manual ▷ Download

  • DOWNLOAD Sony HCD-EC68W / MHC-EC68W Service Manual ↓ Size: 3.08 MB | Pages: 56 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Sony HCD-EC68W / MHC-EC68W in PDF for free, which will help you to disassemble, recover, fix and repair Sony HCD-EC68W / MHC-EC68W Audio. Information contained in Sony HCD-EC68W / MHC-EC68W Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.