Sony HCD-EC68W / MHC-EC68W Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-EC68W
SPECIFICATIONS
COMPACT DISC DECK RECEIVER
9-889-417-01
2009C05-1
©
2009.03
Mexican Model
Ver. 1.0 2009.03
• HCD-EC68W is the amplifi er, CD player, tape
deck and tuner section in MHC-EC68W.
section
Power output (rated):
50 W + 50 W (at 6 Ω, 1 kHz, 1% THD)
50 W + 50 W (at 6 Ω, 1 kHz, 1% THD)
RMS output power (reference):
70 W + 70 W (per channel at 6 Ω, 1 kHz, 10% THD)
Inputs
AUDIO IN (stereo mini jack): Sensitivity 800 mV, impedance
22 kilohms
22 kilohms
Outputs
PHONES (stereo mini jack): Accepts headphones with an
impedance of 8 Ω or more
SPEAKER: impedance
6 Ω
impedance of 8 Ω or more
SPEAKER: impedance
6 Ω
CD player section
System: Compact disc and digital audio system
Laser: Semiconductor laser (
λ
=770 – 810 nm)
Emission duration: continuous
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB
Tape deck section
Recording system: 4-track 2-channel, stereo
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
Antenna:
FM lead antenna
AM loop antenna
AM loop antenna
FM tuner section:
Tuning range:
87.5 – 108.0 MHz (50 kHz step)
Intermediate frequency: 10.7 MHz
87.5 – 108.0 MHz (50 kHz step)
Intermediate frequency: 10.7 MHz
AM tuner section:
Tuning range
530 – 1,710 kHz (with 10 kHz tuning interval)
531 – 1,710 kHz (with 9 kHz tuning interval)
Intermediate frequency: 450 kHz
530 – 1,710 kHz (with 10 kHz tuning interval)
531 – 1,710 kHz (with 9 kHz tuning interval)
Intermediate frequency: 450 kHz
General
Power requirements:
AC 127 V, 60 Hz
Power consumption:
100 W
Dimensions (w/h/d) (excl. speakers):
Approx. 200 × 306 × 415 mm
Mass (excl. speakers):
Approx. 5.3 kg
CD
Section
Section
Model Name Using Similar Mechanism
HCD-EC68
Mechanism Type
CDM88A-K6BD90-WOD
Optical Pick-up Block Name
KSM-213DCP
Tape deck
Section
Section
Model Name Using Similar Mechanism
HCD-EC68
Tape Transport Mechanism Type
TCM-J1 or
CS-21SC-900TP
CS-21SC-900TP
HCD-EC68W
2
1.
SERVICING NOTES
............................................. 3
2. GENERAL
.................................................................. 6
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 8
3-2. Side
Panel
(L)/(R)
........................................................... 9
3-3. Top Panel Block .............................................................. 9
3-4. Tape Mechanism Deck .................................................... 10
3-5. MAIN
3-4. Tape Mechanism Deck .................................................... 10
3-5. MAIN
Board
................................................................... 10
3-6. Front Panel Section ......................................................... 11
3-7. Back Panel Block ............................................................ 11
3-8. CD
3-7. Back Panel Block ............................................................ 11
3-8. CD
Mechanism
Block
..................................................... 12
3-9. BU
Block
........................................................................ 12
3-10. OP Base Assy (KSM-213D) ........................................... 13
3-11. Belt (DLM3A) ................................................................ 13
3-11. Belt (DLM3A) ................................................................ 13
4.
TEST MODE
............................................................ 14
5. MECHANICAL
ADJUSTMENTS
...................... 18
6. ELECTRICAL
ADJUSTMENTS
........................ 18
7. DIAGRAMS
7-1. Printed Wiring Board - CD Board - ................................ 24
7-2. Schematic Diagram - CD Board - ................................... 25
7-3. Printed Wiring Board - DECK Board - ........................... 26
7-4. Schematic Diagram - DECK Board - ............................. 26
7-5. Printed Wiring Board - MAIN Board - ........................... 27
7-6. Schematic Diagram - MAIN Board (1/2) - ..................... 28
7-7. Schematic Diagram - MAIN Board (2/2) - ..................... 29
7-8. Printed Wiring Board - PANEL Board - ......................... 30
7-9. Schematic Diagram - PANEL Board - ............................ 31
7-10. Printed Wiring Boards
7-2. Schematic Diagram - CD Board - ................................... 25
7-3. Printed Wiring Board - DECK Board - ........................... 26
7-4. Schematic Diagram - DECK Board - ............................. 26
7-5. Printed Wiring Board - MAIN Board - ........................... 27
7-6. Schematic Diagram - MAIN Board (1/2) - ..................... 28
7-7. Schematic Diagram - MAIN Board (2/2) - ..................... 29
7-8. Printed Wiring Board - PANEL Board - ......................... 30
7-9. Schematic Diagram - PANEL Board - ............................ 31
7-10. Printed Wiring Boards
- AUDIO IN/OUT, KEY, POWER SUPPLY Section - ... 32
7-11. Schematic Diagram
- AUDIO IN/OUT, KEY, POWER SUPPLY Section - ... 33
8.
EXPLODED VIEWS
8-1. Panel
Section
................................................................... 39
8-2. Tape Deck Section .......................................................... 40
8-3. Front Panel Section ......................................................... 41
8-4. Chassis
8-3. Front Panel Section ......................................................... 41
8-4. Chassis
Section
............................................................... 42
8-5. Main
Section
................................................................... 43
8-6. CD Mechanism Section (CDM88A-K6BD90-WOD) .... 44
9.
ELECTRICAL PARTS LIST
.............................. 45
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
HCD-EC68W
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press
1. Press
[
?/1
] button to turn the power on.
2. Press the [FUNCTION] button to select CD function.
3. While pressing the [
3. While pressing the [
x
] button, press the [
Z
] button for more 5
seconds).
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When
“
LOCKED
”
is displayed, the slot lock is not released by
turning power on/off with the
[
?/1
]
button.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
HCD-EC68W
4
HOW TO REMOVE THE KNOB (VOL)
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
door (CD)
pull the tray by the hand.
Turn a gear by a driver
till a lever falls down
to the position of the figure.
lever
state of opening the CD tray
gear
Note:
Please take out the side panel (R) from a set refer to DISASSEMBLY (page 9).
knob (VOL)
hole
Push the knob (VOL) by the flat head driver.
front panel block
(back view)
(back view)