DOWNLOAD Sony HCD-EC599 / MHC-EC599 Service Manual ↓ Size: 2.44 MB | Pages: 46 in PDF or view online for FREE

2012J08-1

© 

2012.10

•  HCD-EC599 is the amplifi er, USB, CD player 

and tuner section in MHC-EC599.

Model Name Using Similar Mechanism

HCD-EX600

Base Unit Name

BU-D1BD76

Optical Pick-up Block Name

DA11MMVGP

•  MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson.
•  Windows Media is either a registered trademark or trademark of Microsoft Corporation in the 

United States and/or other countries.

•  This product is protected by certain intellectual property rights of Microsoft Corporation. Use or 

distribution of such technology outside of this product is prohibited without a license from Micro-
soft or an authorized Microsoft subsidiary.

Argentina model
The following are measured at AC 220 V,
50/60 Hz
Power output (rated):
 

30 W + 30 W (at 6 ohms, 1 kHz,

 1% 

THD)

Other models
The following are measured at
Mexican model:
 

AC 127 V, 60 Hz

Other models:
 

AC 120 V, 220 V, 240 V, 50/60 Hz

Power output (rated):
 

30 W + 30 W (at 6 ohms, 1 kHz,

 1% 

THD)

RMS output power (reference):
 

60 W + 60 W (per channel at 6 ohms,

 1 

kHz)

Inputs
DVD/PC IN L/R
 

Voltage 1.5 V, impedance 47 kilohms

  (USB) port: Type A

Outputs
PHONES (stereo mini jack)
 

Accepts headphones with an

 

impedance of 8 ohms or more

USB section
Supported bit rate
 

MP3 (MPEG 1 Audio Layer-3):

 

32 kbps – 320 kbps, VBR

 

WMA: 48 kbps – 192 kbps

 

AAC: 48 kbps – 320 kbps

Sampling frequencies
 

MP3 (MPEG 1 Audio Layer-3):

 32/44.1/48 

kHz

 

WMA: 44.1 kHz

 

AAC: 44.1 kHz

Supported USB device
 

Mass Storage Class

Maximum current
 500 

mA

Disc player section
System
 

Compact disc and digital audio system

Laser Diode Properties
 

Emission Duration: Continuous

 

Laser Output*: Less than 44.6 μW

 

* This output is the value measurement

 

   at a distance of 200 mm from the

 

   objective lens surface on the Optical

 

   Pick-up Block with 7 mm aperture.

Frequency response
 

20 Hz – 20 kHz

Signal-to-noise ratio
 

More than 90 dB

Dynamic range
 

More than 88 dB

Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna
 

FM lead antenna

 

AM loop antenna

FM tuner section
Tuning range
 

87.5 MHz – 108.0 MHz (50 kHz step)

AM tuner section
Tuning range
 

530 kHz – 1,710 kHz (10 kHz step)

 

531 kHz – 1,710 kHz (9 kHz step)

Standby power consumption: 0.5 W

Design and specifi cations are subject to
change without notice.

•  “WALKMAN” and “WALKMAN” logo are registered trademarks of Sony Corporation.
•  MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson.
•  Windows Media is either a registered trademark or trademark of Microsoft Corporation in the 

United States and/or other countries.

•  This product contains technology subject to certain intellectual property rights of Microsoft.
 

Use or distribution of this technology outside of this product is prohibited without the appropriate 
license(s) from Microsoft.

 .............................................   3

2-1. Disassembly 

Flow 

...........................................................   6

2-2.  Side Panel (L)/(R) ...........................................................   6
2-3. Top 

Panel 

Assy 

................................................................   7

2-4.  Front Panel Block ...........................................................   7
2-5. Knob 

(VOLUME) 

...........................................................   8

2-6. POWER 

Board 

................................................................   8

2-7.  Base Unit (BU-D1BD76) ................................................   9
2-8.  Optical Pick-up Block (DA11MMVGP) ........................   9

TEST  MODE 

 ............................................................   10

ELECTRICAL  CHECKS 

 ......................................   12

5-1.  Block Diagram - CD/USB Section - ...............................   13
5-2.  Block Diagram - MAIN Section - ...................................   14
5-3.  Block Diagram - DISPLAY/POWER Section - ..............   15
5-4.  Printed Wiring Board - BD76 Board - ............................   17
5-5.  Schematic Diagram - BD76 Board (1/2) - ......................   18
5-6.  Schematic Diagram - BD76 Board (2/2) - ......................   19
5-7.  Printed Wiring Boards - PANEL Board - ........................   20
5-8.  Schematic Diagram - PANEL Board (1/2) - ...................   21
5-9.  Schematic Diagram - PANEL Board (2/2) - ...................   22
5-10. Printed Wiring Boards 
 

- POWER and TRANS Boards - .....................................   23

5-11.  Schematic Diagram - POWER Board - ..........................   24
5-12.  Schematic Diagram - TRANS Board - ...........................   25
5-13.  Printed Wiring Board - TUNER1 Board - ......................   26
5-14.  Schematic Diagram - TUNER1 Board - .........................   26

 

6-1. Overall 

Section 

...............................................................  34

6-2.  Front Panel Section .........................................................   35
6-3. Chassis 

Section 

...............................................................  36

6-4.  Top Panel Section ...........................................................   37

  ..............................   38

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 

repairing.

•  Do not touch the soldering iron on the same conductor of the 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering 

or unsoldering.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

This appliance is classifi ed as 
a CLASS 1 LASER product.
This marking is located on the 
rear exterior.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

LASER  DIODE  AND  FOCUS  SEARCH  OPERATION  
CHECK
During normal operation of the equipment, emission of the laser 
diode is prohibited unless the upper lid is closed while turning on 
the SW305 (push switch type).
The following checking method for the laser diode is operable.

• Method
  Emission of the laser diode is visually checked.
  1.  Open the upper lid.
  2.  Push the SW305 as shown in Fig. 1.

Note: Do not push the detection lever strongly, or it may be bent or 

damaged.

  3.  Check the object lens for confi rming normal emission of the 

laser diode. If not emitting, there is a trouble in the automatic 
power control circuit or the optical pick-up.

    In this operation, the object lens will move up and down 2 

times along with inward motion for the focus search.

CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING
When checking the board, the electrical discharge is necessary for 
the electric shock prevention. Connect the resistors referring to the 
fi gure below.

•  POWER board (C734, C735, C736)
  Both ends of respective capacitors.

•  SIDE PANEL (L) was removed.

MODEL  IDENTIFICATION
Distinguish the destination by referring to the model number label or the model number plate or the sculpture of back panel .

4-413-837-0s AR2

4-413-838-0s MX4

Back Panel

MODEL NUMBER LABEL

Sculpture

Back Panel