DOWNLOAD Sony HCD-EC59 / HCD-EC590 / MHC-EC59 / MHC-EC590 Service Manual ↓ Size: 2.6 MB | Pages: 44 in PDF or view online for FREE

2012B33-1

© 

2012.02

•  HCD-EC59 is the amplifi er, USB, CD player and 

tuner section in MHC-EC59.

•  HCD-EC590 is the amplifi er, USB, CD player 

and tuner section in MHC-EC590.

Model Name Using Similar Mechanism

HCD-EX6/EX6T

Base Unit Name

BU-D1BD74UR

Optical Pick-up Block Name

DA11MMVGP

•  MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson.
•  Windows Media is either a registered trademark or trademark of Microsoft Corporation in the 

United States and/or other countries.

•  This product is protected by certain intellectual property rights of Microsoft Corporation. Use or 

distribution of such technology outside of this product is prohibited without a license from Micro-
soft or an authorized Microsoft subsidiary.

The following measured at AC 127 V, 60 Hz 
(Mexican model)
The following measured at AC 220 V, 
50/60 Hz (Argentine model)
The following measured at AC 120 V, 220 V, 
240 V, 50/60 Hz (Other models)

HCD-EC59
Power output (rated):

25 W + 25 W (at 6 Ω, 1 kHz, 1% 
THD)

RMS output power (reference):

HCD-EC590
Power output (rated):
 

30W + 30W (at 6 Ω, 1kHz, 1% 

 THD)

60 W + 60 W (per channel at 6 Ω,  
1 kHz)

PC IN (stereo mini jack):

Sensitivity 800 mV, impedance 
22 kilohms

PHONES (stereo mini jack): 

accepts headphones with an 
impedance of 8 Ω or more

SPEAKERS: impedance: 6 Ω

Supported bit rate:

MP3 (MPEG 1 Audio Layer-3): 
32 kbps – 320 kbps, VBR 
WMA: 48 kbps – 192 kbps
AAC: 48 kbps – 320 kbps

Sampling frequencies:

MP3 (MPEG 1 Audio Layer-3): 
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz

 (USB) port: 

Maximum current:
500 mA

System: 

Compact disc and digital audio 
system

Laser Diode Properties

Emission Duration: Continuous
Laser Output*: Less than 44.6μW
* This output is the value  

measurement at a distance of 
200mm from the objective lens 
surface on the Optical Pick-up Block 
with 7mm aperture.

Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 88 dB

FM stereo, FM/AM superheterodyne tuner
Antenna:

FM lead antenna
AM loop antenna

FM tuner section:
Tuning range:

87.5 MHz – 108.0 MHz (50 kHz step)

Intermediate frequency: 225 kHz

AM tuner section:
Tuning range
Latin American models:

530 kHz – 1,710 kHz (10 kHz step)
531 kHz – 1,710 kHz (9 kHz step)

Other models:

531 kHz – 1,602 kHz (9 kHz step)
530 kHz – 1,610 kHz (10 kHz step)

Intermediate frequency: 53 kHz

Power requirements

Mexican model:
AC 127 V, 60 Hz
Argentine model:
AC 220 V, 50/60 Hz
Other models:
AC 120 V, 220 V or 230 V – 240 V, 
50/60 Hz, adjustable with voltage 
selector

Power consumption: 85 W

(0.5 Wat the Power Saving Mode) 

Dimensions (W/H/D) (excl. speakers)

Approx. 200 mm × 306 mm × 
305 mm

Mass (excl. speakers): Approx. 3.8 kg

Design and specifications are subject to 
change without notice.

Standby power consumption: 0.5 W
Halogenated flame retardants are not used 
in the certain printed wiring boards.

Photo: HCD-EC59

 .............................................   3

2-1. Disassembly 

Flow 

...........................................................   6

2-2.  Side Panel (L)/(R) ...........................................................   7
2-3. Top 

Panel 

Assy 

................................................................   7

2-4.  Front Panel Block ...........................................................   8
2-5. Knob 

(VOL) 

....................................................................   8

2-6. MAIN 

Board 

...................................................................   9

2-7.  Base Unit (BU-D1BD74UR) ..........................................   10
2-8.  Optical Pick-up Block (DA11MMVGP) ........................   10

TEST  MODE 

 ............................................................   11

ELECTRICAL  CHECKS 

 ......................................   13

5-1.  Printed Wiring Board - CD Section - ..............................   18
5-2.  Schematic Diagram - CD Section - .................................   19
5-3.  Printed Wiring Board - USB Section - ............................   20
5-4.  Schematic Diagram - USB Section - ..............................   21
5-5.  Printed Wiring Boards - MAIN Section - .......................   22
5-6.  Schematic Diagram - MAIN Section - ...........................   23
5-7. Printed 

Wiring 

Boards 

 

- 2CH AMP/USB-JACK/JACK Boards - .......................   24

5-8. Schematic 

Diagram 

 

- 2CH AMP/USB-JACK/JACK Boards - .......................   25

5-9.  Printed Wiring Board - PANEL Board - .........................   26
5-10.  Schematic Diagram - PANEL Board - ............................   27
5-11. Printed Wiring Board 
 

- PT-SWITCH Board (SUFFIX-11) - .............................   28

5-12. Printed Wiring Board 
 

- PT-SWITCH Board (SUFFIX-12)  - ............................   28

5-13.  Schematic Diagram - PT-SWITCH Board - ...................   29

 

6-1. Overall 

Section 

...............................................................  32

6-2.  Front Panel Section .........................................................   33
6-3. Chassis 

Section 

...............................................................  34

6-4.  Top Panel Section ...........................................................   35

  ..............................   36

Accessories are given in the last of the electrical parts list.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 

repairing.

•  Do not touch the soldering iron on the same conductor of the 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering 

or unsoldering.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

This appliance is classifi ed as 
a CLASS 1 LASER product.
This marking is located on the 
rear exterior.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

Note: Refer to the “2CH AMP AND  PT-SWITCH BOARDS 

DISCRIMINATION” (page 14) for how to distinguish 
SUFFIX-11 and SUFFIX-12.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

LASER  DIODE  AND  FOCUS  SEARCH  OPERATION  
CHECK
During normal operation of the equipment, emission of the laser 
diode is prohibited unless the upper lid is closed while turning on 
the SW305 (push switch type).
The following checking method for the laser diode is operable.

• Method
  Emission of the laser diode is visually checked.
  1.  Open the upper lid.
  2.  Push the SW305 as shown in Fig. 1.

Note: Do not push the detection lever strongly, or it may be bent or 

damaged.

  3.  Check the object lens for confi rming normal emission of the 

laser diode. If not emitting, there is a trouble in the automatic 
power control circuit or the optical pick-up.

    In this operation, the object lens will move up and down 2 

times along with inward motion for the focus search.

CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING
When checking the board, the electrical discharge is necessary for 
the electric shock prevention. Connect the resistors referring to the 
fi gure below.

•  MAIN board (C622, C626)
  Both ends of respective capacitors.

:/2 W

:/2 W

•  SIDE PANEL (L) was removed.

MODEL  IDENTIFICATION
Distinguish the destination by referring to the model number label or the model number plate or the sculpture of back panel .

4-184-199-0s AR

4-290-683-0s AR

4-184-200-0s MX

4-184-201-0s E4

Back Panel

MODEL NUMBER LABEL (EC59)

MODEL NUMBER PLATE (EC590)

Sculpture

Back Panel