Sony HCD-DP800AV / MHC-DP800AV Service Manual ▷ View online
3
HCD-DP800AV
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
TABLE OF CONTENTS
MODEL IDENTIFICATION
— BACK PANEL —
• Abbreviation
CND : Canadian model
MX
MX
: Mexican model
KR
: Korea model
AR
: Argentine model
AUS
: Australian model
PARTS No.
1. GENERAL
·········································································· 4
2. DISASSEMBY
··································································· 6
3. TEST MODE
···································································· 13
4. MECHANICAL ADJUSTMENTS
····························· 17
5. ELECTRICAL ADJUSTMENTS
······························· 17
6. DIAGRAMS
6-1. Circuit Board Location ················································· 23
6-2. Block Diagrams ···························································· 24
6-3. Schematic Diagram BD Section ······························· 26
6-4. Printed Wiring Board BD Section ···························· 27
6-5. Printed Wiring Board Main Section ························· 28
6-6. Schematic Diagram Main Section (1/3) ··················· 29
6-7. Schematic Diagram Main Section (2/3) ··················· 30
6-8. Schematic Diagram Main Section (3/3) ··················· 31
6-9. Printed Wiring Board DSP Section ·························· 32
6-10. Schematic Diagram DSP Section (1/2) ··················· 33
6-11. Schematic Diagram DSP Section (2/2) ··················· 34
6-12. Printed Wiring Board OPT Section ························ 35
6-13. Schematic Diagram OPT Section ··························· 35
6-14. Printed Wiring Board Front Amp Section ··············· 36
6-15. Schematic Diagram Front Amp Section ················· 37
6-16. Schematic Diagram Surround Amp Section ··········· 38
6-17. Printed Wiring Board Surround Amp Section ········ 39
6-18. Printed Wiring Board Panel Section ······················· 40
6-19. Schematic Diagram Panel Section (1/2) ················· 41
6-20. Schematic Diagram Panel Section (2/2) ················· 42
6-21. Printed Wiring Board Leaf SW Section ·················· 43
6-22. Schematic Diagram Leaf SW Section ····················· 43
6-23. Printed Wiring Board Driver Section ······················ 44
6-24. Schematic Diagram Driver Section ························ 44
6-25. Printed Wiring Board Trans Section ······················· 45
6-26. Schematic Diagram Trans Section ·························· 46
6-27. IC Pin Function Description ······································· 47
6-28. IC Block Diagrams ····················································· 54
6-2. Block Diagrams ···························································· 24
6-3. Schematic Diagram BD Section ······························· 26
6-4. Printed Wiring Board BD Section ···························· 27
6-5. Printed Wiring Board Main Section ························· 28
6-6. Schematic Diagram Main Section (1/3) ··················· 29
6-7. Schematic Diagram Main Section (2/3) ··················· 30
6-8. Schematic Diagram Main Section (3/3) ··················· 31
6-9. Printed Wiring Board DSP Section ·························· 32
6-10. Schematic Diagram DSP Section (1/2) ··················· 33
6-11. Schematic Diagram DSP Section (2/2) ··················· 34
6-12. Printed Wiring Board OPT Section ························ 35
6-13. Schematic Diagram OPT Section ··························· 35
6-14. Printed Wiring Board Front Amp Section ··············· 36
6-15. Schematic Diagram Front Amp Section ················· 37
6-16. Schematic Diagram Surround Amp Section ··········· 38
6-17. Printed Wiring Board Surround Amp Section ········ 39
6-18. Printed Wiring Board Panel Section ······················· 40
6-19. Schematic Diagram Panel Section (1/2) ················· 41
6-20. Schematic Diagram Panel Section (2/2) ················· 42
6-21. Printed Wiring Board Leaf SW Section ·················· 43
6-22. Schematic Diagram Leaf SW Section ····················· 43
6-23. Printed Wiring Board Driver Section ······················ 44
6-24. Schematic Diagram Driver Section ························ 44
6-25. Printed Wiring Board Trans Section ······················· 45
6-26. Schematic Diagram Trans Section ·························· 46
6-27. IC Pin Function Description ······································· 47
6-28. IC Block Diagrams ····················································· 54
7. EXPLODED VIEWS
7-1. Main Section ································································· 58
7-2. Front Panel Section ······················································· 59
7-3. Chassis Section ····························································· 60
7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 61
7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 62
7-6. CD Mechanism Deck Section (CDM58E-30BD60) ···· 63
7-7. Base Unit Section (BU-30BD60) ································· 64
7-2. Front Panel Section ······················································· 59
7-3. Chassis Section ····························································· 60
7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 61
7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 62
7-6. CD Mechanism Deck Section (CDM58E-30BD60) ···· 63
7-7. Base Unit Section (BU-30BD60) ································· 64
8. ELECTRICAL PARTS LIST
······································· 65
MODEL
AEP model
CND model
AUS model
KR model
MX model
AR model
PARTS No.
4-231-894-0s
4-231-894-1s
4-231-894-2s
4-231-894-3s
4-231-894-4s
4-231-894-5s
4
HCD-DP800AV
This section is extracted from
instruction manual.
instruction manual.
SECTION 1
GENERAL
2CH/MULTI r; (23)
CD wk (8, 12, 13, 18, 19)
CD SYNC HI-DUB qj (18, 19)
CLOCK/TIMER SET ea (11, 19,
CD wk (8, 12, 13, 18, 19)
CD SYNC HI-DUB qj (18, 19)
CLOCK/TIMER SET ea (11, 19,
25)
DECK A Z ql (17)
DECK B Z qk (17, 18)
digipad ej (6, 9, 10, 11, 13, 15,
DECK B Z qk (17, 18)
digipad ej (6, 9, 10, 11, 13, 15,
16, 17, 20, 21, 22, 25)
DIGITAL wf (26)
DIGITAL IN (or DIGITAL IN 2)
DIGITAL IN (or DIGITAL IN 2)
(OPTICAL) jack ws (26)
DIRECTION ed (17, 18, 19)
DISC 1–3 2 (12, 13, 19)
DISC SKIP EX-CHANGE 3
DISC 1–3 2 (12, 13, 19)
DISC SKIP EX-CHANGE 3
(12)
Disc tray 5 (12)
DISPLAY wl (11, 14, 16)
DOLBY NR ef (17, 18, 19)
DSP EDIT rg (21)
EDIT ed (19)
EFFECT ra (21, 22)
ENTER ek (9, 10, 11, 13, 15, 16,
DISPLAY wl (11, 14, 16)
DOLBY NR ef (17, 18, 19)
DSP EDIT rg (21)
EDIT ed (19)
EFFECT ra (21, 22)
ENTER ek (9, 10, 11, 13, 15, 16,
19, 20, 21, 22, 23, 25)
FM MODE ef (15)
GAME wd (26)
GAME MODE rf (21)
GROOVE rs (21)
IR receptor qf
KARAOKE PON (Except for
GAME wd (26)
GAME MODE rf (21)
GROOVE rs (21)
IR receptor qf
KARAOKE PON (Except for
North American and European
models) e; (23)
models) e; (23)
MD (VIDEO) wg (26)
MIC jack (Except for North
MIC jack (Except for North
American and European
models) w; (23)
models) w; (23)
MIC LEVEL control (Except for
North American and European
models) wa (23)
models) wa (23)
MOVIE MODE eh (21)
MULTI CHANNEL DECODING
MULTI CHANNEL DECODING
indicator rj (24)
MUSIC MODE rh (21)
P FILE rd (22)
PHONES jack qg
PLAY MODE eg (12, 13, 19)
PTY (European model only) ed
P FILE rd (22)
PHONES jack qg
PLAY MODE eg (12, 13, 19)
PTY (European model only) ed
(16)
REC PAUSE/START qh (18, 19)
REPEAT ef (13)
SPECTRUM (North American
SPECTRUM (North American
and European models only) e;
(23)
(23)
TAPE A/B wh (17, 18)
TIMER SELECT es (20, 25)
TOOL MODE el (21)
TUNER/BAND wj (15)
TUNER MEMORY eg (15)
VOLUME control qd
TIMER SELECT es (20, 25)
TOOL MODE el (21)
TUNER/BAND wj (15)
TUNER MEMORY eg (15)
VOLUME control qd
BUTTON DESCRIPTIONS
@/1 (power) 1
Z OPEN/CLOSE (disc tray) 4
nN (play) 6
X (pause) 7
x (stop) 8
. (go back) q;
> (go forward) 9
m/– (rewind) qs
M/+ (fast forward) qa
Z OPEN/CLOSE (disc tray) 4
nN (play) 6
X (pause) 7
x (stop) 8
. (go back) q;
> (go forward) 9
m/– (rewind) qs
M/+ (fast forward) qa
Parts Identification
Main unit
1
2
3 4
5
6
8
q;
qs
qd
qf
qg
qh
qj
qk
ql
w;
wa
wd
wg
wh
wj
wk
wf
ws
7
9
qa
wle;eaes edef eg
rj
rh
rg
rf
rdrsrar;
eh
ek
ej
el
The items are arranged in alphabetical order.
5
HCD-DP800AV
Setting the time
1
Turn on the system.
2
Press CLOCK/TIMER SET.
When you set the time for the first time,
proceed to step 5.
proceed to step 5.
3
Press . or > repeatedly to select
“CLOCK SET”.
“CLOCK SET”.
4
Press ENTER.
5
Press . or > repeatedly to set the
hour.
hour.
6
Press ENTER.
7
Press . or > repeatedly to set the
minutes.
minutes.
8
Press ENTER.
Tips
• If you have made a mistake or want to change the
time, start over from step 2.
• You can use the digipad instead of ./>.
Note
The clock settings are canceled when you disconnect
the power cord or if a power failure occurs.
the power cord or if a power failure occurs.
6
HCD-DP800AV
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1. CASE (TOP)
Set
Case (Top)
Loading Panel
Front Panel Section
Tape Mechanism Deck
(TCM-230AWR41/MWR41)
(TCM-230AWR41/MWR41)
CD Panel board, Panel board, OPT IN Board
LEAF SW board, Head (A) board,
Head (B) board
Head (B) board
DSP board, SUB Trans board, Back panel, Fan, OPT IN rear board (AR, AUS, KR,
MX model )
Chassis section
Front AMP board, Surround AMP board
Base unit
(BU-30BD60)
(BU-30BD60)
CD mechanism deck
(CDM58)
(CDM58)
Tnans board, Main board
Escutcheon pad
(With touch pad)
(With touch pad)
Driver board, Motor board, CD sensor board
• The equipment can be removed using the following procedure.
1
two screws (case 3 TP2)
2
screw (case 3 TP2)
3
two screws (case 3 TP2)
4
screw (case 3 TP2)
8
case
7
two screws
(+BVTT 3
×
8)
6
three screws (+BVTT 3
×
8)
5
two screws (+BVTT 3
×
8)
• Abbreviation
CND : Canadian model
MX
MX
: Mexican model
KR
: Korea model
AR
: Argentine model
AUS
: Australian model