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3

This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

— BACK PANEL —

US model

CND model

AEP model

MX model

E51 model

4-231-829-0

s

4-231-829-1

s

4-231-829-2

s

4-231-829-5

s

4-231-829-6

s

• Abbreviation

CND : Canadian model
MX

: Mexican model

E51

: Chiri and Peru model

PARTS No.

·········································································· 4

·································································· 6

···································································· 13

····························· 17

······························· 17

6-1. Circuit Board Location ················································· 23
6-2. Block Diagrams ···························································· 24
6-3. Printed Wiring Board     BD Section ···························· 26
6-4. Schematic Diagram     BD Section ······························· 27
6-5. Printed Wiring Board     Main Section ························· 28
6-6. Schematic Diagram     Main Section (1/3) ··················· 29

6-7. Schematic Diagram     Main Section (2/3) ··················· 30
6-8. Schematic Diagram     Main Section (3/3) ··················· 31
6-9. Printed Wiring Board     DSP Section ·························· 32
6-10. Schematic Diagram     DSP Section (1/2) ··················· 33
6-11. Schematic Diagram     DSP Section (2/2) ··················· 34
6-12. Printed Wiring Board     OPT Section ························ 35
6-13. Schematic Diagram     OPT Section ··························· 35
6-14. Printed Wiring Board     Front Amp Section (AEP/US/

CND model) ································································· 36

6-15. Schematic Diagram     Front Amp Section (AEP/US/

CND model) ································································· 37

6-16. Printed Wiring Board     Front Amp Section (E51/MX

model) ··········································································· 38

6-17. Schematic Diagram     Front Amp Section (E51/MX

model) ··········································································· 39

6-18. Schematic Diagram     Surround Amp Section ··········· 40
6-19. Printed Wiring Board     Surround Amp Section ········ 40
6-20. Printed Wiring Board     Panel Section ······················· 41
6-21. Schematic Diagram     Panel Section (1/2) ················· 42
6-22. Schematic Diagram     Panel Section (2/2) ················· 43
6-23. Printed Wiring Board     Leaf SW Section ·················· 44
6-24. Schematic Diagram     Leaf SW Section ···················· 45
6-25. Printed Wiring Board     Driver Section ······················ 46
6-26. Schematic Diagram     Driver Section ························ 47
6-27. Printed Wiring Board     Trans Section ······················· 48
6-28. Schematic Diagram     Trans Section ·························· 49
6-29. IC Pin Function Description ······································· 50
6-30. IC Block Diagrams ····················································· 56

7-1. Main Section ································································· 60
7-2. Front Panel Section ······················································· 61
7-3. Chassis Section ····························································· 62
7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 63
7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 64
7-6. CD Mechanism Deck Section (CDM58E-30BD60) ···· 65
7-7. Base Unit Section (BU-30BD60) ································· 66

······································· 67

4

6

9

q;

qa

qf

qg

qh

qj

qk

ql

wa

1

2

3 4

5

7

8

qs

qd

w;

wd

ws

wf

wg

wh

wj

ef

eg

ek

wk wl e; ea es ed

eh

ej

el

r;

ra

rg

rf

rd

rs

rj

rh

1

@/1 (POWER) button

2

DISC 1-3 button

3

DISC SKIP EX-CHANGE button

4

Z OPEN/CLOSE (disc tray) button

5

DISC tray

6

bB (play) button

7

X (pause) button

8

x (stop) button

9

> (go forward) button

q;

. (go back) button

qa

M/+ (fast forward) button

qs

m/– (rewind) button

qd

VOLUME control knob

qf

IR receptor

qg

PHONES jack

qh

REC PAUSE/START button

qj

CD SYNC HI-DUB button

qk

DECK B Z

ql

DECK A Z

w;

DIGITAL IN (OPTICAL)

wa

GAME button

ws

DIGITAL button

wd

MD (VIDEO) button

wf

TAPE A/B button

wg

TUNER/BAND button

wh

CD button

wj

DISPLAY

wk

SPECTRUM button (US and AEP model only) or
KARAOKE PON button (except for US, AEP model)

wl

CLOCK/TIMER SET button

e;

TIMER SELECT button

ea

EDIT/DIRECTION/PTY (European model only) button

es

DOLBY NR/FM MODE/REPEAT button

ed

TUNER/MEMORY/PLAY MODE button

ef

MOVIE MODE

eg

DIGIPAD

eh

ENTER

ej

TOOL MODE

ek

2CH/MULTI

el

EFFECT

r;

GROOVE

ra

P FILE

rs

GAME MODE

rd

DSP EDIT

rf

MUSIC MODE

rg

MULTI CHANNEL DECORDING indicator

rh

MIC  jack (except for US, AEP model)

rj

MIC LEVEL control knob (except for US, AEP model)

5

This section is extracted from
instruction manual.

When you set the time for the first time,
proceed to step 5.

V/v

V/v

V/v

The clock starts working.

If you have made a mistake or want to change the
time, start over from step 2.

The clock settings are canceled when you disconnect
the power cord or if a power failure occurs.

6

Note : Follow the disassembly procedure in the numerical order given.

Set

Case (Top)

Loading Panel

Front Panel Section

Tape Mechanism Deck

CD PANEL Board, Panel Board, OPT IN Board 

Head (A) Board, Head (B) Board And LEAF SW Board

DSP Board And SUB Trans Board 

Main Board And Trans Board

FRONT AMP Board And Surround AMP Board

Base Unit

Driver Board, Motor Board And CD Sensor Board

Escutcheon Pad (With TOUCH PAD)

• The equipment can be removed using the following procedure.

1

two screws (case 3 TP2)

2

 screw (case 3 TP2)

3

two screws (case 3 TP2)

4

 screw (case 3 TP2)

8

 case

7

two screws 

    (+BVTT 3

 

×

 8)

6

three screws (+BVTT 3

 

×

 8)

5

two screws (+BVTT 3

 

×

 8)