Sony HCD-DP1000D Service Manual ▷ View online
2
HCD-DP1000D
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Outputs
MD (VIDEO) OUT:
MD (VIDEO) OUT:
voltage 250 mV
(phono jacks)
impedance 1 kilohms
VIDEO OUT:
max. output level
(phono jack)
1 Vp-p, unbalanced, Sync
negative, load impedance
75 ohms
negative, load impedance
75 ohms
S-VIDEO OUT:
Y: 1 Vp-p, unbalanced,
(4-pin/mini-DIN jack)
Sync negative,
C: 0.286Vp-p,
load impedance 75 ohms
C: 0.286Vp-p,
load impedance 75 ohms
PHONES:
accepts headphones of
(stereo mini jack)
8 ohms or more
FRONT SPEAKER :
accepts impedance of 8 to
16 ohms
16 ohms
REAR SPEAKER:
accepts impedance of 8 to
16 ohms
16 ohms
CENTER SPEAKER:
accepts impedance of 8 to
16 ohms
16 ohms
SUB WOOFER:
Voltage 1 V,
impedance 1 kilohms
impedance 1 kilohms
DVD player section
Laser
Semiconductor laser
(DVD:
(DVD:
λ =650 nm, CD: λ =780 nm)
Emission duration:
continuous
continuous
Frequency response
DVD (PCM 48 kHz):
2 Hz – 22 kHz = (
2 Hz – 22 kHz = (
±1 dB)
CD: 2Hz – 20 kHz =
(
(
±1 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
Video color system format
NTSC, PAL
DIGITAL OUT OPTICAL
(Square optical connector jack, rear panel)
Wavelength
(Square optical connector jack, rear panel)
Wavelength
660 nm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 – 13,000 Hz (
±3 dB),
(DOLBY NR OFF)
using Sony TYPE I
cassette,
40 – 14,000 Hz (
cassette,
40 – 14,000 Hz (
±3 dB),
using Sony TYPE II
cassette
cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
Pan American model:
Pan American model:
530 – 1,710 kHz
(with the interval set at
10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)
(with the interval set at
10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)
European and Middle Eastern models:
531 – 1,602 kHz
(with the interval set at 9 kHz)
(with the interval set at 9 kHz)
Other models:
531 – 1,602 kHz
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
North American model:
North American model:
120 V AC, 60 Hz
European model:
230 V AC, 50/60 Hz
Australian model:
230 – 240 V AC,
50/60 Hz
50/60 Hz
Mexican model:
120 V AC, 60 Hz
Thailand model:
220 V AC, 50/60 Hz
Indian, Pakistani, Moroccan and Tunisian models:
220 V AC, 50/60 Hz
Other models:
120 V, 220 V or
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
Power consumption
U.S.A. model:
U.S.A. model:
205 watts
Canadian model:
205 watts
European model:
190 watts
0.5 watts (at the Power Saving Mode)
0.5 watts (at the Power Saving Mode)
Other models:
225 watts
Dimensions (w/h/d)
Approx. 280 x 360 x 365mm
Mass
North American and European models:
North American and European models:
Approx. 11.0 kg
Other models:
12.0 kg
Supplied accessories:
AM loop antenna (1)
FM lead antenna (1)
Remote commander (1)
Batteries (2)
Video cable (1)
Front speaker pads (8)
Center and rear speaker pads
(MHC-DP1000D only, 12)
FM lead antenna (1)
Remote commander (1)
Batteries (2)
Video cable (1)
Front speaker pads (8)
Center and rear speaker pads
(MHC-DP1000D only, 12)
Design and specifications are subject to change without notice.
3
HCD-DP1000D
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
MODEL IDENTIFICATION
— BACK PANEL —
• Abbreviation
CND : Canadian model
MX
MX
: Mexican model
SP
: Singapore model
MY
: Malaysia model
AUS
: Australian model
EA
: Saudi Arabia model
PARTS No.
MODEL
US model
CND model
AEP, UK model
SP, MY model
E model
MX model
EA model
AUS model
TH model
E91 model
PARTS No.
4-236-826-0s
4-236-826-1s
4-236-826-2s
4-236-826-3s
4-236-826-4s
4-236-826-5s
4-236-826-6s
4-236-826-7s
4-236-826-8s
4-236-826-9s
TH
: Thai model
E91
: 220V AC area model
After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth ground
and from all exposed metal parts to any exposed metal part having
a return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
and from all exposed metal parts to any exposed metal part having
a return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
1.
A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2.
A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
digital multimeter is suitable for this job.
3.
Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
SAFETY CHECK-OUT
(US model only)
To Exposed Metal
Parts on Set
0.15
µF
1.5 k
Ω
AC
Voltmeter
(0.75 V)
Voltmeter
(0.75 V)
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged
by heat.
4
HCD-DP1000D
TABLE OF CONTENTS
1. GENERAL
·········································································· 6
2. DISASSEMBY
··································································· 7
3. TEST MODE
···································································· 14
4. MECHANICAL ADJUSTMENTS
····························· 17
5. ELECTRICAL ADJUSTMENTS
······························· 18
6. DIAGRAMS
6-1. Circuit Board Location ················································· 22
6-2. Block Diagrams ···························································· 23
6-3. Printed Wiring Board RF-240 Section ······················ 26
6-4. Schematic Diagram RF-240 Section ························ 27
6-5. Printed Wiring Board MB Section ···························· 28
6-6. Schematic Diagram MB Section (1/5) ······················ 30
6-7. Schematic Diagram MB Section (2/5) ······················ 31
6-8. Schematic Diagram MB Section (3/5) ······················ 32
6-9. Schematic Diagram MB Section (4/5) ······················ 33
6-10.Schematic Diagram MB Section (5/5) ····················· 34
6-11. Schematic Diagram Driver Section ························ 35
6-12. Printed Wiring Board Driver Section ······················ 35
6-13.Printed Wiring Board Main Section ························· 36
6-14.Schematic Diagram Main Section (1/3) ··················· 37
6-15.Schematic Diagram Main Section (2/3) ··················· 38
6-16.Schematic Diagram Main Section (3/3) ··················· 39
6-17.Printed Wiring Board DSP Section ·························· 40
6-18. Schematic Diagram DSP Section (1/2) ··················· 41
6-19. Schematic Diagram DSP Section (2/2) ··················· 42
6-20. Printed Wiring Board OPT/VIDEO Section ··········· 43
6-21. Schematic Diagram OPT/VIDEO Section ·············· 43
6-22. Printed Wiring Board Front Amp Section ··············· 44
6-23. Schematic Diagram Front Amp Section ················· 45
6-24. Schematic Diagram Surround Amp Section ··········· 46
6-25. Printed Wiring Board Surround Amp Section ········ 47
6-26. Printed Wiring Board Panel Section ······················· 48
6-27. Schematic Diagram Panel Section (1/2) ················· 49
6-28. Schematic Diagram Panel Section (2/2) ················· 50
6-29. Printed Wiring Board Leaf SW Section ·················· 51
6-30. Schematic Diagram Leaf SW Section ····················· 51
6-31. Printed Wiring Board Trans Section ······················· 52
6-32. Schematic Diagram Trans Section ·························· 53
6-33. IC Pin Function Description ······································· 54
6-34. IC Block Diagrams ····················································· 61
6-2. Block Diagrams ···························································· 23
6-3. Printed Wiring Board RF-240 Section ······················ 26
6-4. Schematic Diagram RF-240 Section ························ 27
6-5. Printed Wiring Board MB Section ···························· 28
6-6. Schematic Diagram MB Section (1/5) ······················ 30
6-7. Schematic Diagram MB Section (2/5) ······················ 31
6-8. Schematic Diagram MB Section (3/5) ······················ 32
6-9. Schematic Diagram MB Section (4/5) ······················ 33
6-10.Schematic Diagram MB Section (5/5) ····················· 34
6-11. Schematic Diagram Driver Section ························ 35
6-12. Printed Wiring Board Driver Section ······················ 35
6-13.Printed Wiring Board Main Section ························· 36
6-14.Schematic Diagram Main Section (1/3) ··················· 37
6-15.Schematic Diagram Main Section (2/3) ··················· 38
6-16.Schematic Diagram Main Section (3/3) ··················· 39
6-17.Printed Wiring Board DSP Section ·························· 40
6-18. Schematic Diagram DSP Section (1/2) ··················· 41
6-19. Schematic Diagram DSP Section (2/2) ··················· 42
6-20. Printed Wiring Board OPT/VIDEO Section ··········· 43
6-21. Schematic Diagram OPT/VIDEO Section ·············· 43
6-22. Printed Wiring Board Front Amp Section ··············· 44
6-23. Schematic Diagram Front Amp Section ················· 45
6-24. Schematic Diagram Surround Amp Section ··········· 46
6-25. Printed Wiring Board Surround Amp Section ········ 47
6-26. Printed Wiring Board Panel Section ······················· 48
6-27. Schematic Diagram Panel Section (1/2) ················· 49
6-28. Schematic Diagram Panel Section (2/2) ················· 50
6-29. Printed Wiring Board Leaf SW Section ·················· 51
6-30. Schematic Diagram Leaf SW Section ····················· 51
6-31. Printed Wiring Board Trans Section ······················· 52
6-32. Schematic Diagram Trans Section ·························· 53
6-33. IC Pin Function Description ······································· 54
6-34. IC Block Diagrams ····················································· 61
7. EXPLODED VIEWS
7-1. Main Section ································································· 65
7-2. Front Panel Section ······················································· 66
7-3. Chassis Section ····························································· 67
7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 68
7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 69
7-6. DVD Mechanism Deck Section (CDM58D-DVBU9) · 70
7-2. Front Panel Section ······················································· 66
7-3. Chassis Section ····························································· 67
7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 68
7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 69
7-6. DVD Mechanism Deck Section (CDM58D-DVBU9) · 70
8. ELECTRICAL PARTS LIST
······································· 71
Self-diagnosis function
(When letters/numbers appear in the display)
When the self-diagnosis function is activated to prevent the system from
malfunctioning, a five-character service number (e.g., C 13 00) with a
combination of a letter and digits appears on the screen. In this case,
check the following table.
malfunctioning, a five-character service number (e.g., C 13 00) with a
combination of a letter and digits appears on the screen. In this case,
check the following table.
First three
characters of
the service
number
C 13
characters of
the service
number
C 13
C 31
E XX
(XX is a number)
(XX is a number)
C:13:00
Cause and/or Corrective
Action
Action
The disc is dirty
,Clean the disc with a soft
cloth (page 54).
,Clean the disc with a soft
cloth (page 54).
The disc is not inserted correctly.
,Re-insert the disc correctly.
To prevent a malfunction, the
system has performed the self-diagnosis
function.
,Contact your nearest Sony
dealer or local authorized
Sony service facility and give
the 5-character service
number.
Example: E 61 10
,Re-insert the disc correctly.
To prevent a malfunction, the
system has performed the self-diagnosis
function.
,Contact your nearest Sony
dealer or local authorized
Sony service facility and give
the 5-character service
number.
Example: E 61 10
• DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
disc in the store is equipped.
Releasing Procedure :
1.
1.
Press three buttons of PLAY MODE , x and m
simultaneously.
simultaneously.
2.
The message “UNLOCKED” is displayed and the tray is
unlocked.
unlocked.
Note : When “LOCKED” is displayed, the tray lock is not released
by turning power on/off with the POWER button.
Ver 1.9
NOTES ON MB BOARD EXCHANGE
If a MB board is exchanged, “DRIVE AUTO ADJUSTMENT’’ may
be unable to be performed. In this case, initialize a memory in the
following procedure.
1.
be unable to be performed. In this case, initialize a memory in the
following procedure.
1.
Starting Test Mode (See Supplement-1 page2).
2.
Press the 2 button of remote commander to set the Drive
Manual Operation (See Supplement-1 page 8).
Manual Operation (See Supplement-1 page 8).
3.
Press the 6 button of remote commander to set the Memory
Check (See Supplement-1 page 10).
Check (See Supplement-1 page 10).
4.
Press the [CLEAR] button of remote commander to initialize a
memory.
memory.
5
HCD-DP1000D
Ver 1.6 2003.01
SERVICE POSITION
Jig (J-2501-155-A)
to RF240 board : CN004
to RF240 board : CN004
Jig (J-2501-199-A)
to RF240 board : CN002
to RF240 board : CN002
MB board
CHANGE OF OPTICAL PICK-UP
Optical Pick-up has been replaced from KHM-240AAA (TYPE A) to KHM-270AAA (TYPE B) from the middle of production.
In parallel with that, certain parts of MB board have been changed.
Optical Pick-up has been replaced from KHM-240AAA (TYPE A) to KHM-270AAA (TYPE B) from the middle of production.
In parallel with that, certain parts of MB board have been changed.
TYPE A/B DISCRIMINATION
SILVER: KHM-240AAA (TYPE A)
BLACK: KHM-270AAA (TYPE B)
BLACK: KHM-270AAA (TYPE B)
optical device
PARTS LIST OF EACH MODEL
MB BOARD
REF
TYPE A
TYPE B
KHM-240AAA
KHM-270AAA
R076
1-216-837-11 METAL CHIP
22K
5%
1/10W
No Mount
R077
1-216-815-11 METAL CHIP
330
5%
1/10W
1-216-833-11 METAL CHIP
10K
5%
1/10W
R079
1-216-801-11 METAL CHIP
22
5%
1/10W
1-216-845-11 METAL CHIP
100K
5%
1/10W