Sony HCD-DJ2I / LBT-DJ2I Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
HCD-DJ2i
COMPACT DISC RECEIVER
9-889-186-05
2010A04-1
©
2010.01
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Ver. 1.4 2010.01
• HCD-DJ2i is the tuner, USB and
iPod section in LBT-DJ2i.
iPod section in LBT-DJ2i.
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM77B-K6BD93-WOD
Optical Pick-up Name
KSM-213DCP
SPECIFICATIONS
AUDIO POWER SPECIFICATION
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
USA model only
With 6-ohm loads, both channels driven, from 120 Hz – 10 kHz; rates 90
watts per channel minimum RMS power, with no more than 0.7% total
harmonic distortion from 250 miliwatts to rated output.
With 6-ohm loads, both channels driven, from 120 Hz – 10 kHz; rates 90
watts per channel minimum RMS power, with no more than 0.7% total
harmonic distortion from 250 miliwatts to rated output.
Amplifi er section
North American model only
The following are measured at
The following are measured at
AC 120 V, 60 Hz
Front speaker
RMS output power (reference):
RMS output power (reference):
150 W + 150 W (per channel at 6
Ω, 1kHz, 10% THD)
Subwoofer
RMS output power (reference):
RMS output power (reference):
150 W (at 6
Ω, 100 Hz, 10% THD)
Other models
The following are measured at
Mexican model: AC 127 V, 60 Hz
Saudi Arabian model: AC 120 – 127 V, 220 V or 230 – 240 V, 50/60 Hz
Other models: AC 120, 220, 230 – 240 V, 50/60 Hz
Front speaker
Power Output (rated):
The following are measured at
Mexican model: AC 127 V, 60 Hz
Saudi Arabian model: AC 120 – 127 V, 220 V or 230 – 240 V, 50/60 Hz
Other models: AC 120, 220, 230 – 240 V, 50/60 Hz
Front speaker
Power Output (rated):
90 W + 90 W (at 6
Ω, 1 kHz, 1% THD)
RMS output power (reference):
150 W + 150 W (per channel at 6
Ω, 1kHz, 10% THD)
Subwoofer
RMS output power (reference):
RMS output power (reference):
150 W (at 6
Ω, 100 Hz, 10% THD)
– Continued on next page –
HCD-DJ2i
2
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Inputs
LINE IN 1, 2 L/R:
LINE IN 1, 2 L/R:
Voltage 250 mV, impedance 47 kilohms
MIC:
Sensitivity 1 mV, impedance 10 kilohms
(USB) port: Type A
Outputs
i :
i :
accepts headphones of 8
Ω or more
FRONT SPEAKER:
accepts impedance of 6
Ω
Disc player section
System
System
Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6
μW
*This output is the value measurement at a distance of
200 mm from the objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
200 mm from the objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
Frequency response
20 Hz – 20 kHz
Signal-to-noise ratio
More than 90 dB
Dynamic range More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
Tuning range
North American model:
87.5 – 108.0 MHz (100 kHz step)
Other
models:
87.5 – 108.0 MHz (50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7
10.7
MHz
AM tuner section
Tuning range
Tuning range
Pan-American and Oceanian models:
530 – 1,710 kHz (with the interval set at 10 kHz)
531 – 1,710 kHz (with the interval set at 9 kHz)
European
model:
531 – 1,602 kHz (with the interval set at 9 kHz)
Other
models:
531 – 1,602 kHz (with the interval set at 9 kHz)
530 – 1,610 kHz (with the interval set at 10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450
450
kHz
USB section
Supported bit rate
Supported bit rate
MP3 (MPEG 1 Audio Layer 3): 32 – 320 kbps, VBR
WMA: 32 – 192 kbps, VBR
AAC: 48 – 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio Layer 3): 32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
Transfer speed
Full-Speed
Supported USB device
Mass Storage Class
Maximum current
500
500
mA
iPod section
DC5V 500 mA MAX
DC5V 500 mA MAX
General
Power requirements
Power requirements
North American model: 120 V AC, 60 Hz
European model: 230 V AC, 50/60 Hz
Mexican models: 127 V AC, 60 Hz
Oceanian model: 230 – 240 V AC, 50/60 Hz
Saudi Arabian model: 120 – 127 V, 220 V or
230 – 240 V AC, 50/60 Hz,
adjustable with voltage selector
Other models: 120 V, 220 V or 230 – 240 V AC,
50/60 Hz, adjustable with voltage selector
Power consumption
Canadian model: 450 VA
Other models: 345 W
Dimensions (w/h/d) (Approx.)
HCD-DJ2i: 380 × 146.8 × 288 mm
(15 × 5
7
/
8
× 11
3
/
8
inches)
Mass (Approx.) HCD-DJ2i: 3.2 kg (7 lb 1 oz)
Design and specifi cations are subject to change without notice.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
Ver. 1.3
HCD-DJ2i
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
bottom of the unit.
a CLASS 1 LASER product.
This marking is located on the
bottom of the unit.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SAFETY CHECK-OUT (US MODEL)
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
HCD-DJ2i
4
1.
SERVICE NOTES
.................................................. 5
2. GENERAL
Guide to parts and controls ............................................. 6
3. DISASSEMBLY
3-1. Panel (Bottom) ................................................................ 13
3-2. REGULATOR Board ...................................................... 13
3-3. MAIN
3-2. REGULATOR Board ...................................................... 13
3-3. MAIN
AUDIO
Board
..................................................... 14
3-4. MAIN DIGITAL Board .................................................. 14
3-5. Panel (Loading) ............................................................... 15
3-6. Bracket (CDM) ............................................................... 15
3-7. USB Board ...................................................................... 16
3-8. IR Board, MASTER VOL Board .................................... 16
3-9. EQ Board, CUE VOL Board ........................................... 17
3-10. DISPLAY Board, CROSS FADER Board ...................... 17
3-11. ESC Top Assy ................................................................. 18
3-12. CD Mechanism Block ..................................................... 18
3-13. Tray ................................................................................. 19
3-14. Belt, Base Unit ................................................................ 19
3-15. OP Base Assy .................................................................. 20
3-16. Optical Pick-up, BD93 Board ......................................... 20
3-5. Panel (Loading) ............................................................... 15
3-6. Bracket (CDM) ............................................................... 15
3-7. USB Board ...................................................................... 16
3-8. IR Board, MASTER VOL Board .................................... 16
3-9. EQ Board, CUE VOL Board ........................................... 17
3-10. DISPLAY Board, CROSS FADER Board ...................... 17
3-11. ESC Top Assy ................................................................. 18
3-12. CD Mechanism Block ..................................................... 18
3-13. Tray ................................................................................. 19
3-14. Belt, Base Unit ................................................................ 19
3-15. OP Base Assy .................................................................. 20
3-16. Optical Pick-up, BD93 Board ......................................... 20
4.
TEST MODE
............................................................ 21
5. ELECTRICAL
ADJUSTMENTS
........................ 25
6. DIAGRAMS
6-1. Block Diagram –CD Section– ........................................ 28
6-2. Block Diagram –Audio Section– .................................... 29
6-3. Block Diagram –Digital Section– ................................... 30
6-4. Block Diagram –Display/power Section– ...................... 31
6-2. Block Diagram –Audio Section– .................................... 29
6-3. Block Diagram –Digital Section– ................................... 30
6-4. Block Diagram –Display/power Section– ...................... 31
TABLE OF CONTENTS
6-5. Printed Wiring Boards –CD Section– ............................. 33
6-6. Schematic Diagram –CD Section (1/2)– ........................ 34
6-7. Schematic Diagram –CD Section (2/2)– ........................ 35
6-8. Printed Wiring Boards –Main Digital Section– .............. 36
6-9. Schematic Diagram –Main Digital Section (1/2)– ......... 37
6-10. Schematic Diagram –Main Digital Section (2/2)– ......... 38
6-11. Printed Wiring Boards –Main Audio Section– ............... 39
6-12. Schematic Diagram –Audio Section (1/2)– .................... 40
6-13. Schematic Diagram –Audio Section (2/2)– .................... 41
6-14. Printed Wiring Boards –REGULATOR Section– ........... 42
6-15. Schematic Diagram –REGULATOR Section– ............... 43
6-16. Printed Wiring Boards –IPOD Section– ......................... 44
6-17. Schematic Diagram –IPOD Section– ............................. 45
6-18. Printed Wiring Board –USB Section– ............................ 46
6-19. Schematic Diagram –USB Section– ............................... 47
6-20. Printed Wiring Boards –Side A Section– ........................ 48
6-21. Schematic Diagram –Side A Section– ............................ 49
6-22. Printed Wiring Boards –Side B Section– ........................ 50
6-23. Schematic Diagram –Side B Section– ............................ 51
6-24. Printed Wiring Boards –Display Section– ...................... 52
6-25. Schematic Diagram –Display Section– .......................... 53
6-26. Schematic Diagram –Master VOL Section– ................... 54
6-27. Printed Wiring Boards –Master VOL Section– .............. 55
6-6. Schematic Diagram –CD Section (1/2)– ........................ 34
6-7. Schematic Diagram –CD Section (2/2)– ........................ 35
6-8. Printed Wiring Boards –Main Digital Section– .............. 36
6-9. Schematic Diagram –Main Digital Section (1/2)– ......... 37
6-10. Schematic Diagram –Main Digital Section (2/2)– ......... 38
6-11. Printed Wiring Boards –Main Audio Section– ............... 39
6-12. Schematic Diagram –Audio Section (1/2)– .................... 40
6-13. Schematic Diagram –Audio Section (2/2)– .................... 41
6-14. Printed Wiring Boards –REGULATOR Section– ........... 42
6-15. Schematic Diagram –REGULATOR Section– ............... 43
6-16. Printed Wiring Boards –IPOD Section– ......................... 44
6-17. Schematic Diagram –IPOD Section– ............................. 45
6-18. Printed Wiring Board –USB Section– ............................ 46
6-19. Schematic Diagram –USB Section– ............................... 47
6-20. Printed Wiring Boards –Side A Section– ........................ 48
6-21. Schematic Diagram –Side A Section– ............................ 49
6-22. Printed Wiring Boards –Side B Section– ........................ 50
6-23. Schematic Diagram –Side B Section– ............................ 51
6-24. Printed Wiring Boards –Display Section– ...................... 52
6-25. Schematic Diagram –Display Section– .......................... 53
6-26. Schematic Diagram –Master VOL Section– ................... 54
6-27. Printed Wiring Boards –Master VOL Section– .............. 55
7.
EXPLODED VIEWS
7-1. Panel Bottm Section ........................................................ 67
7-2. Panel
7-2. Panel
Section-1
............................................................... 68
7-3. Panel
Section-2
............................................................... 69
7-4. ESC
Top
Section
............................................................. 70
7-5. CD
Mechanism
Section
.................................................. 71
8.
ELECTRICAL PARTS LIST
.............................. 72
