Sony HCD-CQ1 (serv.man2) Service Manual ▷ View online
HCD-CQ1
Chinese Model
SERVICE MANUAL
MICRO HI-FI COMPONENT SYSTEM
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-961-367-02
2005A16-1
© 2005.01
Ver 1.1 2005. 01
SPECIFICATIONS
This set is the tuner, CD and amplifier
section in CMT-CQ1.
section in CMT-CQ1.
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM76-K6BD44S
Base Unit Type
BU-K6BD44S
Optical Pick-up Type
KSM-213D
Amplifier section
The following measured at AC 220 V, 50/60 Hz
DIN power output (rated): 8 W + 8 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
10 W + 10 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
The following measured at AC 240 V, 50/60 Hz
DIN power output (rated): 8 W + 8 W
DIN power output (rated): 8 W + 8 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
10 W + 10 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
AM tuner section
Tuning range
530 kHz – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 kHz – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 kHz – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna, external
antenna terminal
antenna terminal
Intermediate frequency
450 kHz
FM tuner section
Tuning range
87.5 MHz – 108.0 MHz
(50-kHz step)
(50-kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
Tuner section
FM stereo, FM/AM superheterodyne tuner
SPEAKER:
Use the supplied speakers
CD player section
System
Compact disc and digital
audio system
audio system
Laser
Semiconductor laser
(
(
λ
=780 nm)
Emission duration:
continuous
continuous
Frequency response
2 Hz – 20 kHz
PHONES (stereo minijack):
Accepts headphones with
an impedance of 8 ohms or
more
an impedance of 8 ohms or
more
Outputs
PC/MD/TAPE OUT (stereo minijack):
PC/MD/TAPE OUT (stereo minijack):
Sensitivity 250 mV,
impedance 1 kilohm
impedance 1 kilohm
Inputs
PC/MD/TAPE IN (stereo minijack):
PC/MD/TAPE IN (stereo minijack):
Voltage 1.3 V (MD) /
impedance 47 kilohms
820 mV (PC/TAPE),
General
Power requirements
230
V AC, 50/60 Hz
Power consumption
40 watts
Dimensions (w/h/d)
Approx. 190 mm
× 120 mm
× 235 mm incl. projecting
parts and controls
parts and controls
Mass
Approx. 3.5 kg
Design and specifications are subject to change
without notice.
without notice.
CD
SECTION
Photo: WHITE TYPE
2
HCD-CQ1
TABLE OF CONTENTS
1. SERVICING NOTES
······················································· 3
2. GENERAL
·········································································· 5
3. DISASSEMBLY
3-1. PANEL (BACK) ····························································· 8
3-2. PANEL (TOP) ASSY ······················································ 9
3-3. PANEL BOARD ··························································· 10
3-4. CD MECHANISM DECK (CDM76-K6BD44S) ········· 10
3-5. JACK BOARD, REG BOARD ····································· 11
3-6. BEARING ASSY, BUSHING (GUIDE A) ··················· 11
3-7. TUNER (FM/AM) ························································ 12
3-8. POWER BOARD ·························································· 12
3-9. REMOCON BOARD, PANEL (FRONT) ASSY ········· 13
3-10. CONTROL BOARD ··················································· 13
3-11. OPTICAL PICK-UP (KSM-213D) ···························· 14
3-12. BD BOARD ································································ 14
3-13. SLIDER (R), SLIDER (L) ·········································· 15
3-14. TRAY ·········································································· 15
3-15. LOADING BOARD, GEAR (P), GEAR (M) ············· 16
3-2. PANEL (TOP) ASSY ······················································ 9
3-3. PANEL BOARD ··························································· 10
3-4. CD MECHANISM DECK (CDM76-K6BD44S) ········· 10
3-5. JACK BOARD, REG BOARD ····································· 11
3-6. BEARING ASSY, BUSHING (GUIDE A) ··················· 11
3-7. TUNER (FM/AM) ························································ 12
3-8. POWER BOARD ·························································· 12
3-9. REMOCON BOARD, PANEL (FRONT) ASSY ········· 13
3-10. CONTROL BOARD ··················································· 13
3-11. OPTICAL PICK-UP (KSM-213D) ···························· 14
3-12. BD BOARD ································································ 14
3-13. SLIDER (R), SLIDER (L) ·········································· 15
3-14. TRAY ·········································································· 15
3-15. LOADING BOARD, GEAR (P), GEAR (M) ············· 16
4. TEST MODE
···································································· 17
5. ELECTRICAL ADJUSTMENTS
······························· 19
6. DIAGRAMS
6-1. NOTE FOR PRINTED WIRING BOARDS AND
SCHEMATIC DIAGRAMS ········································ 20
6-2. BLOCK DIAGRAM – CD SECTION – ····················· 21
6-3. BLOCK DIAGRAM – MAIN SECTION – ················ 22
6-4. PRINTED WIRING BOARD – BD SECTION – ······· 23
6-5. SCHEMATIC DIAGRAM – BD SECTION – ············ 24
6-6. PRINTED WIRING BOARD
6-3. BLOCK DIAGRAM – MAIN SECTION – ················ 22
6-4. PRINTED WIRING BOARD – BD SECTION – ······· 23
6-5. SCHEMATIC DIAGRAM – BD SECTION – ············ 24
6-6. PRINTED WIRING BOARD
– PANEL SECTION (COMPONENT SIDE) – ·········· 25
6-7. PRINTED WIRING BOARD
– PANEL SECTION (CONDUCTOR SIDE) – ·········· 26
6-8. PRINTED WIRING BOARD
– CONTROL SECTION (COMPONENT SIDE) – ···· 27
6-9. PRINTED WIRING BOARD
– CONTROL SECTION (CONDUCTOR SIDE) – ···· 28
6-10. SCHEMATIC DIAGRAM
– CONTROL SECTION – ········································· 29
6-11. PRINTED WIRING BOARD
– POWER SECTION (COMPONENT SIDE) – ········· 30
6-12. PRINTED WIRING BOARD
– POWER SECTION (CONDUCTOR SIDE) – ········· 31
6-13. SCHEMATIC DIAGRAM – POWER SECTION – ···· 32
6-14. IC PIN FUNCTION DESCRIPTION ························· 36
6-14. IC PIN FUNCTION DESCRIPTION ························· 36
7. EXPLODED VIEWS
7-1. PANEL (TOP) SECTION ··········································· 38
7-2. CHASSIS SECTION-1 ··············································· 39
7-3. CHASSIS SECTION-2 ··············································· 40
7-4. CHASSIS SECTION-3 ··············································· 41
7-5. CD MECHANISM DECK SECTION-1
7-2. CHASSIS SECTION-1 ··············································· 39
7-3. CHASSIS SECTION-2 ··············································· 40
7-4. CHASSIS SECTION-3 ··············································· 41
7-5. CD MECHANISM DECK SECTION-1
(CDM76-K6BD44S) ··················································· 42
7-6. CD MECHANISM DECK SECTION-2
(CDM76-K6BD44S) ··················································· 43
8. ELECTRICAL PARTS LIST
······································· 44
3
HCD-CQ1
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SECTION 1
SERVICING NOTES
This caution
label is
located inside
the unit.
label is
located inside
the unit.
4
HCD-CQ1
Service position of the Overall
Service position of the CD Mechanism Deck
PANEL board
CONTROL board
REMOCON board
POWER board
power transformer
JACK board
CD mechanism
TUNER
CD mechanism
panel (top) assy
