Sony HCD-CPX11 Service Manual ▷ View online
2
HCD-CPX11
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Part No.
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
Model Name
Part No.
AEP and UK models
4-252-358-0
[]
Korean model
4-252-358-2
[]
Australian model
4-252-358-3
[]
3
HCD-CPX11
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
...................................................................
9
3.
DISASSEMBLY
3-1.
Cover ............................................................................... 12
3-2.
Front Panel Section ......................................................... 12
3-3.
TC Board, Mechanical Deck .......................................... 13
3-4.
PANEL Board .................................................................. 13
3-5.
MAIN Board, PRE AMP Board ...................................... 14
3-6.
CD Mechanism Deck (CDM80BH-F1BD81) ................. 14
3-7.
Chassis (Top) ................................................................... 15
3-8.
Lever (Loading R/L) ........................................................ 16
3-9.
Disc Stop Lever, Disc Sensor Lever ................................ 17
3-10. DRIVER Board ............................................................... 17
3-11. BD81A Board .................................................................. 18
3-12. BU Section ...................................................................... 18
3-13. Optical Pick-up (KSM-215DCP) .................................... 19
3-14. Lever (BU Lock) ............................................................. 19
3-15. Close Lever ...................................................................... 20
3-16. Dir Lever, Gear (IDL-B) .................................................. 20
3-17. Gear (IDL-C) ................................................................... 21
3-11. BD81A Board .................................................................. 18
3-12. BU Section ...................................................................... 18
3-13. Optical Pick-up (KSM-215DCP) .................................... 19
3-14. Lever (BU Lock) ............................................................. 19
3-15. Close Lever ...................................................................... 20
3-16. Dir Lever, Gear (IDL-B) .................................................. 20
3-17. Gear (IDL-C) ................................................................... 21
4.
TEST MODE
............................................................... 22
5.
ELECTRICAL ADJUSTMENTS
Deck Section .................................................................... 24
CD Section ...................................................................... 25
CD Section ...................................................................... 25
6.
DIAGRAMS
6-1.
Block Diagram – BD/DRIVER Section – ...................... 28
– TUNER/TAPE DECK Section – .................................. 29
– MAIN Section – ........................................................... 30
– DISPLAY/POWER SUPPLY Section – ....................... 31
– TUNER/TAPE DECK Section – .................................. 29
– MAIN Section – ........................................................... 30
– DISPLAY/POWER SUPPLY Section – ....................... 31
6-2.
Printed Wiring Board – BD81A Section – ..................... 32
6-3.
Schematic Diagram – BD81A Section – ........................ 33
6-4.
Printed Wiring Board – TC Section – ............................. 34
6-5.
Schematic Diagram – TC Section – ............................... 35
6-6.
Printed Wiring Board – MAIN Section – ....................... 36
6-7.
Schematic Diagram – MAIN Section – .......................... 37
6-8.
Printed Wiring Board – PRE AMP Section – .................. 38
6-9.
Schematic Diagram – PRE AMP Section – .................... 39
6-10. Printed Wiring Board – LCD/DRIVER Section – ........... 40
6-11. Schematic Diagram – LCD/DRIVER Section – ............. 41
6-12. Printed Wiring Board – PANEL Section – ..................... 42
6-13. Schematic Diagram – PANEL Section – ........................ 43
6-14. Printed Wiring Board – S-MASTER Section – .............. 44
6-15. Schematic Diagram – S-MASTER Section – ................. 45
6-16. IC Pin Function Description ............................................ 51
6-11. Schematic Diagram – LCD/DRIVER Section – ............. 41
6-12. Printed Wiring Board – PANEL Section – ..................... 42
6-13. Schematic Diagram – PANEL Section – ........................ 43
6-14. Printed Wiring Board – S-MASTER Section – .............. 44
6-15. Schematic Diagram – S-MASTER Section – ................. 45
6-16. IC Pin Function Description ............................................ 51
7.
EXPLODED VIEWS
7-1.
MAIN Section ................................................................. 57
7-2.
Front Panel Section ......................................................... 58
7-3.
Lid (TC) Section .............................................................. 59
7-4.
Chassis Section ................................................................ 60
7-5.
S-MASTER AMP Section ............................................... 61
7-6.
CD Mechanism Deck Section-1
(CDM80BH-F1BD81) ..................................................... 62
(CDM80BH-F1BD81) ..................................................... 62
7-7.
CD Mechanism Deck Section-2
(CDM80BH-F1BD81) ..................................................... 63
(CDM80BH-F1BD81) ..................................................... 63
7-8.
CD Mechanism Deck Section-3
(CDM80BH-F1BD81) ..................................................... 64
(CDM80BH-F1BD81) ..................................................... 64
7-9.
Base Unit Section (BU-F1BD81A) ................................. 65
8.
ELECTRICAL PARTS LIST
.................................. 66
4
HCD-CPX11
SECTION 1
SERVICING NOTES
SERVICE POSITION OF THE TAPE MECHANISM DECK
tape mechanism deck
SERVICE POSITION OF THE S-MASTER AMP BOARD
S-MASTER AMP board
• Remove the switching regulator, the S-MASTER AMP board block first,
then remove the S-MASTER AMP board from the S-MASTER AMP board block.
then remove the S-MASTER AMP board from the S-MASTER AMP board block.
5
HCD-CPX11
JUDGING WHETHER THE SWITCHING REGULATOR IS GOOD OR DEFECTIVE
JUDGING WHETHER THE SUB POWER BOARD IS GOOD OR DEFECTIVE
switching regulator
CN4
•
The switching regulator is judged to be good when the terminal voltage at the switching regulator CN4 is 12 V.
SUB POWER board
MAIN board
CN302
• It is judged to be good when the voltage between pin 2 (+4 V) and pin 3 (GND) of the MAIN board CN302 is 4 V.