Sony HCD-CPX11 Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
Published by Sony Engineering Corporation
AEP Model
UK Model
Korean Model
Australian Model
MICRO HI-FI COMPONENT SYSTEM
9-877-766-02
2004D16-1
© 2004.04
© 2004.04
Ver 1.1 2004.04
SPECIFICATIONS
HCD-CPX11
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM80BH-F1BD81
Section
Optical Pick-up Name
KSM-215DCP
Tape deck
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Name
CMAL1Z-236A
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (
±3 dB),
using Sony TYPE I
cassettes
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz (50 kHz
step)
step)
Antenna
FM wire antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
European model:
European model:
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 9 kHz)
European model:
DIN power output (rated): 55 + 55 W
(4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
75 + 75 W
(4 ohms at 1 kHz, 10%
THD)
(4 ohms at 1 kHz, 10%
THD)
Other models:
The following measured at 220 – 240 V AC, 50/60 Hz
DIN power output (rated): 55 + 55 W
DIN power output (rated): 55 + 55 W
(4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
75 + 75 W
(4 ohms at 1 kHz, 10%
THD)
(4 ohms at 1 kHz, 10%
THD)
Inputs
MD/VIDEO IN (phono jacks):
MD/VIDEO IN (phono jacks):
Sensitivity 450/250 mV,
impedance 47 kilohms
impedance 47 kilohms
Outputs
CD DIGITAL OUT:
CD DIGITAL OUT:
Optical Wavelength:
660 nm
660 nm
PHONES:
accepts headphones with
an impedance of 8 ohms or
more
an impedance of 8 ohms or
more
SPEAKER:
accepts impedance of 4 ohms
CD p
Amplifier section
layer section
Laser
Semiconductor laser
(CD:
(CD:
λ=780 nm)
Emission duration:
continuous
continuous
Frequency response
CD: 2 Hz – 20 kHz
Wavelength
780 – 790 nm
Other models:
530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna, external
antenna terminal
antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
European model:
European model:
230 V AC, 50/60 Hz
Korean model:
220 V AC, 60 Hz
Australian model:
230 – 240 V AC, 50/60 Hz
Power consumption
European model:
European model:
50 W
0.3 W (in Power Saving
mode)
0.3 W (in Power Saving
mode)
Korean model:
50 W
Other models:
50 W
Dimensions (w/h/d) incl. projecting parts and controls
Approx. 175
× 240.5 × 291
mm
Mass
Approx. 4.3 kg
Design and specifications are subject to change
without notice.
without notice.
HCD-CPX11 is the Amplifier, CD player,
Tape Deck and Tuner section in CMT-
CPX11.
Tape Deck and Tuner section in CMT-
CPX11.
2
HCD-CPX11
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Part No.
MODEL IDENTIFICATION
– Back Panel –
– Back Panel –
Model Name
Part No.
AEP and UK models
4-252-358-0
[]
Korean model
4-252-358-2
[]
Australian model
4-252-358-3
[]
3
HCD-CPX11
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
...................................................................
9
3.
DISASSEMBLY
3-1.
Cover ............................................................................... 12
3-2.
Front Panel Section ......................................................... 12
3-3.
TC Board, Mechanical Deck .......................................... 13
3-4.
PANEL Board .................................................................. 13
3-5.
MAIN Board, PRE AMP Board ...................................... 14
3-6.
CD Mechanism Deck (CDM80BH-F1BD81) ................. 14
3-7.
Chassis (Top) ................................................................... 15
3-8.
Lever (Loading R/L) ........................................................ 16
3-9.
Disc Stop Lever, Disc Sensor Lever ................................ 17
3-10. DRIVER Board ............................................................... 17
3-11. BD81A Board .................................................................. 18
3-12. BU Section ...................................................................... 18
3-13. Optical Pick-up (KSM-215DCP) .................................... 19
3-14. Lever (BU Lock) ............................................................. 19
3-15. Close Lever ...................................................................... 20
3-16. Dir Lever, Gear (IDL-B) .................................................. 20
3-17. Gear (IDL-C) ................................................................... 21
3-11. BD81A Board .................................................................. 18
3-12. BU Section ...................................................................... 18
3-13. Optical Pick-up (KSM-215DCP) .................................... 19
3-14. Lever (BU Lock) ............................................................. 19
3-15. Close Lever ...................................................................... 20
3-16. Dir Lever, Gear (IDL-B) .................................................. 20
3-17. Gear (IDL-C) ................................................................... 21
4.
TEST MODE
............................................................... 22
5.
ELECTRICAL ADJUSTMENTS
Deck Section .................................................................... 24
CD Section ...................................................................... 25
CD Section ...................................................................... 25
6.
DIAGRAMS
6-1.
Block Diagram – BD/DRIVER Section – ...................... 28
– TUNER/TAPE DECK Section – .................................. 29
– MAIN Section – ........................................................... 30
– DISPLAY/POWER SUPPLY Section – ....................... 31
– TUNER/TAPE DECK Section – .................................. 29
– MAIN Section – ........................................................... 30
– DISPLAY/POWER SUPPLY Section – ....................... 31
6-2.
Printed Wiring Board – BD81A Section – ..................... 32
6-3.
Schematic Diagram – BD81A Section – ........................ 33
6-4.
Printed Wiring Board – TC Section – ............................. 34
6-5.
Schematic Diagram – TC Section – ............................... 35
6-6.
Printed Wiring Board – MAIN Section – ....................... 36
6-7.
Schematic Diagram – MAIN Section – .......................... 37
6-8.
Printed Wiring Board – PRE AMP Section – .................. 38
6-9.
Schematic Diagram – PRE AMP Section – .................... 39
6-10. Printed Wiring Board – LCD/DRIVER Section – ........... 40
6-11. Schematic Diagram – LCD/DRIVER Section – ............. 41
6-12. Printed Wiring Board – PANEL Section – ..................... 42
6-13. Schematic Diagram – PANEL Section – ........................ 43
6-14. Printed Wiring Board – S-MASTER Section – .............. 44
6-15. Schematic Diagram – S-MASTER Section – ................. 45
6-16. IC Pin Function Description ............................................ 51
6-11. Schematic Diagram – LCD/DRIVER Section – ............. 41
6-12. Printed Wiring Board – PANEL Section – ..................... 42
6-13. Schematic Diagram – PANEL Section – ........................ 43
6-14. Printed Wiring Board – S-MASTER Section – .............. 44
6-15. Schematic Diagram – S-MASTER Section – ................. 45
6-16. IC Pin Function Description ............................................ 51
7.
EXPLODED VIEWS
7-1.
MAIN Section ................................................................. 57
7-2.
Front Panel Section ......................................................... 58
7-3.
Lid (TC) Section .............................................................. 59
7-4.
Chassis Section ................................................................ 60
7-5.
S-MASTER AMP Section ............................................... 61
7-6.
CD Mechanism Deck Section-1
(CDM80BH-F1BD81) ..................................................... 62
(CDM80BH-F1BD81) ..................................................... 62
7-7.
CD Mechanism Deck Section-2
(CDM80BH-F1BD81) ..................................................... 63
(CDM80BH-F1BD81) ..................................................... 63
7-8.
CD Mechanism Deck Section-3
(CDM80BH-F1BD81) ..................................................... 64
(CDM80BH-F1BD81) ..................................................... 64
7-9.
Base Unit Section (BU-F1BD81A) ................................. 65
8.
ELECTRICAL PARTS LIST
.................................. 66
4
HCD-CPX11
SECTION 1
SERVICING NOTES
SERVICE POSITION OF THE TAPE MECHANISM DECK
tape mechanism deck
SERVICE POSITION OF THE S-MASTER AMP BOARD
S-MASTER AMP board
• Remove the switching regulator, the S-MASTER AMP board block first,
then remove the S-MASTER AMP board from the S-MASTER AMP board block.
then remove the S-MASTER AMP board from the S-MASTER AMP board block.