HCD-CPX11 — Sony Audio Service Manual (repair manual)

Model
HCD-CPX11
Pages
76
Size
5.98 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
hcd-cpx11.pdf
Date

View Sony HCD-CPX11 Service Manual online

SERVICE MANUAL
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
AEP Model
UK Model
Korean Model
Australian Model
MICRO HI-FI COMPONENT SYSTEM
9-877-766-02
2004D16-1
© 2004.04
Ver 1.1  2004.04
SPECIFICATIONS
HCD-CPX11
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM80BH-F1BD81
Section
Optical Pick-up Name
KSM-215DCP
Tape deck
Model Name Using Similar Mechanism
NEW
Section
Tape Transport Mechanism Name
CMAL1Z-236A
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (
±3 dB), 
using Sony TYPE I 
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz (50 kHz 
step)
Antenna
FM wire antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
European model:
531 – 1,602 kHz 
(with the tuning interval 
set at 9 kHz) 
European model:
DIN power output (rated): 55 + 55 W 
(4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
75 + 75 W 
(4 ohms at 1 kHz, 10% 
THD)
Other models:
The following measured at 220 – 240 V AC, 50/60 Hz
DIN power output (rated): 55 + 55 W 
(4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
75 + 75 W 
(4 ohms at 1 kHz, 10% 
THD)
Inputs
MD/VIDEO IN (phono jacks):
Sensitivity 450/250 mV, 
impedance 47 kilohms
Outputs
CD DIGITAL OUT:
Optical Wavelength: 
660 nm
PHONES:
accepts headphones with 
an impedance of 8 ohms or 
more
SPEAKER:
accepts impedance of  4 ohms
CD p
Amplifier section
layer section
Laser
Semiconductor laser 
(CD: 
λ=780 nm)
Emission duration: 
continuous
Frequency response
CD: 2 Hz – 20 kHz
Wavelength
780 – 790 nm
Other models:
530 – 1,710 kHz 
(with the tuning interval 
set at 10 kHz)
531 – 1,602 kHz 
(with the tuning interval 
set at 9 kHz)
Antenna
AM loop antenna, external 
antenna terminal
Intermediate frequency
450 kHz 
General
Power requirements
European model:
230 V AC, 50/60 Hz
Korean model:
220 V AC, 60 Hz
Australian model:
230 – 240 V AC, 50/60 Hz
Power consumption
European model:
50 W 
0.3 W (in Power Saving 
mode)
Korean model:
50 W
Other models:
50 W
Dimensions (w/h/d) incl. projecting parts and controls 
Approx. 175 
× 240.5 × 291 
mm
Mass
Approx. 4.3 kg
Design and specifications are subject to change 
without notice.
HCD-CPX11 is the Amplifier, CD player,
Tape Deck and Tuner section in CMT-
CPX11.
2
HCD-CPX11
Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Keep the temperature of the soldering iron around 270 
°
C
during repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40 
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
This appliance is 
classified as a CLASS 1 
LASER product. This 
label is located on the 
rear exterior.
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Part No.
MODEL  IDENTIFICATION
– Back Panel –
Model Name
Part No.
AEP and UK models
4-252-358-0
[]
Korean model
4-252-358-2
[]
Australian model
4-252-358-3
[]
3
HCD-CPX11
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
...................................................................
9
3.
DISASSEMBLY
3-1.
Cover ............................................................................... 12
3-2.
Front Panel Section ......................................................... 12
3-3.
TC Board,  Mechanical Deck .......................................... 13
3-4.
PANEL Board .................................................................. 13
3-5.
MAIN Board, PRE AMP Board ...................................... 14
3-6.
CD Mechanism Deck (CDM80BH-F1BD81) ................. 14
3-7.
Chassis (Top) ................................................................... 15
3-8.
Lever (Loading R/L) ........................................................ 16
3-9.
Disc Stop Lever, Disc Sensor Lever ................................ 17
3-10. DRIVER Board ............................................................... 17
3-11. BD81A Board .................................................................. 18
3-12. BU Section ...................................................................... 18
3-13. Optical Pick-up (KSM-215DCP) .................................... 19
3-14. Lever (BU Lock) ............................................................. 19
3-15. Close Lever ...................................................................... 20
3-16. Dir Lever, Gear (IDL-B) .................................................. 20
3-17. Gear (IDL-C) ................................................................... 21
4.
TEST MODE
............................................................... 22
5.
ELECTRICAL ADJUSTMENTS
Deck Section .................................................................... 24
CD Section ...................................................................... 25
6.
DIAGRAMS
6-1.
Block Diagram  – BD/DRIVER Section – ...................... 28
– TUNER/TAPE DECK Section – .................................. 29
– MAIN Section – ........................................................... 30
– DISPLAY/POWER SUPPLY Section – ....................... 31
6-2.
Printed Wiring Board  – BD81A Section – ..................... 32
6-3.
Schematic Diagram  – BD81A Section – ........................ 33
6-4.
Printed Wiring Board  – TC Section – ............................. 34
6-5.
Schematic Diagram  – TC Section – ............................... 35
6-6.
Printed Wiring Board  – MAIN Section – ....................... 36
6-7.
Schematic Diagram  – MAIN Section – .......................... 37
6-8.
Printed Wiring Board – PRE AMP Section – .................. 38
6-9.
Schematic Diagram  – PRE AMP Section – .................... 39
6-10. Printed Wiring Board – LCD/DRIVER Section – ........... 40
6-11. Schematic Diagram – LCD/DRIVER Section – ............. 41
6-12. Printed Wiring Board  – PANEL Section – ..................... 42
6-13. Schematic Diagram  – PANEL Section – ........................ 43
6-14. Printed Wiring Board  – S-MASTER Section – .............. 44
6-15. Schematic Diagram  – S-MASTER Section – ................. 45
6-16. IC Pin Function Description ............................................ 51
7.
EXPLODED VIEWS
7-1.
MAIN Section ................................................................. 57
7-2.
Front Panel Section ......................................................... 58
7-3.
Lid (TC) Section .............................................................. 59
7-4.
Chassis Section ................................................................ 60
7-5.
S-MASTER AMP Section ............................................... 61
7-6.
CD Mechanism Deck Section-1
(CDM80BH-F1BD81) ..................................................... 62
7-7.
CD Mechanism Deck Section-2
(CDM80BH-F1BD81) ..................................................... 63
7-8.
CD Mechanism Deck Section-3
(CDM80BH-F1BD81) ..................................................... 64
7-9.
Base Unit Section (BU-F1BD81A) ................................. 65
8.
ELECTRICAL PARTS LIST
.................................. 66
4
HCD-CPX11
SECTION 1
SERVICING NOTES
SERVICE  POSITION  OF  THE  TAPE  MECHANISM DECK
tape mechanism deck 
SERVICE  POSITION  OF  THE  S-MASTER  AMP  BOARD
S-MASTER AMP board
• Remove the switching regulator, the S-MASTER AMP board block first, 
   then remove the S-MASTER AMP board from the S-MASTER AMP board block.
Page of 76
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Here you can view online or download Sony HCD-CPX11 Service Manual in pdf. This Service Manual can help you recover, restore, fix, disassemble and repair Sony HCD-CPX11 Audio. Information contained in Sony HCD-CPX11 service manual (repair manual) typically includes:

  • Disassembly, troubleshooting, programming, maintenance, remote, adjustment, installation and setup instructions.
  • Schematics, wiring and block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Parts list (bill of materials).