Sony HCD-BX77DBI Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-BX77DBi
SPECIFICATIONS
COMPACT DISC RECEIVER
9-889-832-04
2013B33-1
©
2013.02
AEP Model
UK Model
Ver. 1.3 2013.02
• HCD-BX77DBi is the amplifier, CD player, tuner
and iPod section in CMT-BX77DBi.
Model Name Using Similar Mechanism
HCD-BX70DBi
Base Unit Name
BU-K6BD90-WOD
Optical Pick-up Name
KSM-213DCP
iPod is a trademark of Apple Inc., registered in the U.S.
and other countries.
and other countries.
MPEG Layer-3 audio coding technology and patents
licensed from Fraunhofer IIS and Thomson.
licensed from Fraunhofer IIS and Thomson.
All other trademarks and registered trademarks are of
their respective holders. In this manual,
their respective holders. In this manual,
TM
and ® marks
are not specified.
Amplifier section
DIN power output (rated):
18 watts + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 25 watts + 25 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference): 38 watts + 38 watts (6 ohms at 1 kHz, 10%
THD)
18 watts + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 25 watts + 25 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference): 38 watts + 38 watts (6 ohms at 1 kHz, 10%
THD)
Inputs
AUDIO IN (stereo mini jack): voltage 250 mV, impedance 47 kilohms
Outputs
PHONES (stereo mini jack): accepts headphones of 8 ohms or more
SPEAKER: accepts impedance of 6 to 16 ohms
SPEAKER: accepts impedance of 6 to 16 ohms
CD player section
System: Compact disc and digital audio system
Laser Diode Properties
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
* This output is the value measurement at a distance of 200 mm from the
Laser Output*: Less than 44.6 μW
* This output is the value measurement at a distance of 200 mm from the
objective lens surface on the Optical Pick-up Block with 7 mm aperture.
Frequency response: 20 Hz 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Tuner section
DAB tuner section:
Frequency range*
Band-III: 174.928 (5A) MHz 239.200 (13F) MHz
* For details, see “DAB frequency table” below.
Antenna: FM/DAB lead antenna
Antenna terminal: 75 ohms, F female
Band-III: 174.928 (5A) MHz 239.200 (13F) MHz
* For details, see “DAB frequency table” below.
Antenna: FM/DAB lead antenna
Antenna terminal: 75 ohms, F female
FM stereo, FM/AM superheterodyne tuner
FM tuner section:
FM tuner section:
Tuning range: 87.5 MHz 108.0 MHz (50 kHz step)
Antenna: FM/DAB lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
Antenna: FM/DAB lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
AM tuner section:
Tuning range: 531 kHz 1,602 kHz (9 kHz step)
Antenna: AM loop antenna, external antenna terminal
Intermediate frequency: 450 kHz
Antenna: AM loop antenna, external antenna terminal
Intermediate frequency: 450 kHz
DAB frequency table (Band-III)
Frequency
Label
Frequency
Label
174.928 MHz
5A
209.936 MHz
10A
176.640 MHz
5B
211.648 MHz
10B
178.352 MHz
5C
213.360 MHz
10C
180.064 MHz
5D
215.072 MHz
10D
181.936 MHz
6A
216.928 MHz
11A
183.648 MHz
6B
218.640 MHz
11B
185.360 MHz
6C
220.352 MHz
11C
187.072 MHz
6D
222.064 MHz
11D
188.928 MHz
7A
223.936 MHz
12A
190.640 MHz
7B
225.648 MHz
12B
192.352 MHz
7C
227.360 MHz
12C
194.064 MHz
7D
229.072 MHz
12D
195.936 MHz
8A
230.784 MHz
13A
197.648 MHz
8B
232.496 MHz
13B
199.360 MHz
8C
234.208 MHz
13C
201.072 MHz
8D
235.776 MHz
13D
202.928 MHz
9A
237.488 MHz
13E
204.640 MHz
9B
239.200 MHz
13F
206.352 MHz
9C
208.064 MHz
9D
– Continued on next page –
Note: Refer to supplement-1 for SPECIFICATIONS of the following serial No. or larger.
AEP model : Serial No. 5100859 or larger
UK model : Serial No. 6123118 or larger
HCD-BX77DBi
2
1.
SERVICING NOTES
.............................................. 3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 4
2-2. Panel (Side L/R) .............................................................. 5
2-3. Top Panel Block .............................................................. 5
2-4. TOP KEY Board, IP Board, Panel Top (IP) .................... 6
2-5. Front Panel Block ........................................................... 6
2-6. Rear Panel Block ............................................................ 7
2-7. Panel
2-3. Top Panel Block .............................................................. 5
2-4. TOP KEY Board, IP Board, Panel Top (IP) .................... 6
2-5. Front Panel Block ........................................................... 6
2-6. Rear Panel Block ............................................................ 7
2-7. Panel
(Rear)
.................................................................... 7
2-8. AMP Board Block ........................................................... 8
2-9. POWER Board Block ..................................................... 8
2-10. MAIN Board ................................................................... 9
2-11. DAB Board, Module (DAB Tuner) ................................ 9
2-12. Loading Mechanism Block ............................................. 10
2-13. Base Unit ......................................................................... 10
2-14. Belt .................................................................................. 11
2-15. Optical Pick-Up Block (KSM-213DCP) ........................ 11
2-9. POWER Board Block ..................................................... 8
2-10. MAIN Board ................................................................... 9
2-11. DAB Board, Module (DAB Tuner) ................................ 9
2-12. Loading Mechanism Block ............................................. 10
2-13. Base Unit ......................................................................... 10
2-14. Belt .................................................................................. 11
2-15. Optical Pick-Up Block (KSM-213DCP) ........................ 11
3.
TEST MODE
............................................................ 12
4.
ELECTRICAL CHECKS
...................................... 14
5. DIAGRAMS
5-1. Block Diagram - CD SERVO Section - .......................... 15
5-2. Block Diagram - iPod, TUNER, DAB Section - ............ 16
5-3. Block Diagram - MAIN Section - ................................... 17
5-4. Block
5-2. Block Diagram - iPod, TUNER, DAB Section - ............ 16
5-3. Block Diagram - MAIN Section - ................................... 17
5-4. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 18
5-5. Printed Wiring Boards - CD Section - ............................ 20
5-6. Schematic Diagram - CD Board - ................................... 21
5-7. Printed Wiring Board - DAB Board - ............................. 22
5-8. Schematic Diagram - DAB Board - ................................ 23
5-9. Printed Wiring Board - IP Board - .................................. 24
5-10. Schematic Diagram - IP Board - ..................................... 25
5-11. Printed Wiring Boards - MAIN Section - ....................... 26
5-12. Schematic Diagram - MAIN Section (1/3) - ................... 27
5-13. Schematic Diagram - MAIN Section (2/3) - ................... 28
5-14. Schematic Diagram - MAIN Section (3/3) - ................... 29
5-15. Printed Wiring Boards
5-6. Schematic Diagram - CD Board - ................................... 21
5-7. Printed Wiring Board - DAB Board - ............................. 22
5-8. Schematic Diagram - DAB Board - ................................ 23
5-9. Printed Wiring Board - IP Board - .................................. 24
5-10. Schematic Diagram - IP Board - ..................................... 25
5-11. Printed Wiring Boards - MAIN Section - ....................... 26
5-12. Schematic Diagram - MAIN Section (1/3) - ................... 27
5-13. Schematic Diagram - MAIN Section (2/3) - ................... 28
5-14. Schematic Diagram - MAIN Section (3/3) - ................... 29
5-15. Printed Wiring Boards
- AMP, HEADPHONE Section - .................................... 30
5-16. Schematic Diagram - AMP, HEADPHONE Section - .... 31
5-17. Printed Wiring Boards - PANEL Section - ..................... 32
5-18. Schematic Diagram - PANEL Section - .......................... 33
5-19. Printed Wiring Board - POWER Board - ........................ 34
5-20. Schematic Diagram - POWER Board - .......................... 35
5-17. Printed Wiring Boards - PANEL Section - ..................... 32
5-18. Schematic Diagram - PANEL Section - .......................... 33
5-19. Printed Wiring Board - POWER Board - ........................ 34
5-20. Schematic Diagram - POWER Board - .......................... 35
6.
EXPLODED VIEWS
6-1. Panel
Section
................................................................... 43
6-2. Top Panel Section ........................................................... 44
6-3. Front Panel Section ......................................................... 45
6-4. MAIN Board Section ...................................................... 46
6-5. POWER Board Section ................................................... 47
6-6. Loading Mechanism Section .......................................... 48
6-7. Base Unit Section (BU-K6BD90-WOD) ........................ 49
6-3. Front Panel Section ......................................................... 45
6-4. MAIN Board Section ...................................................... 46
6-5. POWER Board Section ................................................... 47
6-6. Loading Mechanism Section .......................................... 48
6-7. Base Unit Section (BU-K6BD90-WOD) ........................ 49
7.
ELECTRICAL PARTS LIST
.............................. 50
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
This appliance is classified
as a CLASS 1 LASER
product. This marking
is located on the rear
exterior.
as a CLASS 1 LASER
product. This marking
is located on the rear
exterior.
iPod section
Compatible iPod models:
iPod touch
iPod nano 3rd
generation
(video)
iPod classic
iPod nano 2nd
generation
(aluminum)
iPod 5th
generation
(video)
iPod nano 1st
generation
iPod 4th
generation
(color display)
iPod 4th
generation
iPod mini
General
Power requirements: 230 V AC, 50/60 Hz
Power consumption: 63 watts
Dimensions (w/h/d) (excl. speakers): Approx. 215 mm × 140 mm × 298 mm
Mass (excl. speakers): Approx. 3.9 kg
Power consumption: 63 watts
Dimensions (w/h/d) (excl. speakers): Approx. 215 mm × 140 mm × 298 mm
Mass (excl. speakers): Approx. 3.9 kg
Design and specifications are subject to change without notice.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
HCD-BX77DBi
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ANTITHEFT UNLOCK MODE
Procedure:
1. Press the [
Procedure:
1. Press the [
?/1
] button to turn the power on.
2. Press the [FUNCTION] button to select “CD”.
3. Press two buttons of [
3. Press two buttons of [
x/
CANCEL] and [
A
] for 5 seconds.
4. The message “UNLOCKED” is displayed on the fl uorescent
indicator tube and the disc tray is unlocked.
Note: When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the [
?/1] button.
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
Note: Please insert a screwdriver after removing the panel (side L).
About disassembly of the panel (side L), please refer to “2-2. Panel (Side L/R)” (page 5).
3
Open the tray.
2
Push the boss.
1
Insert the driver.
HCD-BX77DBi
4
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
2-2. PANEL (SIDE L/R)
(Page
(Page
5)
2-3. TOP PANEL BLOCK
(Page
(Page
5)
2-5. FRONT PANEL BLOCK
(Page
(Page
6)
2-12. LOADING MECHANISM
BLOCK
(Page
BLOCK
(Page
10)
2-13. BASE UNIT
(Page
(Page
10)
2-14. BELT
(Page
(Page
11)
2-15. OPTICAL PICK-UP BLOCK
(KSM-213DCP)
(Page
(KSM-213DCP)
(Page
11)
2-6. REAR PANEL BLOCK
(Page
(Page
7)
2-8. AMP BOARD BLOCK
(Page
(Page
8)
2-10. MAIN BOARD
(Page
(Page
9)
2-9. POWER BOARD BLOCK
(Page
(Page
8)
2-7. PANEL
(REAR)
(Page
7)
2-11. DAB BOARD,
MODULE (DAB TUNER)
(Page
9)
2-4. TOP KEY BOARD,
IP BOARD, PANEL TOP (IP)
(Page
6)
SET