Sony HCD-BX20I / HCD-BX50BTI Service Manual ▷ View online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HCD-BX20i/BX50BTi
SPECIFICATIONS
COMPACT DISC RECEIVER
9-889-020-06
2013B33-1
©
2013.02
US Model
Canadian Model
HCD-BX20i/BX50BTi
AEP Model
Australian Model
Singapore Model
HCD-BX20i
Ver. 1.5 2013.02
Model Name Using Similar Mechanism
HCD-BX5BT/EC68
Base Unit Name
BU-K6BD90-WOD
Optical Pick-up Block Name
KSM-213DCP
• HCD-BX20i is the amplifi er, CD player, tuner and
iPod section in CMT-BX20i.
• HCD-BX50BTi is the amplifi er, bluetooth, CD player,
tuner and iPod section in CMT-BX50BTi.
Photo: HCD-BX20i
– Continued on next page –
• The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc.
and any use of such marks by Sony Corporation is under license. Other
trademarks and trade names are those of their respective owners.
trademarks and trade names are those of their respective owners.
• MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
• iPod is a trademark of Apple Inc., registered in the U.S. and other countries.
Mainunit
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
(The United States model only)
With 6 ohm loads, both channels driven, from 120 –
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
(The United States model only)
With 6 ohm loads, both channels driven, from 120 –
10,000Hz; rated 25 watts
per channel minimum RMS power, with no more than 10% total harmonic
distortion from 250 milliwatts to rated output.
distortion from 250 milliwatts to rated output.
DIN power output (rated):
18 + 18 W (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 25 + 25 W (6 ohms at 1 kHz,
10% THD)
18 + 18 W (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 25 + 25 W (6 ohms at 1 kHz,
10% THD)
Inputs
Inputs
Amplifier section (BX20i: US, Canadian, Australian and Singapore models)
Amplifier section (BX50BTi)
AUDIO IN (stereo mini jack): voltage 250 mV, impedance 47 kilohms
Outputs
Outputs
Bluetooth section (BX50BTi)
PHONES (stereo mini jack): accepts headphones of 8 ohms or more
SPEAKER: accepts impedance of 6 to 16 ohms
SPEAKER: accepts impedance of 6 to 16 ohms
CD player section
System: Compact disc and digital audio system
Laser Diode Properties
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6μW
* This output is the value measurement at a distance of 200mm from the
Laser Output*: Less than 44.6μW
* This output is the value measurement at a distance of 200mm from the
objective lens surface on the Optical Pick-up Block with 7mm aperture.
Frequency response: 20 Hz – 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Continuous RMS power output (reference): 25 + 25 watts (6 ohms at
1 kHz, 10% THD)
1 kHz, 10% THD)
AUDIO IN (stereo mini jack): voltage250mV, impedance 47 kilohms
PHONES (stereo mini jack): accepts headphones of 8 ohms or more
SPEAKER: accepts impedance of 6 ohms
SPEAKER: accepts impedance of 6 ohms
Communication system: Bluetooth Standard version 2.0
Output: Bluetooth Standard Power Class 2
Output: Bluetooth Standard Power Class 2
Maximum communication range: Line of sight approx. 10 m
1)
Frequency band: 2.4 GHz band (2.4000 GHz – 2.4835GHz)
Modulation method: FHSS
Compatible Bluetooth profiles
2)
:
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
1)
The actual range will vary depending on factors such as obstacles
between devices, magnetic filds around a microwave oven, static
electricity, reception sensitivity, antenna’s performance, operating
system, software application, etc.
between devices, magnetic filds around a microwave oven, static
electricity, reception sensitivity, antenna’s performance, operating
system, software application, etc.
2)
Bluetooth standard profiles indicate the purpose of Bluetooth
communication between devices.
communication between devices.
Supported codecs:
Receive: SBC (Sub Band Codec), MP3
Transmit: SBC (Sub Band Codec)
Transmit: SBC (Sub Band Codec)
Amplifier section (BX20i: AEP model)
DIN power output (rated):
18 + 18 W (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 25 + 25 W (6 ohms at 1 kHz,
10% THD)
Music power output (reference): 38 + 38 W (6 ohms at 1 kHz, 10% THD)
18 + 18 W (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference): 25 + 25 W (6 ohms at 1 kHz,
10% THD)
Music power output (reference): 38 + 38 W (6 ohms at 1 kHz, 10% THD)
Inputs
AUDIO IN (stereo mini jack): voltage 250 mV, impedance 47 kilohms
Outputs
PHONES (stereo mini jack): accepts headphones of 8 ohms or more
SPEAKER: accepts impedance of 6 to 16 ohms
SPEAKER: accepts impedance of 6 to 16 ohms
HCD-BX20i/BX50BTi
2
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
Flexible Circuit Board Repairing
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
This appliance is classifi ed as a
CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
Ver. 1.4
iPod section
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FM tuner section:
FM tuner section:
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Tuning range: 531 1,602 kHz (with 9 kHz tuning interval)
HCD-BX20i/BX50BTi
3
1.
SERVICING NOTES
............................................. 4
2. GENERAL
.................................................................. 6
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 10
3-2. Panel (Side L/R) .............................................................. 11
3-3. Top Panel Block .............................................................. 11
3-4. TOP KEY Board, IP Board, Panel Top (IP) .................... 12
3-5. Front Panel Block ........................................................... 12
3-6. Rear Panel Block ............................................................ 13
3-7. Panel
3-3. Top Panel Block .............................................................. 11
3-4. TOP KEY Board, IP Board, Panel Top (IP) .................... 12
3-5. Front Panel Block ........................................................... 12
3-6. Rear Panel Block ............................................................ 13
3-7. Panel
(Rear)
.................................................................... 13
3-8. AMP Board Block ........................................................... 14
3-9. POWER Board Block ..................................................... 14
3-10. MAIN Board ................................................................... 15
3-11. Loading Mechanism Block ............................................. 15
3-12. Base Unit ......................................................................... 16
3-13. Belt .................................................................................. 16
3-14. OP Base Assy (KSM-213D) ........................................... 17
3-9. POWER Board Block ..................................................... 14
3-10. MAIN Board ................................................................... 15
3-11. Loading Mechanism Block ............................................. 15
3-12. Base Unit ......................................................................... 16
3-13. Belt .................................................................................. 16
3-14. OP Base Assy (KSM-213D) ........................................... 17
4.
TEST MODE
............................................................ 18
5.
ELECTRICAL CHECKS
...................................... 20
6. DIAGRAMS
6-1. Block Diagram - CD SERVO Section - .......................... 21
6-2. Block
6-2. Block
Diagram
- iPod, TUNER, BLUETOOTH Section - ...................... 22
6-3. Block Diagram - MAIN Section - ................................... 23
6-4. Block
6-4. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 24
6-5. Printed Wiring Boards - CD Section - ............................ 26
6-6. Schematic Diagram - CD Board - ................................... 27
6-7. Printed
6-6. Schematic Diagram - CD Board - ................................... 27
6-7. Printed
Wiring
Boards
- BLUETOOTH Section (BX50BTi) - ............................ 28
6-8. Schematic
Diagram
- BLUETOOTH Section (BX50BTi) - ............................ 29
6-9. Printed Wiring Board - IP Board - .................................. 30
6-10. Schematic Diagram - IP Board - ..................................... 31
6-11. Printed Wiring Boards - MAIN Section - ....................... 32
6-12. Schematic Diagram - MAIN Section (1/3) - ................... 33
6-13. Schematic Diagram - MAIN Section (2/3) - ................... 34
6-14. Schematic Diagram - MAIN Section (3/3) - ................... 35
6-15. Printed Wiring Boards
6-10. Schematic Diagram - IP Board - ..................................... 31
6-11. Printed Wiring Boards - MAIN Section - ....................... 32
6-12. Schematic Diagram - MAIN Section (1/3) - ................... 33
6-13. Schematic Diagram - MAIN Section (2/3) - ................... 34
6-14. Schematic Diagram - MAIN Section (3/3) - ................... 35
6-15. Printed Wiring Boards
- HEADPHONE/AMP Section - ..................................... 36
6-16. Schematic Diagram - HEADPHONE/AMP Section - .... 37
6-17. Printed Wiring Boards - PANEL Section - ..................... 38
6-18. Schematic Diagram - PANEL Section - .......................... 39
6-19. Printed Wiring Board - POWER Board - ........................ 40
6-20. Schematic Diagram - POWER Board - .......................... 41
6-17. Printed Wiring Boards - PANEL Section - ..................... 38
6-18. Schematic Diagram - PANEL Section - .......................... 39
6-19. Printed Wiring Board - POWER Board - ........................ 40
6-20. Schematic Diagram - POWER Board - .......................... 41
7.
EXPLODED VIEWS
7-1. Panel
Section
................................................................... 50
7-2. Top Panel Section ........................................................... 51
7-3. Front Panel Section ......................................................... 52
7-4. MAIN Board Section ...................................................... 53
7-5. POWER Board Section ................................................... 54
7-6. Loading Mechanism Section .......................................... 55
7-7. Base Unit Section (BU-K6BD90-WOD) ....................... 56
7-3. Front Panel Section ......................................................... 52
7-4. MAIN Board Section ...................................................... 53
7-5. POWER Board Section ................................................... 54
7-6. Loading Mechanism Section .......................................... 55
7-7. Base Unit Section (BU-K6BD90-WOD) ....................... 56
8.
ELECTRICAL PARTS LIST
.............................. 57
TABLE OF CONTENTS
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
HCD-BX20i/BX50BTi
4
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SECTION 1
SERVICING NOTES
ANTITHEFT UNLOCK MODE
Procedure:
1. Press the [
Procedure:
1. Press the [
?/1
] button to turn the power on.
2. Press the [FUNCTION] button to select “CD”.
3. Press two buttons of [
3. Press two buttons of [
x/
CANCEL] and [
A
] for 5 seconds.
4. The message “UNLOCKED” is displayed on the fl uorescent
indicator tube and the disc tray is unlocked.
Note: When “LOCKED” is displayed, the tray lock is not released by
turning power on/off with the [
?/1] button.
NOTE OF REPLACING THE IC904 ON THE BT BOARD
IC904 on the BT board cannot exchange with single. When IC904
on the BT board is damaged, exchange the entire mounted board.
IC904 on the BT board cannot exchange with single. When IC904
on the BT board is damaged, exchange the entire mounted board.
Model
Part No.
HCD-BX20i: US model
3-293-462-0
[]
HCD-BX20i: Canadian model
3-293-463-0
[]
HCD-BX50BTi: US model
3-293-464-0
[]
HCD-BX50BTi: Canadian model
3-293-465-0
[]
HCD-BX20i: Australian model
3-295-838-0
[]
HCD-BX20i: Singapore model
3-296-979-0
[]
HCD-BX20i: AEP model
4-154-084-0
[]
MODEL IDENTIFICATION
Part No.
– Rear View – (Except Singapore model)
Ver. 1.4
– Bottom View – (Singapore model)
Part No.