Sony HBD-E770W Service Manual ▷ View online
HBD-E770W
8
NOTE THE BD DRIVE (BPX-5) PARTS REPLACING
The mechanism blocks except optical device of BD drive (BPX-5)
are chiefl y composed of the following parts.
•
The mechanism blocks except optical device of BD drive (BPX-5)
are chiefl y composed of the following parts.
•
CHUCK HOLDER ASSY
•
LOADING ASSY
•
HOLDER, FFC (REAR)
These parts are produced by two venders, it is not compatible.
Therefore, CHUCK HOLDER ASSY and LOADING ASSY are
supplied by one pair as repair parts. Please exchange both CHUCK
HOLDER ASSY and LOADING ASSY at the same time.
Therefore, CHUCK HOLDER ASSY and LOADING ASSY are
supplied by one pair as repair parts. Please exchange both CHUCK
HOLDER ASSY and LOADING ASSY at the same time.
HOLDER FFC (REAR) need not be exchanged at the same time.
Note: The laser caution label is not pasted to LOADING FOR SERVICE
(Part No. A-1750-926-A). Please peel off an original laser caution
label, and paste it to LOADING FOR SERVICE when you use
LOADING FOR SERVICE.
label, and paste it to LOADING FOR SERVICE when you use
LOADING FOR SERVICE.
LASER CAUTION LABEL
CHUCK HOLDER ASSY
LOADING ASSY
LOADING FOR SERVICE
HOLDER, FFC (REAR)
NOTE OF REPLACING THE THE IC3100 AND IC3200
ON THE MAIN BOARD AND THE COMPLETE MAIN
BOARD
When IC3100 and IC3200 on the MAIN board and the complete
MAIN board are replaced, it is necessary to spread the compound
(THERMAL COMPOUND (G747)) (Part No. J-2501-221-A ) be-
tween parts and heat sink.
Spread the compound referring to the fi gure below.
ON THE MAIN BOARD AND THE COMPLETE MAIN
BOARD
When IC3100 and IC3200 on the MAIN board and the complete
MAIN board are replaced, it is necessary to spread the compound
(THERMAL COMPOUND (G747)) (Part No. J-2501-221-A ) be-
tween parts and heat sink.
Spread the compound referring to the fi gure below.
– MAIN Board (Component Side) –
IC3200
IC3100
IC3100
IC3200
NOTE OF REPLACING THE CASE
“3D logo mark” is added from the midway production to the case.
Please exchange cases after confi rming the presence of “3D logo mark”.
“3D logo mark” is added from the midway production to the case.
Please exchange cases after confi rming the presence of “3D logo mark”.
Former: There is no 3D logo mark.
New:
New:
There is 3D logo mark.
Ver. 1.1
HBD-E770W
9
NOTE OF REPLACING THE D913, D931, IC901 AND IC921 ON THE POWER BOARD AND THE COMPLETE
POWER BOARD
When D913, D931, IC901 and IC921 on the POWER board and the complete POWER board are replaced, it is necessary to spread the
compound (THERMAL COMPOUND (G747)) (Part No. J-2501-221-A) between parts and heat sink.
Spread the compound referring to the fi gure below.
POWER BOARD
When D913, D931, IC901 and IC921 on the POWER board and the complete POWER board are replaced, it is necessary to spread the
compound (THERMAL COMPOUND (G747)) (Part No. J-2501-221-A) between parts and heat sink.
Spread the compound referring to the fi gure below.
– POWER Board
(Component Side) –
(Component Side) –
IC901
HS901
HS931
HS921
IC921
D913
D931
IC901
D913
IC921
D931
HBD-E770W
10
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
Note 1: After the case is removed, this work is done.
Note 2: Please prepare the thin wire (clip etc.).
Note 2: Please prepare the thin wire (clip etc.).
1
Remove the case.
(Illustration of disassembly is omitted.)
3
tray
2
clip etc.
PROCESSING OF HARNESS (USB)
– Top view –
HBD-E770W
11
SECTION 2
DISASSEMBLY
•
This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
Note: Follow the disassembly procedure in the numerical order given.
2-2. CASE (EZ)
SET
2-3. MB-134 BOARD
(Page 12)
2-4. BRACKET (MB) BLOCK
(Page 13)
2-9. BACK PANEL BLOCK
(Page 15)
2-5. FUSE (F901),
POWER BOARD
(Page 13)
2-2. CASE (EZ)
(Page 11)
2-6. FRONT PANEL BLOCK
(Page 14)
2-10. MAIN BOARD
(Page 16)
2-11. AUDIO BOARD
(Page 16)
2-8. INCLUDE BOARD
(Page 15)
2-7. BD DRIVE (BPX-5)
(Page 14)
2-12. OPTICAL DEVICE
(KEM-460AAA),
(KEM-460AAA),
WIRE (FLAT TYPE)
(Page 17)
1
four screws
(BV3)
6
case (EZ)
5
seven hooks
3
3
4
2
five screws
(BV/RING)
–
Bottom view
–
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