Sony HBD-E770W Service Manual ▷ View online
HBD-E770W
6
2. Pass-fail judgment of the optical device (KEM-460AAA)
Perform pass-fail judgment to judge whether the repair of the optical device (KEM-460AAA) is necessary.
Perform pass-fail judgment to judge whether the repair of the optical device (KEM-460AAA) is necessary.
2-1. Flow of drive section check
NO
NO
Confirm whether
BD (BLX-104) can be
reproduced
Confirm whether
DVD (HLX-513)/
CD (HLX-A1) can be
reproduced
Confirm whether the
drive voltage is the
following values
CN301 pin
2 : 12 V
CN301 pin
6 : 5 V
Confirm OP FFC cable
(Part No. 1-837-494-11)
and SPDL FFC cable
(Part No. 1-837-495-11),
and replace it when it
has been damaged
Then, confirm whether
this set operates
normally
Confirm PS301 to
PS304 on the MB-134
board, and replace it
when it has been
damaged
Confirm whether the
optical device IOP
is normal in the
service mode
(Refer to “2-2. Flow
of optical device
IOP check”)
Repalece the
optical device
(KEM-460AAA)
(Refer to “3. Optical
device (KEM-460AAA)
replacement”)
NO
YES
OK
YES
YES
NO
NO
Note: Refer to “2-12. OPTICAL DEVICE (KEM-460AAA), WIRE (FLAT TYPE)” (page 17) about how to remove the FFC HOLDER (REAR).
2-2. Flow of optical device IOP check
YES
NO
Turn the power on,
and change function
to “BD/DVD”
Press the buttons on
the remote commander
in order of [RETURN],
[0], [2], [1] [SUBTITLE],
and enter the service
mode
Press the buttons on
the remote commander
in order of [8], [7], [3],
[ENTER], and the
dIOP value is displayed
OK
Confirm whether
value is the
specification value
Specification value:
BD : 6 mA
DVD/CD: 9 mA
Repalece the
optical device
(Refer to “3. Optical
device (KEM-460AA)
replacement”)
HBD-E770W
7
3. Optical device (KEM-460AAA) replacement
Flow of replacement:
Flow of replacement:
Note: The photo in fl ow is an image.
Barcode label on
new optical device
(KEM-460AAA)
bottom side
new optical device
(KEM-460AAA)
bottom side
Take photo (JPEG)
by digital camera
by digital camera
Save the text data
to USB memory
(memory capacity
need not be 8GB)
to USB memory
(memory capacity
need not be 8GB)
Connect USB memory
with rear USB connector
on this set, and read the
text data by the service mode
with rear USB connector
on this set, and read the
text data by the service mode
Change photo into
the text data with
the barcode decoder
the text data with
the barcode decoder
Procedure:
1. Remove the INSULATOR (4 pieces) and broken optical de-
1. Remove the INSULATOR (4 pieces) and broken optical de-
vice (KEM-460AAA) from LOADING ASSY.
2. Take photo of the barcode on new optical device (KEM-
460AAA) bottom side by digital camera.
3. Assemble the INSULATOR (4 pieces) to new optical device
(KEM-460AAA), fi x (Torque value: 2 kgf) it to LOADING
ASSY with screw, and assemble this set.
ASSY with screw, and assemble this set.
4. Drag & drop the taken photo by step 2 to “BDBUDec.exe”,
and make the text data (File name: BuData.txt).
5. Save the text data to USB memory.
6. Connect USB memory with rear USB connector on this set,
6. Connect USB memory with rear USB connector on this set,
and turn the power on.
Rear USB connector
7. Press the [FUNCTION] button to select “BD/DVD”.
8. Press the buttons on the remote commander in order of
8. Press the buttons on the remote commander in order of
[RETURN], [0], [2], [1], [SUBTITLE], and enter the service
mode.
mode.
9. Press the buttons on the remote commander in order of [8], [1],
[ENTER], and execute “[1] Drive OP data Write”.
10. Turn the power off after writing the OP data.
11. Turn the power on, and enter the service mode again.
12. Press the buttons on the remote commander in order of [8], [7],
11. Turn the power on, and enter the service mode again.
12. Press the buttons on the remote commander in order of [8], [7],
[3], [ENTER], and the dIOP value is displayed.
13. Confi rm value is the following specifi cation value, and turn the
power off.
Specifi cation value:
BD
: 6 mA
DVD/CD : 9 mA
14. Turn the power on, confi rm playback performance of the BD
(BLX-104)/DVD (HLX-513)/CD (HLX-A1).
15. Completely assemble this set, and complete the repair.
HBD-E770W
8
NOTE THE BD DRIVE (BPX-5) PARTS REPLACING
The mechanism blocks except optical device of BD drive (BPX-5)
are chiefl y composed of the following parts.
•
The mechanism blocks except optical device of BD drive (BPX-5)
are chiefl y composed of the following parts.
•
CHUCK HOLDER ASSY
•
LOADING ASSY
•
HOLDER, FFC (REAR)
These parts are produced by two venders, it is not compatible.
Therefore, CHUCK HOLDER ASSY and LOADING ASSY are
supplied by one pair as repair parts. Please exchange both CHUCK
HOLDER ASSY and LOADING ASSY at the same time.
Therefore, CHUCK HOLDER ASSY and LOADING ASSY are
supplied by one pair as repair parts. Please exchange both CHUCK
HOLDER ASSY and LOADING ASSY at the same time.
HOLDER FFC (REAR) need not be exchanged at the same time.
Note: The laser caution label is not pasted to LOADING FOR SERVICE
(Part No. A-1750-926-A). Please peel off an original laser caution
label, and paste it to LOADING FOR SERVICE when you use
LOADING FOR SERVICE.
label, and paste it to LOADING FOR SERVICE when you use
LOADING FOR SERVICE.
LASER CAUTION LABEL
CHUCK HOLDER ASSY
LOADING ASSY
LOADING FOR SERVICE
HOLDER, FFC (REAR)
NOTE OF REPLACING THE THE IC3100 AND IC3200
ON THE MAIN BOARD AND THE COMPLETE MAIN
BOARD
When IC3100 and IC3200 on the MAIN board and the complete
MAIN board are replaced, it is necessary to spread the compound
(THERMAL COMPOUND (G747)) (Part No. J-2501-221-A ) be-
tween parts and heat sink.
Spread the compound referring to the fi gure below.
ON THE MAIN BOARD AND THE COMPLETE MAIN
BOARD
When IC3100 and IC3200 on the MAIN board and the complete
MAIN board are replaced, it is necessary to spread the compound
(THERMAL COMPOUND (G747)) (Part No. J-2501-221-A ) be-
tween parts and heat sink.
Spread the compound referring to the fi gure below.
– MAIN Board (Component Side) –
IC3200
IC3100
IC3100
IC3200
NOTE OF REPLACING THE CASE
“3D logo mark” is added from the midway production to the case.
Please exchange cases after confi rming the presence of “3D logo mark”.
“3D logo mark” is added from the midway production to the case.
Please exchange cases after confi rming the presence of “3D logo mark”.
Former: There is no 3D logo mark.
New:
New:
There is 3D logo mark.
Ver. 1.1
HBD-E770W
9
NOTE OF REPLACING THE D913, D931, IC901 AND IC921 ON THE POWER BOARD AND THE COMPLETE
POWER BOARD
When D913, D931, IC901 and IC921 on the POWER board and the complete POWER board are replaced, it is necessary to spread the
compound (THERMAL COMPOUND (G747)) (Part No. J-2501-221-A) between parts and heat sink.
Spread the compound referring to the fi gure below.
POWER BOARD
When D913, D931, IC901 and IC921 on the POWER board and the complete POWER board are replaced, it is necessary to spread the
compound (THERMAL COMPOUND (G747)) (Part No. J-2501-221-A) between parts and heat sink.
Spread the compound referring to the fi gure below.
– POWER Board
(Component Side) –
(Component Side) –
IC901
HS901
HS931
HS921
IC921
D913
D931
IC901
D913
IC921
D931
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